JPH1093271A - Heat-dissipating and fixing methods of power device package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent increase in the number of component parts and the complexities of assembling, and to accomplish lessening of assembling expenses related to the heat-dissipation and fixing of a power device package. SOLUTION: Power device packages 13a to 13d of an electric machine are fixed to a heat-radiating plate 11, and heat is radiated. In the heat radiation and the fixing method of the power device package, a package holder 12 and a heat-radiating plate 11 are integrally formed, a fixing spring 14 is incorporated into the package holder 12, together with the power device packages 13a to 13d, and the power device packages 13a to 13d are pressed to the side of the heat-radiating plate 11 in the package holder 12, using a fixing plate spring 14.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for radiating and fixing a power device package in a semi-sealed or sealed electric device.

[0002]

2. Description of the Related Art FIG. 5 is a perspective view showing a conventional example of a method for radiating and fixing a power device package of this kind. As shown in FIG. 1, conventionally, first, the power device packages 1a to 1d are fixed to the heat sink 2 using the fixing plate 3 and the screws 4a and 4b to form an assembly.

[0003] Next, this assembly is screwed to the substrate 5.
a, 6b, and electrically connected by flow soldering to form a board assembly. The board assembly is fixed to the base 8 by screws 7a to 7d.
Is fixed to the base 8 with the screws 9e and 9f.
The cover 10 was attached to the base 8 by a to 9d.

[0004]

However, according to the prior art having the above structure, the power device package is fixed to the radiator plate using the fixing plate and the screws. Required and complicated to assemble. In addition, a relief for a screw for fixing the power device package to the fixing plate must be made somewhere.

[0005] From the above, there has been a problem that the processing cost of the member increases, the number of parts increases, and the assembly cost increases. In view of the above problems, the present invention provides a method of fixing a power device package to a heat sink with one touch without using screws, preventing an increase in the number of parts and a complicated assembly, and An object of the present invention is to realize a reduction in assembly costs related to heat radiation and fixing.

[0006]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention uses a tension of a sandwiched leaf spring to fix a power device package. That is, the present invention relates to a heat dissipation and fixing method for a power device package in which a power device package of an electric device is fixed to a heat radiating plate to radiate heat. In addition, a fixing leaf spring is incorporated, and the power device package is pressed against the heat sink side in the package holder by the fixing leaf spring.

At this time, it is preferable that a locking portion is formed on a part of the fixing leaf spring, and when the fixing leaf spring is incorporated into the package holder, the locking portion is hooked on a projection provided on the package holder. Further, it is preferable to form the fixing leaf spring into an S-shaped cross section. Further, it is preferable that the resin of the package holder be formed around the contact surface between the heat sink and the power device package.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an exploded perspective view showing an embodiment of the present invention, FIG. 2 is a perspective view showing an assembled state of the embodiment, and FIG. 3 is a sectional view of the same. In the figure, reference numeral 11 denotes a radiator plate, 12 denotes a package holder made of resin, and the radiator plate 11 and the package holder 12 are integrally formed. The material of the heat sink 12 is a metal having a large thermal conductivity,
For example, aluminum or a copper alloy is used.

Reference numerals 13a to 13d denote power device packages, and 14 denotes the power device packages 13a to 13d.
And a fixing leaf spring accommodated in the package holder 12. The fixing leaf spring 14 has a cross section S as shown in FIG.
It is formed in the shape of a letter,
a is formed. On the other hand, package holder 1
2 is provided with a projection 12a for hooking the locking portion 14a.

The assembling procedure of the present embodiment is as follows. First, the fixing leaf spring 14 is incorporated in the package holder 12. At this time, the locking portion 14a of the fixing leaf spring 14 is inserted to a position where the locking portion 14a covers the projection 12a of the package holder 12. Next, the power device packages 13a to 13a
13d is incorporated in the package holder 12. At this time, the power device packages 13 a to 13 d are pressed against the package holder 12 by the fixing leaf springs 14.
In addition, the play between the fixing leaf spring 14 and the package holder 12 is eliminated, and the locking portion 14a of the fixing leaf spring 14 is hooked on the projection 12a of the package holder 12 to prevent the fixing.

FIG. 4 is a perspective view showing an installed state of the present embodiment. As shown in the figure, the assembly assembled as described above is fixed to the substrate 15 with screws 16a and 16b and subjected to flow soldering to obtain a substrate assembly.
Then, the board assembly is fixed to the base 18 with screws 17a to 17d.
a. Fix to the base 18 with 19b. Then, the cover 21 is attached with the screws 20a to 20d as in the related art.

When the package holder 12 and the heat radiating plate 11 are integrally formed, if the resin is thinly wrapped around the contact surface between the heat radiating plate 11 and the power device packages 13a to 13d, the thermal resistance does not increase so much. , Electrical insulation can be performed. Power device package 13
If a to 13d are full-mold packages, the heat resistance by the package holder can be eliminated by molding so that the contact surface with the heat sink 11 is exposed.

The sectional shape of the fixing leaf spring 14 is shown in FIG.
The power device packages 13a to 13d can be evenly pressed against the package holder 12 or the heat radiating plate 11 by forming in an S-shape as shown in FIG. As described above, according to the present embodiment, by using the package holder 12, the power device package can be held at a predetermined position on the heat sink 11 without using an assembly jig. Also, since the package holder 12 and the radiator plate 11 are integrally formed, when electrical insulation between the power device packages is desired, the radiator plate 11 is required.
Insulation can be achieved by molding the resin around the contact surface between the power device packages 13a to 13d and
Further, if the thickness of the molding is controlled, the thermal resistance can be reduced.

Further, the fixing leaf spring 14 is mounted on the package holder 1 together with the power device packages 13a to 13d.
By assembling in 2, the operation of assembling using screws becomes unnecessary. Further, the locking portion 14a is formed on the fixing leaf spring 14, the projection 12a is provided on the package holder 12, and the two are hooked so that the power is maintained as long as the pressing force by the fixing leaf spring 14 is not lost. The device packages 13a to 13d can be prevented from falling out of the package holder 12 together with the fixing leaf springs 14.

Further, by forming the fixing leaf spring 14 so as to have an S-shaped cross-sectional shape, the power device packages 13a to 13d can be uniformly pressed against the package holder 12 or the heat radiating plate 11. it can. Note that, in the present embodiment, an example has been described in which a semi-closed or sealed electric device is applied to a heat radiation form in which a housing is also used for heat radiation. Thus, heat radiation in an independent form can be performed without relying on heat radiation to the housing.

[0016]

As described above in detail, according to the present invention, in a method of dissipating and fixing a power device package of an electric device to a heat dissipating plate for fixing the power device package to a heat dissipating plate, a package holder and a heat dissipating plate are provided. The power device package is assembled together with the power device package in the package holder, and the power device package is pressed against the heat radiating plate in the package holder by the fixing leaf spring, so that the tension of the sandwiched leaf spring is used. Thus, the power device package can be fixed.

This makes it possible to fix the power device package to the heat radiating plate with one touch without using screws, to prevent an increase in the number of components and to prevent complication of assembly, and to improve heat radiation and fixing of the power device package. This has the effect of reducing assembly costs. At this time,
Forming the locking portion on a part of the fixing leaf spring, and when the fixing leaf spring is incorporated in the package holder, when the locking portion is hooked on a projection provided on the package holder,
Since it is possible to prevent the fixing leaf spring and the power device package from falling off, there is an effect that stable fixing can be obtained.

Further, when the fixing leaf spring is formed into an S-shaped cross section, the power device package can be pressed evenly, and there is an effect that more stable fixing can be obtained. Further, when the resin of the package holder is formed so as to extend around the contact surface between the heat sink and the power device package, electrical insulation between the power device packages can be obtained, and the operation reliability can be improved.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an embodiment of the present invention.

FIG. 2 is a perspective view showing an assembled state of the embodiment of the present invention.

FIG. 3 is a cross-sectional view showing one embodiment of the present invention.

FIG. 4 is a perspective view showing an installation state of the embodiment of the present invention.

FIG. 5 is a perspective view showing a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Heat sink 12 Package holder 12a Projection 13a-13d Power device package 14 Fixed leaf spring 14a Locking part

Claims (4)

[Claims] 1. A heat dissipating and fixing method for a power device package in which a power device package of an electric device is fixed to a heat radiating plate to radiate heat. A heat dissipating and fixing method for a power device package, wherein a fixing leaf spring is incorporated, and the power device package is pressed against a heat radiating plate in a package holder by the fixing leaf spring. 2. A locking portion is formed on a part of a fixing leaf spring, and when the fixing leaf spring is incorporated into a package holder, the locking portion is hooked on a projection provided on the package holder. The method for radiating and fixing a power device package according to claim 1. 3. The heat dissipating and fixing method for a power device package according to claim 1, wherein the fixing leaf spring is formed into an S-shaped cross section. 4. The heat dissipation and fixing method for a power device package according to claim 1, wherein the resin of the package holder is formed so as to extend around a contact surface between the heat sink and the power device package.