JPH11186472A - Heat radiating structure for in-module heat generating element - Google Patents
Heat radiating structure for in-module heat generating elementInfo
- Publication number
- JPH11186472A JPH11186472A JP36399597A JP36399597A JPH11186472A JP H11186472 A JPH11186472 A JP H11186472A JP 36399597 A JP36399597 A JP 36399597A JP 36399597 A JP36399597 A JP 36399597A JP H11186472 A JPH11186472 A JP H11186472A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- module
- generating element
- leaf spring
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、モジュール内発熱
素子の放熱構造に関し、特に、モジュール内のプリント
基板上に装着されたＩＣ素子等の発熱素子からの放熱を
効率良く行うための放熱構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipating structure for a heat generating element in a module, and more particularly to a heat dissipating structure for efficiently dissipating heat from a heat generating element such as an IC element mounted on a printed circuit board in a module. .
【０００２】[0002]
【従来の技術】従来、モジュール内のプリント基板上に
装着されたＩＣ素子等の発熱素子からの放熱を効率良く
行うため種々の構成が採用されている。例えば、実開平
４−４６５５６号公報に記載の技術では、図２に示すよ
うに、ＩＣ素子１、電気部品１０等が実装されたプリン
ト基板２がケース４にネジ３で固定され、カバー１１に
板バネ１７をネジ８で固定し、カバー１１がネジ５によ
ってケース４に固定されている。そして、板バネ１７を
ＩＣ素子１の表面に押しつけ、ＩＣ素子１において発生
した熱を板バネ１７と、カバー１１を介して大気中に放
熱していた。2. Description of the Related Art Conventionally, various configurations have been adopted to efficiently radiate heat from a heating element such as an IC element mounted on a printed circuit board in a module. For example, in the technique described in Japanese Utility Model Laid-Open No. 4-46556, a printed circuit board 2 on which an IC element 1, an electric component 10 and the like are mounted is fixed to a case 4 with screws 3 as shown in FIG. The leaf spring 17 is fixed by screws 8, and the cover 11 is fixed to the case 4 by screws 5. Then, the leaf spring 17 is pressed against the surface of the IC element 1, and the heat generated in the IC element 1 is radiated to the atmosphere via the leaf spring 17 and the cover 11.
【０００３】上記板バネ１７は、平坦部１７ａから上方
に延設された対称的な一対の湾曲部１７ｂと、湾曲部１
７ｂの先端から平坦部１７ａに対して略々平行、かつ互
いに離れる方向に延設された取付部１７ｃとで構成され
る。また、板バネ１７は、バネ性及び強度を考慮してス
テンレス鋼等によって形成される。The leaf spring 17 includes a pair of symmetrical curved portions 17b extending upward from a flat portion 17a, and a pair of curved portions 1b.
The mounting portion 17c is substantially parallel to the flat portion 17a from the tip end of the mounting portion 7b and extends in a direction away from each other. The leaf spring 17 is made of stainless steel or the like in consideration of the spring property and strength.
【０００４】板バネ１７の取付の際には、平坦部１７ａ
をＩＣ素子１の表面に接触させ、取付部１７ｃをネジ８
を介してカバー１１に取り付ける。When attaching the leaf spring 17, a flat portion 17a
Is brought into contact with the surface of the IC element 1, and the mounting portion 17c is
Is attached to the cover 11 via the.
【０００５】また、板バネ１７の平坦部１７ａに対して
は、常時、一対の湾曲部１７ｂによってバネ力が加えら
れ、これによって平坦部１７ａが常に確実にＩＣ素子１
の表面と面接触を保ち、ＩＣ素子１において発生する熱
を平坦部１７ａから、湾曲部１７ｂ、取付部１７ｃ、カ
バー１１を介して外部に放熱している。Further, a spring force is always applied to the flat portion 17a of the leaf spring 17 by a pair of curved portions 17b, so that the flat portion 17a is always surely secured.
And the heat generated in the IC element 1 is radiated from the flat portion 17a to the outside through the curved portion 17b, the mounting portion 17c, and the cover 11.
【０００６】[0006]
【発明が解決しようとする課題】しかし、上記従来のモ
ジュール内発熱素子の放熱構造においては、板バネ１７
及びカバー１１のみを介してＩＣ素子１において発生し
た熱が外部に放熱されるとともに、板バネ１７とカバー
１１との接触面積が狭く、さらに、板バネ１７とＩＣ素
子１とカバー１１との密着性が必ずしも良くないため、
ＩＣ素子１からの放熱性が満足するレベルにはないとい
う問題がある。However, in the above-described conventional heat dissipation structure of the heat generating element in the module, the plate spring 17 is used.
The heat generated in the IC element 1 is radiated to the outside only through the cover 11 and the contact area between the leaf spring 17 and the cover 11 is small. Because the nature is not always good,
There is a problem that the heat radiation from the IC element 1 is not at a satisfactory level.
【０００７】そこで、本発明は、上記問題点に鑑みてな
されたものであって、上記ＩＣ素子１等の発熱素子から
の放熱を効率良く行うことのできるモジュール内発熱素
子の放熱構造を提供することを目的とする。Accordingly, the present invention has been made in view of the above problems, and provides a heat radiating structure for a heat generating element in a module which can efficiently radiate heat from a heat generating element such as the IC element 1 or the like. The purpose is to:
【０００８】[0008]
【課題を解決するための手段】請求項１記載の発明は、
モジュール内の発熱素子からの放熱を、該発熱素子の表
面に接触する板バネを介して行う発熱素子の放熱構造に
おいて、前記板バネと接触するとともに、前記モジュー
ルのケースの一部としても機能するヒートシンクを介し
て、前記発熱素子からの放熱を行うことを特徴とする。According to the first aspect of the present invention,
In the heat-dissipating structure of the heat-generating element that dissipates heat from the heat-generating element in the module via a leaf spring that comes into contact with the surface of the heat-generating element, the heat dissipating element contacts the leaf spring and also functions as a part of the module case. It is characterized in that heat is radiated from the heating element via a heat sink.
【０００９】請求項２記載の発明は、前記板バネは、取
付部を兼ねた前記ヒートシンクへの第１接触部と、前記
発熱素子の放熱のみを目的とした前記ヒートシンクへの
第２接触部を有することを特徴とする。According to a second aspect of the present invention, the leaf spring has a first contact portion to the heat sink also serving as a mounting portion, and a second contact portion to the heat sink only for heat radiation of the heating element. It is characterized by having.
【００１０】請求項３記載の発明は、前記発熱素子と前
記板バネとの接触部、または前記板バネと前記ヒートシ
ンクとの接触部、あるいはこれらの両方の接触部にシリ
コングリスを塗布したことを特徴とする。According to a third aspect of the present invention, silicon grease is applied to a contact portion between the heating element and the leaf spring, a contact portion between the leaf spring and the heat sink, or both contact portions. Features.
【００１１】そして、請求項１記載の発明によれば、モ
ジュール内の発熱素子からの放熱を、該発熱素子の表面
に接触する板バネを介して行う発熱素子の放熱構造にお
いて、前記板バネと接触するとともに、前記モジュール
のケースの一部としても機能するヒートシンクを介し
て、前記発熱素子からの放熱を行うため、モジュール内
の発熱素子からの放熱効率を高くすることができる。According to the first aspect of the present invention, in the heat-dissipating structure of the heat-generating element, the heat is radiated from the heat-generating element in the module via the leaf spring contacting the surface of the heat-generating element. Since heat is radiated from the heat generating element through a heat sink that contacts and also functions as a part of the case of the module, the heat radiating efficiency from the heat generating element in the module can be increased.
【００１２】請求項２記載の発明によれば、前記板バネ
は、取付部を兼ねた前記ヒートシンクへの第１接触部
と、前記発熱素子の放熱のみを目的とした前記ヒートシ
ンクへの第２接触部を有するため、モジュール内の発熱
素子からの放熱効率がさらに上昇する。According to the second aspect of the present invention, the leaf spring has a first contact portion with the heat sink also serving as a mounting portion, and a second contact with the heat sink only for heat radiation of the heating element. The heat dissipation efficiency from the heating element in the module is further increased due to the presence of the portion.
【００１３】請求項３記載の発明によれば、前記発熱素
子と前記板バネとの接触部、または前記板バネと前記ヒ
ートシンクとの接触部、あるいはこれらの両方の接触部
にシリコングリスを塗布したため、各要素間の密着性が
向上するため、モジュール内の発熱素子からの放熱効率
がさらに上昇する。According to the third aspect of the present invention, since silicon grease is applied to the contact portion between the heating element and the leaf spring, the contact portion between the leaf spring and the heat sink, or both contact portions. In addition, since the adhesion between the elements is improved, the heat radiation efficiency from the heating elements in the module further increases.
【００１４】[0014]
【発明の実施の形態】次に、本発明にかかるモジュール
内発熱素子の放熱構造の実施の形態の具体例を図面を参
照しながら説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a specific example of an embodiment of a heat radiation structure of a heat generating element in a module according to the present invention will be described with reference to the drawings.
【００１５】図１は、本発明にかかるモジュール内発熱
素子の放熱構造の一実施例を示す概略断面図である。
尚、図１において、図２に示した従来のモジュール内発
熱素子の放熱構造と同一の構成要素については同一の参
照番号を付して詳細説明を省略する。FIG. 1 is a schematic sectional view showing one embodiment of a heat radiation structure of a heat generating element in a module according to the present invention.
In FIG. 1, the same components as those of the conventional heat dissipating structure of the heat generating element in the module shown in FIG. 2 are denoted by the same reference numerals, and detailed description thereof will be omitted.
【００１６】本発明にかかるモジュール内発熱素子の放
熱構造では、ＩＣ素子１と電気部品１０が実装されたプ
リント基板２をケース４にネジ３で固定し、ヒートシン
ク６に板バネ７をネジ８で固定し、さらに、ヒートシン
ク６がケース４にネジ５で固定される。尚、ＩＣ素子１
と板バネ７との接触部、及び板バネ７とヒートシンク６
との接触部にはシリコングリス９が塗布されている。In the heat dissipation structure of the heat generating element in the module according to the present invention, the printed circuit board 2 on which the IC element 1 and the electric component 10 are mounted is fixed to the case 4 with screws 3, and the plate spring 7 is fixed to the heat sink 6 with screws 8. Then, the heat sink 6 is fixed to the case 4 with screws 5. In addition, IC element 1
Contact portion between the plate spring 7 and the plate spring 7 and the heat sink 6
Silicon grease 9 is applied to the contact portion with the grease.
【００１７】そして、ヒートシンク６に固定された板バ
ネ７をＩＣ素子１の表面に押しつけることにより、ＩＣ
素子１で発生した熱を板バネ７とヒートシンク６を介し
て大気中に放熱する。尚、シリコングリス９を塗布した
のは、ＩＣ素子１と板バネ７との間、及びヒートシンク
６と板バネ７との間の密着性を増加させ、放熱効率を向
上させるためである。Then, the leaf spring 7 fixed to the heat sink 6 is pressed against the surface of the IC element 1 so that the IC
The heat generated by the element 1 is radiated to the atmosphere via the leaf spring 7 and the heat sink 6. The reason why the silicon grease 9 is applied is to increase the adhesion between the IC element 1 and the leaf spring 7 and between the heat sink 6 and the leaf spring 7 to improve the heat radiation efficiency.
【００１８】上記板バネ７は、ＩＣ素子１の表面との接
触部７ａから斜め上方に延設された対称的な一対の中間
部７ｂと、中間部７ｂの先端から接触部７ａに対して略
々平行、かつ互いに離れる方向に延設された取付部７ｃ
と、前記接触部７ａの上面からヒートシンク６に向かっ
て鉛直方向に延設された放熱部７ｄとで構成される。ま
た、板バネ７は、バネ性及び強度を考慮して、従来例と
同様に、ステンレス鋼等によって形成される。The leaf spring 7 has a pair of symmetrical intermediate portions 7b extending diagonally upward from the contact portion 7a with the surface of the IC element 1, and a substantially symmetrical portion from the tip of the intermediate portion 7b to the contact portion 7a. Attachments 7c extending in parallel and away from each other
And a heat radiating portion 7d vertically extending from the upper surface of the contact portion 7a toward the heat sink 6. Further, the leaf spring 7 is formed of stainless steel or the like in the same manner as the conventional example in consideration of the spring property and strength.
【００１９】上記構成を有する板バネ７は、ヒートシン
ク６との取付部７ｃ及び放熱のみを目的とした放熱部７
ｄにおいてヒートシンク６と接触し、取付部７ｃ及び放
熱部７ｄとヒートシンク６の内面６ａとの間には、前述
のように、これらの間の密着性を良くするためシリコン
グリス９が塗布されている。The leaf spring 7 having the above-described structure includes a mounting portion 7c for attaching to the heat sink 6 and a heat radiating portion 7 for heat radiation only.
As described above, the silicon grease 9 is applied between the mounting portion 7c and the heat radiating portion 7d and the inner surface 6a of the heat sink 6 to improve the adhesion therebetween as described above. .
【００２０】板バネ７のモジュール内への取付の際に
は、板バネ７の接触部７ａをシリコングリス９を介して
ＩＣ素子１の表面に接触させ、取付部７ｃをシリコング
リス９を介してネジ８によってヒートシンク６に取り付
ける。この際、上述のように、板バネ７の放熱部７ｄも
シリコングリス９を介してヒートシンク６と接触する。When the leaf spring 7 is mounted in the module, the contact portion 7a of the leaf spring 7 is brought into contact with the surface of the IC element 1 through the silicon grease 9, and the mounting portion 7c is moved through the silicon grease 9. It is attached to the heat sink 6 by screws 8. At this time, as described above, the heat radiating portion 7 d of the leaf spring 7 also comes into contact with the heat sink 6 via the silicon grease 9.
【００２１】また、板バネ７の接触部７ａに対しては、
常時一対の中間部７ｂ及び放熱部７ｄによってバネ力が
加えられ、これによって接触部７ａが常に確実にＩＣ素
子１の表面と面接触を保ち、ＩＣ素子１において発生す
る熱を接触部７ａから、中間部７ｂと、取付部７ｃとヒ
ートシンク６とを介して、または、接触部７ａから、放
熱部７ｄと、ヒートシンク６とを介して外部に放熱して
いる。Also, for the contact portion 7a of the leaf spring 7,
A spring force is always applied by a pair of the intermediate portion 7b and the heat radiating portion 7d, whereby the contact portion 7a always surely keeps the surface contact with the surface of the IC element 1, and generates the heat generated in the IC element 1 from the contact portion 7a. Heat is radiated to the outside through the intermediate portion 7b, the mounting portion 7c, and the heat sink 6, or from the contact portion 7a through the heat radiating portion 7d and the heat sink 6.
【００２２】[0022]
【発明の効果】本発明によれば、モジュール内の発熱素
子からの放熱効率の高い放熱構造を提供することができ
る。According to the present invention, it is possible to provide a heat radiation structure having high heat radiation efficiency from the heat generating element in the module.
【図１】本発明にかかるモジュール内発熱素子の放熱構
造の一実施例を示す概略断面図である。FIG. 1 is a schematic cross-sectional view showing one embodiment of a heat dissipation structure of a heating element in a module according to the present invention.
【図２】従来のモジュール内発熱素子の放熱構造を示す
概略断面図である。FIG. 2 is a schematic cross-sectional view showing a heat dissipation structure of a conventional in-module heating element.
１ ＩＣ素子 ２ プリント基板 ３ ネジ ４ ケース ５ ネジ ６ ヒートシンク ６ａ 内面 ７ 板バネ ７ａ 接触部 ７ｂ 中間部 ７ｃ 取付部 ７ｄ 放熱部 ８ ネジ ９ シリコングリス １０ 電気部品 DESCRIPTION OF SYMBOLS 1 IC element 2 Printed circuit board 3 Screw 4 Case 5 Screw 6 Heat sink 6a Inner surface 7 Leaf spring 7a Contact part 7b Intermediate part 7c Mounting part 7d Heat radiating part 8 Screw 9 Silicon grease 10 Electric parts
Claims (3)
該発熱素子の表面に接触する板バネを介して行う発熱素
子の放熱構造において、 前記板バネと接触するとともに、前記モジュールのケー
スの一部としても機能するヒートシンクを介して、前記
発熱素子からの放熱を行うことを特徴とするモジュール
内発熱素子の放熱構造。1. Heat radiation from a heating element in a module is
In the heat-dissipating structure of the heat-generating element, which is performed through a leaf spring that contacts the surface of the heat-generating element, the heat-dissipating element is connected to the plate spring and, through a heat sink that also functions as a part of the case of the module, A heat dissipating structure for a heat generating element in a module, which dissipates heat.
トシンクへの第１接触部と、前記発熱素子の放熱のみを
目的とした前記ヒートシンクへの第２接触部を有するこ
とを特徴とする請求項１記載のモジュール内発熱素子の
放熱構造。2. The apparatus according to claim 1, wherein the leaf spring has a first contact portion to the heat sink also serving as a mounting portion, and a second contact portion to the heat sink only for heat radiation of the heating element. A heat dissipation structure for a heat generating element in a module according to claim 1.
または前記板バネと前記ヒートシンクとの接触部、ある
いはこれらの両方の接触部にシリコングリスを塗布した
ことを特徴とする請求項１または２記載のモジュール内
発熱素子の放熱構造。3. A contact portion between the heating element and the leaf spring,
The heat dissipating structure for a heat generating element in a module according to claim 1 or 2, wherein silicon grease is applied to a contact portion between the leaf spring and the heat sink or both contact portions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36399597A JPH11186472A (en) | 1997-12-17 | 1997-12-17 | Heat radiating structure for in-module heat generating element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36399597A JPH11186472A (en) | 1997-12-17 | 1997-12-17 | Heat radiating structure for in-module heat generating element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11186472A true JPH11186472A (en) | 1999-07-09 |
Family
ID=18480723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP36399597A Withdrawn JPH11186472A (en) | 1997-12-17 | 1997-12-17 | Heat radiating structure for in-module heat generating element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11186472A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8077476B2 (en) * | 2007-09-12 | 2011-12-13 | Denso Corporation | Electronic device mounting structure |
| JP2011530190A (en) * | 2008-08-04 | 2011-12-15 | クラスタード システムズ カンパニー | Electronic equipment housing with cooled contacts |
| JP2014033119A (en) * | 2012-08-06 | 2014-02-20 | Mitsubishi Electric Corp | Semiconductor device |
-
1997
- 1997-12-17 JP JP36399597A patent/JPH11186472A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8077476B2 (en) * | 2007-09-12 | 2011-12-13 | Denso Corporation | Electronic device mounting structure |
| JP2011530190A (en) * | 2008-08-04 | 2011-12-15 | クラスタード システムズ カンパニー | Electronic equipment housing with cooled contacts |
| JP2014033119A (en) * | 2012-08-06 | 2014-02-20 | Mitsubishi Electric Corp | Semiconductor device |
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| A300 | Withdrawal of application because of no request for examination |
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