WO2023090102A1 - Mounting board and electrical equipment having mounting board installed thereon - Google Patents

Mounting board and electrical equipment having mounting board installed thereon Download PDF

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Publication number
WO2023090102A1
WO2023090102A1 PCT/JP2022/039981 JP2022039981W WO2023090102A1 WO 2023090102 A1 WO2023090102 A1 WO 2023090102A1 JP 2022039981 W JP2022039981 W JP 2022039981W WO 2023090102 A1 WO2023090102 A1 WO 2023090102A1
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Prior art keywords
heat dissipation
electrode
inlay
electronic component
pad
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PCT/JP2022/039981
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French (fr)
Japanese (ja)
Inventor
淳也 三嶋
智 松永
晋平 浦田
紀元 野坂
聡 岩井
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オムロン株式会社
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Publication of WO2023090102A1 publication Critical patent/WO2023090102A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a mounting board and an electrical device on which the mounting board is mounted.
  • the semiconductor device includes an electronic component, a substrate on which the electronic component is mounted, a lower housing on which the substrate is mounted, and a heat spreader to which the electronic component is metal-bonded to the first surface via a bonding material.
  • the lower housing has an opening for engaging the heat spreader, and the heat spreader is bonded to the opening via a bonding material.
  • the heat spreader has a second surface facing the first surface exposed from the lower housing (see Patent Document 1, for example).
  • the circuit module includes a circuit board having a heating element mounted on one main surface, a housing for supporting the circuit board, and a heat dissipation sheet arranged on the other main surface of the circuit board for diffusing heat in the in-plane direction, a heat conducting portion that conducts heat generated by the heating element to the housing (see Patent Document 2, for example).
  • a copper inlay press-fitted into an opening of a printed circuit board and a heat radiation pad of a high frequency device are connected by a solder layer.
  • the heat generated from the high frequency device is transmitted through the copper inlay and dissipated from the printed circuit board.
  • the size of the area of the copper inlay relative to the area of the heat dissipation pad is unclear. Considering the fact that increasing the area of the inlay increases the difficulty of manufacturing the printed circuit board, there may be cases where the area of the copper inlay must be equal to the area of the heat dissipation pad. If the area of the heat dissipation pad and the area of the copper inlay are the same, the heat cannot be efficiently dissipated from the printed circuit board.
  • the present invention has been made in view of the above-described problems, and provides a mounting board capable of improving the heat dissipation property of heat generated in an electronic component without deteriorating electrical performance, and the mounting board.
  • the final purpose is to provide electrical equipment equipped with and a printed circuit board used for them.
  • An electronic component including an electronic element and having a heat dissipation pad having heat dissipation properties; a printed circuit board on which an inlay containing metal as a main component is arranged inside, the heat dissipation pad and the inlay are connected, and the electronic component is mounted;
  • the electronic component has a first electrode that has the same potential as the heat dissipation pad or is an unused electrode,
  • the inlay includes a mounting substrate in contact with the first electrode.
  • the first electrode has the same potential as the heat dissipation pad or is an unused electrode, so even if the inlay connected to the heat dissipation pad contacts the first electrode, a short circuit will occur. never.
  • the inlay may come into contact with the electrodes of the electronic component, causing a short circuit.
  • the mounting substrate may further include a cooling structure portion having heat dissipation properties and to which the printed circuit board is bonded via a bonding material. According to this, the heat absorbed from the heat dissipation pad can also be diffused from the cooling structure.
  • the electronic component may be a mounting board characterized by having a second electrode having a potential different from that of the heat radiation pad, in addition to the first electrode. According to this, since the inlay does not come into contact with the second electrode, it is possible to prevent the occurrence of a short circuit.
  • the mounting substrate may be characterized in that the area of the inlay is larger than the area of the heat dissipation pad. According to this, the heat absorbed by the inlay from the heat radiation pad is easily diffused not only from the cooling structure but also from the printed circuit board. By increasing the area of the inlay, the heat diffusion efficiency can be improved.
  • the inlay is connected to the heat radiation pad of each of the plurality of electronic components, and is in contact with the first electrode of each of the electronic components. good. According to this, it is possible to mount a plurality of electronic components on the printed circuit board with high density, and it is possible to reduce the size of the mounting substrate.
  • an electrical device that performs power conversion of power supplied from a power supply device may be an electrical device on which the mounting board described above is mounted. According to this, the heat generated from the cooling structure can be diffused into the air outside the electrical equipment, and the electrical equipment can be cooled by the outside air. Moreover, the circuit pattern of the printed circuit board can be mounted on the electrical equipment.
  • a printed circuit board capable of mounting an electronic component in which an inlay mainly composed of metal is arranged inside and a heat dissipation pad having heat dissipation is arranged inside,
  • the inlay is connected to the heat dissipation pad when the electronic component is mounted, and is in contact with a first electrode of the electronic component that has the same potential as the heat dissipation pad or is an unused electrode. It is good also as a printed circuit board characterized by doing.
  • the present invention even if the inlay comes into contact with the first electrode due to the large area of the inlay after the electronic component is mounted on the printed circuit board, it is possible to prevent a short circuit from occurring. Also, the heat absorbed from the thermal pad can be diffused through the cooling structure.
  • an electrode pad for connecting a second electrode having a potential different from that of the heat radiation pad provided on the electronic component is provided, and the electrode pad is connected to the electrode pad of the second electrode of the electronic component.
  • the printed circuit board may be characterized in that the inlay is arranged at a position so as to be connected to the heat dissipation pad and to be in contact with the first electrode when the electrode of the inlay is connected. According to this, after the electronic component is mounted on the printed circuit board, the inlay does not come into contact with the second electrode, so it is possible to prevent the occurrence of a short circuit.
  • a printed circuit board may be used, characterized in that the area of the inlay is larger than the area of the heat dissipation pad. According to this, after the electronic component is mounted on the printed circuit board, the heat absorbed by the inlay from the heat radiation pad is easily diffused from the printed circuit board. By increasing the area of the inlay, the heat diffusion efficiency can be improved.
  • the inlay is connected to the heat radiation pad of each of the plurality of electronic components when mounting the plurality of electronic components, and is in contact with each of the first electrodes.
  • a printed circuit board may be used. According to this, a plurality of electronic components can be mounted on the printed circuit board with high density.
  • the mounting board can be mounted on an electric device.
  • FIG. 1 is a cross-sectional schematic diagram showing an example of the entire mounting substrate according to an embodiment of the present invention.
  • FIG. 2A is a plan view of the bottom surface of the electronic component shown in FIG. 1 as viewed in the direction of the arrow.
  • FIG. 2B is a perspective view of the electronic component shown in FIG. 2A.
  • FIG. 3 is a plan view showing an example of a portion of a printed circuit board on which copper inlays are arranged according to an embodiment of the present invention.
  • 4A, 4B, and 4C are the results of comparative evaluation showing differences in measured values of heat dissipation (thermal resistance) due to differences in copper inlay area.
  • FIG. 5 is a cross-sectional schematic diagram showing an example of a power conditioner on which a mounting board according to an embodiment of the present invention is mounted.
  • the present invention can be applied to a mounting board 1 as shown in FIG. Moreover, by mounting the mounting substrate 1 as shown in FIG. 1, the present invention can also be applied to a power conditioner 7 as an example of an electric device as shown in FIG.
  • FIG. 1 is a cross-sectional schematic diagram showing an example of the entire mounting substrate 1 to which the present invention is applicable.
  • a mounting substrate 1 in this application example includes an electronic component 2, a printed circuit board 3, a heat sink 4, and the like.
  • the electronic component 2 is, for example, a semiconductor component such as an ASIC (Application Specific Integrated Circuit) or a power semiconductor such as a MOSFET (Metal Oxide Semiconductor Field Effect Transistor), and includes an electronic element (not shown).
  • the electronic component 2 generates heat by applying a current to the electronic element.
  • the mounting board 1 includes electronic components other than the electronic component 2 (for example, a capacitor, etc.), but the electronic component 2 generates a larger amount of heat than the other electronic components.
  • a heat dissipation pad 21 having heat dissipation is arranged inside the electronic component 2 .
  • the heat dissipation pad 21 is formed integrally with a lead frame (not shown) on which a semiconductor chip using gallium nitride (GaN) is mounted.
  • the heat dissipation pad 21 is connected to a copper inlay 31, which will be described later, via a solder layer 5 printed, for example, by a solder printer.
  • the electronic component 2 is mounted on the printed circuit board 3 by connecting the heat radiation pad 21 and the copper inlay 31 .
  • the printed board 3 is, for example, a build-up printed wiring board that has a multilayer structure and uses a thermosetting epoxy resin as a base material.
  • the printed circuit board 3 has an opening (not shown), and a columnar copper inlay 31 mainly composed of copper with high thermal conductivity is press-fitted into the opening.
  • the thickness of the printed circuit board 3 in this application example is 1.6 mm, and the copper inlay 31 is formed to have the same thickness as the printed circuit board 3 .
  • an inlay whose main component is a metal other than copper may be used as long as the metal has high thermal conductivity.
  • the copper inlay 31 corresponds to the inlay in the present invention.
  • the thermal pad 21 and the copper inlay 31 are connected via the solder layer 5 as described above.
  • a circuit board other than the printed board 3 may be used as long as an electric circuit is formed thereon.
  • the heat sink 4 is mainly composed of metal with high thermal conductivity and has the property of diffusing the absorbed heat to the surroundings.
  • the printed circuit board 3 is joined to the heat sink 4 via the heat dissipation sheet 6 .
  • the heat transmitted from the electronic component 2 to the copper inlay 31 through the heat radiation pad 21 and the solder layer 5 is further transmitted through the copper inlay 31 and diffused from the printed circuit board 3 (detailed in FIGS. 2A and 2B of the following embodiment). ), it is also diffused from the heat sink 4 via the heat radiation sheet 6 .
  • the heat dissipation sheet 6 contains a filler such as boron nitride or alumina and has high thermal conductivity.
  • the thickness of the heat dissipation sheet 6 in this application example is 30 to 40 ⁇ m.
  • the heat sink 4 is hard and does not easily deform even when pressurized, whereas the heat dissipation sheet 6 also has properties as a cushioning material and easily deforms when pressurized. Therefore, compared to the case where the printed circuit board 3 is directly bonded to the heat sink 4 , the printed circuit board 3 is in contact with the heat dissipation sheet 6 , so that the printed circuit board 3 is easily brought into close contact with the copper inlay 31 inside the printed circuit board 3 . Almost absorbs heat. As a result, the amount of heat diffused by the heat sink 4 to the surroundings also increases.
  • the heat dissipation sheet 6 may be adhesive, or holes for passing screws through the printed circuit board 3 and the heat sink 4 may be used to tighten the screws. holes may be formed and fixed with screws.
  • the heat sink 4 corresponds to the cooling structure in the present invention.
  • the heat dissipation sheet 6 corresponds to the bonding material in the present invention.
  • FIG. 2A is a plan view of the bottom surface of the electronic component 2 shown in FIG. 1, viewed from the direction of the arrow.
  • FIG. 2B is a perspective view of the electronic component 2 shown in FIG. 2A.
  • the area corresponding to the copper inlay 31 is indicated by broken lines.
  • the copper inlay 31 is arranged on the surface above the electronic component 2 in the orientation of FIGS. 2A and 2B.
  • the electronic component 2 has a plurality of first electrodes 22 and second electrodes 23 on the same surface as the heat dissipation pads 21 are arranged.
  • a copper inlay 31 connected with the heat dissipation pad 21 contacts the two first electrodes 22 .
  • the first electrode 22 is either at the same potential as the thermal pad 21 or is an unused electrode.
  • the first electrode 22 has the same potential as the heat radiation pad 21, the heat radiation pad 21 and the first electrode 22 are connected inside the electronic component 2, and the first electrode 22 is grounded, for example. there is As a result, even if the copper inlay 31 contacts the first electrode 22, no short circuit occurs.
  • the second electrode 23 has a different potential than the heat dissipation pad 21 , and the copper inlay 31 does not contact the second electrode 23 .
  • the numbers and positions of the first electrodes 22 and the second electrodes 23 included in the electronic component 2 in this application example are not limited to those shown in FIGS. 2A and 2B.
  • the first electrode 22 and the second electrode 23 are electrically connected to terminals (not shown).
  • the first electrode 22 and the second electrode 23 are not necessarily provided on the bottom surface of the electronic component 2 as shown in FIGS. may be formed.
  • the copper inlay 31 may be shared with a plurality of electronic components 2 .
  • the copper inlay 31 may be connected to the thermal pad 21 of each of the electronic components 2 and may be in contact with the first electrode 22 of each.
  • FIG. 3 is a plan view showing an example of a portion of the printed circuit board 3 according to the embodiment of the present invention where the copper inlay 31 is arranged.
  • areas corresponding to the electronic component 2 and the heat radiation pad 21 are indicated by dashed lines.
  • the printed circuit board 3 is provided with electrode pads 32 at locations where the copper inlays 31 are not arranged. connected with At the same time, the copper inlay 31 is connected to the heat dissipation pad 21 and positioned to contact the first electrode 22 .
  • FIGS. 4A, 4B, and 4C are comparative evaluation results showing differences in measured values of heat dissipation (thermal resistance) due to differences in the areas of the copper inlays 31, 31a, and 31b.
  • FIG. 4A, 4B and 4C the components are the same except for the copper inlays 31, 31a and 31b.
  • FIG. 4A shows a copper inlay 31 in this embodiment.
  • the area of the copper inlay 31a shown in FIG. 4B is larger than the area of the heat radiation pad 21, as in the present embodiment, but the copper inlay 31a does not contact the first electrode 22.
  • the copper inlay 31b does not contact the first electrode 22.
  • the measured thermal resistance values of the copper inlays 31, 31a, and 31b were 3.2 K/W, 4.1 K/W, and 4.5 K/W, respectively, and the heat dissipation amount of the copper inlay 31 was the largest. From the results of the above comparative evaluation, the copper inlay 31 is in contact with the first electrode 22, and by increasing the area of the copper inlay 31 compared to the area of the heat dissipation pad 21, the electrical power of the copper inlay 31 is reduced. It is possible to improve the heat dissipation of the printed circuit board 3 without deteriorating the general performance.
  • FIG. 5 is a cross-sectional schematic diagram showing an example of the power conditioner 7 on which the mounting board 1 according to the embodiment of the present invention is mounted.
  • the mounting board 1 may be mounted on an electric device, and the electric device may be, for example, a power conversion device such as the power conditioner 7, a motor drive device, a power source device, or the like.
  • the power conditioner 7 is connected to a power supply device (not shown) such as a solar cell, boosts the voltage of the power supplied from the power supply device, converts it to alternating current, removes noise, and adjusts the waveform.
  • AC power is supplied to a load (not shown) and an interconnected power system (not shown).
  • a thermally conductive metal base 72 is installed on one side of the housing 71 of the power conditioner 7 .
  • the heat sink 4 to which the printed circuit board 3 is connected is screwed to the metal base 72 with screws 8 . After absorbing the heat generated from the electronic component 2 in this way, the heat sink 4 easily transfers the heat to the outside air.
  • the heat transferred to the metal base 72 is further transferred to the housing 71 and cooled by the outside air.
  • the printed circuit board 3 is screwed to the heat sink 4 via spacers 73 .
  • a terminal block 77 is fixedly attached to a base 76 whose one end is screwed to the printed circuit board 3 via a spacer 74 and whose other end is screwed to the metal base 72 via a spacer 75 .
  • a control circuit board (not shown) may be attached to the surface of the printed circuit board 3 opposite to the front surface through a connector (not shown).
  • the circuit pattern on the printed circuit board 3 is connected to the metal base 72 .
  • An electronic component (2) including an electronic element and having a heat dissipation pad (21) having heat dissipation properties; a printed circuit board (3) in which an inlay (31) mainly composed of metal is arranged, the heat radiation pad and the inlay are connected, and the electronic component is mounted;
  • the electronic component has a first electrode (22) that has the same potential as the heat dissipation pad or is an unused electrode,
  • a mounting substrate (1) characterized in that said inlay is in contact with said first electrode.
  • a printed circuit board (3) on which an electronic component (2) can be mounted in which an inlay (31) mainly made of metal is arranged inside and a heat dissipation pad (21) having heat dissipation properties is arranged inside,
  • the inlay is connected to the heat radiation pad when the electronic component is mounted, and the first electrode (22) of the electronic component has the same potential as the heat radiation pad or is an unused electrode ), characterized in that it is in contact with the printed circuit board (3).
  • Mounting board 2 Electronic component 21: Heat dissipation pad 22: First electrode 23: Second electrode 3: Printed circuit board 31, 31a, 31b: Copper inlay 32: Electrode pad 4: Heat sink 5: Solder layer 6: Heat dissipation Sheet 7 : Power conditioner 71 : Housing 72 : Metal base 73-75 : Spacer 76 : Base 77 : Terminal block 8 : Screw

Abstract

Provided are: a mounting board that can improve the heat dissipation properties of a printed board without causing a deterioration in electrical performance; and electrical equipment having said mounting board installed thereon. This mounting board is characterized by comprising: an electronic component which has disposed in the interior thereof a heat dissipation pad having heat dissipation properties; a printed board which has disposed in the interior thereof an inlay having a metal having heat conduction properties as the main component thereof and in which the heat dissipation pad and the inlay are connected and the electronic component is mounted thereon; and a cooling structure part that has the printed board joined thereto, wherein the electronic component has a first electrode on the same surface as the surface where the heat dissipation pad is disposed, the first electrode having the same electric potential as the heat dissipation pad or being a unused electrode, and the inlay is connected to the first electrode.

Description

実装基板、及び実装基板を搭載した電気機器Mounting substrates and electrical equipment mounted with mounting substrates
　本発明は、実装基板、及び実装基板を搭載した電気機器に関する。 The present invention relates to a mounting board and an electrical device on which the mounting board is mounted.
　従来、電子部品の放熱性を大幅に高めることのできる半導体装置が公知である。当該半導体装置は、電子部品と、電子部品を実装する基板と、基板を搭載する下部筐体と、第１の表面に、接合材を介して電子部品が金属接合されるヒートスプレッダと、を有する。下部筐体は、ヒートスプレッダを係合させる開口部を有し、ヒートスプレッダは、開口部に接合材を介して接合される。そして、ヒートスプレッダは、第１の表面に対向する第２の表面が下部筐体から露出している（例えば、特許文献１参照）。 Conventionally, semiconductor devices that can greatly improve the heat dissipation of electronic components have been known. The semiconductor device includes an electronic component, a substrate on which the electronic component is mounted, a lower housing on which the substrate is mounted, and a heat spreader to which the electronic component is metal-bonded to the first surface via a bonding material. The lower housing has an opening for engaging the heat spreader, and the heat spreader is bonded to the opening via a bonding material. The heat spreader has a second surface facing the first surface exposed from the lower housing (see Patent Document 1, for example).
　また、発熱源から発せられる熱を、低コストで、効率良く外部へ放熱する回路モジュールも公知である。当該回路モジュールは、一主面に発熱体を搭載した回路基板と、回路基板を支持する筐体と、回路基板の他主面に配置され、面内方向に熱を拡散する放熱シートを備え、発熱体が発する熱を筐体に伝える熱伝導部と、を有する（例えば、特許文献２参照）。 A circuit module that efficiently radiates heat generated from a heat source to the outside at low cost is also known. The circuit module includes a circuit board having a heating element mounted on one main surface, a housing for supporting the circuit board, and a heat dissipation sheet arranged on the other main surface of the circuit board for diffusing heat in the in-plane direction, a heat conducting portion that conducts heat generated by the heating element to the housing (see Patent Document 2, for example).
特開２０１４－００３２５８号公報JP 2014-003258 A 特開２０２０－１９１３１６号公報JP 2020-191316 A
　上記特許文献１において開示されているような半導体装置においては、電流を流した際の発熱量が多い電子部品の放熱性を大幅に高めるために、電子部品が接合材を介して、熱を大気中に拡散する性質を有するヒートスプレッダに接着している。しかしながら、電子部品から発生した熱が、電子部品を実装した基板に伝達し、基板の放熱性が十分でない場合には基板の温度が過度に上昇する虞がある。基板の温度が過度に上昇すると、例えば発熱している電子部品の近くにある他の電子部品の温度が上昇し、性能低下や損傷を引き起こす虞がある。また、上記特許文献２において開示されているような回路モジュールにおいては、プリント基板の開口に圧入された銅インレイと、高周波デバイスの放熱パッドとが、はんだ層により接続されている。これによって、高周波デバイスから発生した熱は銅インレイを伝達し、プリント基板から放熱する。しかしながら、当該回路モジュールにおいては、放熱パッドの面積に対する銅インレイの面積の大きさが不明確であり、例えば、プリント基板において銅インレイが設置された箇所には配線を形成することができない、あるいは銅インレイの面積を大きくすることにより、プリント基板を製造する難易度が上がるといった実状を鑑みて、銅インレイの面積を放熱パッドの面積と同等にせざるを得ない場合が考えられる。放熱パッドの面積と銅インレイの面積とが同等である場合、プリント基板から効率的に放熱することができない。 In the semiconductor device disclosed in the above Patent Document 1, in order to greatly improve the heat dissipation of the electronic parts that generate a large amount of heat when an electric current is passed, the electronic parts are exposed to the atmosphere through the bonding material. It adheres to a heat spreader that has the property of diffusing into it. However, the heat generated from the electronic component is transferred to the board on which the electronic component is mounted, and if the heat dissipation property of the board is insufficient, the temperature of the board may rise excessively. If the substrate temperature rises excessively, for example, the temperature of other electronic components near the heat-generating electronic component rises, which may cause performance degradation or damage. Further, in a circuit module as disclosed in the above-mentioned Patent Document 2, a copper inlay press-fitted into an opening of a printed circuit board and a heat radiation pad of a high frequency device are connected by a solder layer. As a result, the heat generated from the high frequency device is transmitted through the copper inlay and dissipated from the printed circuit board. However, in this circuit module, the size of the area of the copper inlay relative to the area of the heat dissipation pad is unclear. Considering the fact that increasing the area of the inlay increases the difficulty of manufacturing the printed circuit board, there may be cases where the area of the copper inlay must be equal to the area of the heat dissipation pad. If the area of the heat dissipation pad and the area of the copper inlay are the same, the heat cannot be efficiently dissipated from the printed circuit board.
　本発明は、上記のような問題点に鑑みてなされたものであり、電気的な性能を悪化させることなく電子部品において発生する熱の放熱性を向上させることができる実装基板、及び当該実装基板を搭載した電気機器及び、それらに使用されるプリント基板を提供することを最終的な目的とする。 SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and provides a mounting board capable of improving the heat dissipation property of heat generated in an electronic component without deteriorating electrical performance, and the mounting board. The final purpose is to provide electrical equipment equipped with and a printed circuit board used for them.
　上記の課題を解決するための本開示は、
　電子素子を含み、放熱性を有する放熱パッドを有する電子部品と、
　金属を主成分とするインレイが内部に配置され、前記放熱パッドと当該インレイとが接続されて前記電子部品が実装されたプリント基板と、を備え、
　前記電子部品は、前記放熱パッドと同電位である、または不使用の電極である第１の電極を有し、
　前記インレイは、前記第１の電極に接触していることを特徴とする、実装基板を含む。 The present disclosure for solving the above problems is
An electronic component including an electronic element and having a heat dissipation pad having heat dissipation properties;
a printed circuit board on which an inlay containing metal as a main component is arranged inside, the heat dissipation pad and the inlay are connected, and the electronic component is mounted;
The electronic component has a first electrode that has the same potential as the heat dissipation pad or is an unused electrode,
The inlay includes a mounting substrate in contact with the first electrode.
　本開示によれば、第１の電極は、放熱パッドと同電位であるか、または不使用の電極であるため、放熱パッドと接続されたインレイが第１の電極に接触しても短絡が生じることはない。インレイの面積を大きくすることで、インレイが電子部品における電極に接触して短絡が生じる虞があるが、接触する電極を第１の電極とすることで、短絡が生じ得る問題が解消される。 According to the present disclosure, the first electrode has the same potential as the heat dissipation pad or is an unused electrode, so even if the inlay connected to the heat dissipation pad contacts the first electrode, a short circuit will occur. never. By increasing the area of the inlay, the inlay may come into contact with the electrodes of the electronic component, causing a short circuit.
　また、本開示においては、放熱性を有し、接合材を介して前記プリント基板が接合された冷却構造部をさらに有する、実装基板としてもよい。これによれば、放熱パッドから吸収した熱を冷却構造部から拡散することもできる。 Further, in the present disclosure, the mounting substrate may further include a cooling structure portion having heat dissipation properties and to which the printed circuit board is bonded via a bonding material. According to this, the heat absorbed from the heat dissipation pad can also be diffused from the cooling structure.
　また、本開示においては、前記電子部品は、前記第１の電極以外に、前記放熱パッドと電位が異なる第２の電極を有することを特徴とする、実装基板としてもよい。これによれば、インレイが第２の電極に接触しないため、短絡が生じることを防止できる。 Further, in the present disclosure, the electronic component may be a mounting board characterized by having a second electrode having a potential different from that of the heat radiation pad, in addition to the first electrode. According to this, since the inlay does not come into contact with the second electrode, it is possible to prevent the occurrence of a short circuit.
　また、本開示においては、前記インレイの面積は、前記放熱パッドの面積と比較して大きいことを特徴とする、実装基板としてもよい。これによれば、インレイが放熱パッドから吸収した熱は、冷却構造部のみならず、プリント基板からも拡散しやすい。インレイの面積を大きくすることによって、熱の拡散効率を向上させることができる。 Further, in the present disclosure, the mounting substrate may be characterized in that the area of the inlay is larger than the area of the heat dissipation pad. According to this, the heat absorbed by the inlay from the heat radiation pad is easily diffused not only from the cooling structure but also from the printed circuit board. By increasing the area of the inlay, the heat diffusion efficiency can be improved.
　また、本開示においては、前記インレイは、複数の前記電子部品の各々の前記放熱パッドと接続されており、各々の前記第１の電極に接触していることを特徴とする、実装基板としてもよい。これによれば、プリント基板に複数の電子部品を高密度に搭載することができ、実装基板の小型化を図ることができる。 Further, in the present disclosure, the inlay is connected to the heat radiation pad of each of the plurality of electronic components, and is in contact with the first electrode of each of the electronic components. good. According to this, it is possible to mount a plurality of electronic components on the printed circuit board with high density, and it is possible to reduce the size of the mounting substrate.
　また、本開示においては、電力供給装置から供給される電力の電力変換を行う電気機器であって、上記に記載の実装基板を搭載した電気機器としてもよい。これによれば、冷却構造部から発生した熱を電気機器の外部の空気中に拡散することや、電気機器において外気によって冷却することができる。また、プリント基板の回路パターンを電気機器に搭載できる。 Further, in the present disclosure, an electrical device that performs power conversion of power supplied from a power supply device may be an electrical device on which the mounting board described above is mounted. According to this, the heat generated from the cooling structure can be diffused into the air outside the electrical equipment, and the electrical equipment can be cooled by the outside air. Moreover, the circuit pattern of the printed circuit board can be mounted on the electrical equipment.
　また、本発明においては、
　金属を主成分とするインレイが内部に配置され、放熱性を有する放熱パッドが内部に配置された電子部品を実装可能なプリント基板であって、
　前記インレイは、前記電子部品を実装する際に、前記放熱パッドと接続されるとともに、前記電子部品が有する、前記放熱パッドと同電位である、または不使用の電極である第１の電極に接触することを特徴とする、プリント基板としてもよい。 Moreover, in the present invention,
A printed circuit board capable of mounting an electronic component in which an inlay mainly composed of metal is arranged inside and a heat dissipation pad having heat dissipation is arranged inside,
The inlay is connected to the heat dissipation pad when the electronic component is mounted, and is in contact with a first electrode of the electronic component that has the same potential as the heat dissipation pad or is an unused electrode. It is good also as a printed circuit board characterized by doing.
　本発明によれば、電子部品をプリント基板に実装した後において、インレイの面積が大きいことに起因してインレイが第１の電極に接触しても、短絡が生じることを防止できる。また、放熱パッドから吸収した熱を冷却構造部から拡散することもできる。 According to the present invention, even if the inlay comes into contact with the first electrode due to the large area of the inlay after the electronic component is mounted on the printed circuit board, it is possible to prevent a short circuit from occurring. Also, the heat absorbed from the thermal pad can be diffused through the cooling structure.
　また、本発明においては、前記電子部品に設けられた、前記放熱パッドと電位が異なる第２の電極を接続する電極パッドを備え、前記電極パッドは、前記電極パッドに前記電子部品の前記第２の電極が接続された際に、前記インレイが、前記放熱パッドと接続されるとともに前記第１の電極に接触するような位置に配置されたことを特徴とする、プリント基板としてもよい。これによれば、電子部品をプリント基板に実装した後において、インレイが第２の電極に接触しないため、短絡が生じることを防止できる。 Further, in the present invention, an electrode pad for connecting a second electrode having a potential different from that of the heat radiation pad provided on the electronic component is provided, and the electrode pad is connected to the electrode pad of the second electrode of the electronic component. The printed circuit board may be characterized in that the inlay is arranged at a position so as to be connected to the heat dissipation pad and to be in contact with the first electrode when the electrode of the inlay is connected. According to this, after the electronic component is mounted on the printed circuit board, the inlay does not come into contact with the second electrode, so it is possible to prevent the occurrence of a short circuit.
　また、本発明においては、前記インレイの面積は、前記放熱パッドの面積と比較して大きいことを特徴とする、プリント基板としてもよい。これによれば、電子部品をプリント基板に実装した後において、インレイが放熱パッドから吸収した熱は、プリント基板から拡散しやすい。インレイの面積を大きくすることによって、熱の拡散効率を向上させることができる。 Further, in the present invention, a printed circuit board may be used, characterized in that the area of the inlay is larger than the area of the heat dissipation pad. According to this, after the electronic component is mounted on the printed circuit board, the heat absorbed by the inlay from the heat radiation pad is easily diffused from the printed circuit board. By increasing the area of the inlay, the heat diffusion efficiency can be improved.
　また、本発明においては、前記インレイは、複数の前記電子部品を実装する際に、複数の前記電子部品の各々の前記放熱パッドと接続され、各々の前記第１の電極に接触することを特徴とする、プリント基板としてもよい。これによれば、プリント基板に複数の電子部品を高密度に搭載できる。 Further, in the present invention, the inlay is connected to the heat radiation pad of each of the plurality of electronic components when mounting the plurality of electronic components, and is in contact with each of the first electrodes. A printed circuit board may be used. According to this, a plurality of electronic components can be mounted on the printed circuit board with high density.
　なお、上記の課題を解決するための手段は、可能な限り互いに組み合わせて用いることができる。 It should be noted that the means for solving the above problems can be used in combination with each other as much as possible.
　本発明によれば、実装基板において、電気的な性能を悪化させることなくプリント基板の放熱性を向上させることができる。また、当該実装基板を電気機器に搭載することもできる。 According to the present invention, it is possible to improve the heat dissipation of the printed board without deteriorating the electrical performance of the mounting board. Also, the mounting board can be mounted on an electric device.
図１は、本発明の実施例に係る実装基板の全体の一例を示す断面模式図である。FIG. 1 is a cross-sectional schematic diagram showing an example of the entire mounting substrate according to an embodiment of the present invention. 図２Ａは、図１に示す電子部品の底面を矢印の方向から見た平面図である。図２Ｂは、図２Ａに示す電子部品の斜視図である。FIG. 2A is a plan view of the bottom surface of the electronic component shown in FIG. 1 as viewed in the direction of the arrow. FIG. 2B is a perspective view of the electronic component shown in FIG. 2A. 図３は、本発明の実施例に係るプリント基板のうち銅インレイが配置された部分の一例を示す平面図である。FIG. 3 is a plan view showing an example of a portion of a printed circuit board on which copper inlays are arranged according to an embodiment of the present invention. 図４Ａ、図４Ｂ、図４Ｃは、銅インレイの面積の違いによる放熱性（熱抵抗）の測定値の差を示す比較評価の結果である。4A, 4B, and 4C are the results of comparative evaluation showing differences in measured values of heat dissipation (thermal resistance) due to differences in copper inlay area. 図５は、本発明の実施例に係る実装基板を搭載したパワーコンディショナの一例を示す断面模式図である。FIG. 5 is a cross-sectional schematic diagram showing an example of a power conditioner on which a mounting board according to an embodiment of the present invention is mounted.
〔適用例〕
　以下に本発明の適用例の概要について一部の図面を用いて説明する。本発明は図１に示すような実装基板１に適用することができる。また、図１に示すような実装基板１を搭載することで、本発明は図５に示すような電気機器の例としてのパワーコンディショナ７に適用することもできる。 [Example of application]
An outline of an application example of the present invention will be described below with reference to some of the drawings. The present invention can be applied to a mounting board 1 as shown in FIG. Moreover, by mounting the mounting substrate 1 as shown in FIG. 1, the present invention can also be applied to a power conditioner 7 as an example of an electric device as shown in FIG.
　図１は、本発明が適用可能な実装基板１の全体の一例を示す断面模式図である。本適用例における実装基板１は、電子部品２、及びプリント基板３、及びヒートシンク４等を含んで構成される。電子部品２は、例えばＡＳＩＣ（Ａｐｐｌｉｃａｔｉｏｎ　Ｓｐｅｃｉｆｉｃ　Ｉｎｔｅｇｒａｔｅｄ　Ｃｉｒｃｕｉｔ）等の半導体部品やＭＯＳＦＥＴ（Ｍｅｔａｌ　Ｏｘｉｄｅ　Ｓｅｍｉｃｏｎｄｕｃｔｏｒ　Ｆｉｅｌｄ　Ｅｆｆｅｃｔ　Ｔｒａｎｓｉｓｔｏｒ）等のパワー半導体であり、電子素子（不図示）を含んで構成される。電子素子に電流を流すことによって、電子部品２は発熱する。実装基板１には電子部品２以外の他の電子部品（例えばコンデンサ等）も含まれるが、電子部品２は他の電子部品と比較して発熱量が大きい。 FIG. 1 is a cross-sectional schematic diagram showing an example of the entire mounting substrate 1 to which the present invention is applicable. A mounting substrate 1 in this application example includes an electronic component 2, a printed circuit board 3, a heat sink 4, and the like. The electronic component 2 is, for example, a semiconductor component such as an ASIC (Application Specific Integrated Circuit) or a power semiconductor such as a MOSFET (Metal Oxide Semiconductor Field Effect Transistor), and includes an electronic element (not shown). The electronic component 2 generates heat by applying a current to the electronic element. The mounting board 1 includes electronic components other than the electronic component 2 (for example, a capacitor, etc.), but the electronic component 2 generates a larger amount of heat than the other electronic components.
　また、電子部品２の内部には、放熱性を有する放熱パッド２１が配置されている。放熱パッド２１は、例えば窒化ガリウム（ＧａＮ）を用いた半導体チップがマウントされたリードフレーム（不図示）と一体に形成されている。放熱パッド２１は、例えばはんだ印刷機によって印刷されるはんだ層５を介して、後述の銅インレイ３１に接続されている。放熱パッド２１と銅インレイ３１が接続されて電子部品２がプリント基板３に実装される。 Further, a heat dissipation pad 21 having heat dissipation is arranged inside the electronic component 2 . The heat dissipation pad 21 is formed integrally with a lead frame (not shown) on which a semiconductor chip using gallium nitride (GaN) is mounted. The heat dissipation pad 21 is connected to a copper inlay 31, which will be described later, via a solder layer 5 printed, for example, by a solder printer. The electronic component 2 is mounted on the printed circuit board 3 by connecting the heat radiation pad 21 and the copper inlay 31 .
　プリント基板３は、例えば多層構造を有し、熱硬化性エポキシ樹脂を基材とするビルドアッププリント配線板である。プリント基板３は開口部（図示略）を有し、開口部には熱伝導性の高い銅を主成分とする柱状の銅インレイ３１が圧入されて配置されている。本適用例におけるプリント基板３の厚さは１．６ｍｍであり、銅インレイ３１はプリント基板３と同一の厚さに形成されている。なお、熱伝導性の高い金属であれば、銅インレイ３１でなく、銅以外の金属を主成分とするインレイを用いてもよい。銅インレイ３１は、本発明におけるインレイに相当する。上述の通り、はんだ層５を介して放熱パッド２１と銅インレイ３１が接続される。なお、電気回路が形成されていれば、プリント基板３以外の回路基板を用いてもよい。 The printed board 3 is, for example, a build-up printed wiring board that has a multilayer structure and uses a thermosetting epoxy resin as a base material. The printed circuit board 3 has an opening (not shown), and a columnar copper inlay 31 mainly composed of copper with high thermal conductivity is press-fitted into the opening. The thickness of the printed circuit board 3 in this application example is 1.6 mm, and the copper inlay 31 is formed to have the same thickness as the printed circuit board 3 . In place of the copper inlay 31, an inlay whose main component is a metal other than copper may be used as long as the metal has high thermal conductivity. The copper inlay 31 corresponds to the inlay in the present invention. The thermal pad 21 and the copper inlay 31 are connected via the solder layer 5 as described above. A circuit board other than the printed board 3 may be used as long as an electric circuit is formed thereon.
　ヒートシンク４は、熱伝導性の高い金属を主成分とし、吸収した熱を周囲に拡散する性質を有する。プリント基板３は、放熱シート６を介してヒートシンク４に接合されている。電子部品２から放熱パッド２１及びはんだ層５を経て銅インレイ３１に伝達した熱は、銅インレイ３１をさらに伝達してプリント基板３から拡散される（以下の実施例の図２Ａ、図２Ｂにおいて詳細に説明する）以外に、放熱シート６を経てヒートシンク４からも拡散される。放熱シート６は、窒化ホウ素やアルミナ等の充填剤を含んでいて高い熱伝導性を有する。本適用例における放熱シート６の厚さは３０～４０μｍである。ヒートシンク４は硬く、加圧しても変形しにくいのに対して、放熱シート６は緩衝材としての性質も有し、加圧すると変形しやすい。このため、プリント基板３が直接ヒートシンク４に接合される場合と比較して、プリント基板３が放熱シート６に接することによって、プリント基板３が密着しやすく、プリント基板３の内部の銅インレイ３１から熱が吸収されやすい。結果的にヒートシンク４が周囲に拡散する熱の量も多くなる。プリント基板３をヒートシンク４に接合させる方法として、例えば放熱シート６が粘着性を有するものであってもよく、あるいはプリント基板３とヒートシンク４の各々に、ネジを通すための孔とネジを締めるための孔を形成し、ネジによって固定してもよい。ここで、ヒートシンク４は、本発明における冷却構造部に相当する。また、放熱シート６は、本発明における接合材に相当する。 The heat sink 4 is mainly composed of metal with high thermal conductivity and has the property of diffusing the absorbed heat to the surroundings. The printed circuit board 3 is joined to the heat sink 4 via the heat dissipation sheet 6 . The heat transmitted from the electronic component 2 to the copper inlay 31 through the heat radiation pad 21 and the solder layer 5 is further transmitted through the copper inlay 31 and diffused from the printed circuit board 3 (detailed in FIGS. 2A and 2B of the following embodiment). ), it is also diffused from the heat sink 4 via the heat radiation sheet 6 . The heat dissipation sheet 6 contains a filler such as boron nitride or alumina and has high thermal conductivity. The thickness of the heat dissipation sheet 6 in this application example is 30 to 40 μm. The heat sink 4 is hard and does not easily deform even when pressurized, whereas the heat dissipation sheet 6 also has properties as a cushioning material and easily deforms when pressurized. Therefore, compared to the case where the printed circuit board 3 is directly bonded to the heat sink 4 , the printed circuit board 3 is in contact with the heat dissipation sheet 6 , so that the printed circuit board 3 is easily brought into close contact with the copper inlay 31 inside the printed circuit board 3 . Easily absorbs heat. As a result, the amount of heat diffused by the heat sink 4 to the surroundings also increases. As a method of joining the printed circuit board 3 to the heat sink 4, for example, the heat dissipation sheet 6 may be adhesive, or holes for passing screws through the printed circuit board 3 and the heat sink 4 may be used to tighten the screws. holes may be formed and fixed with screws. Here, the heat sink 4 corresponds to the cooling structure in the present invention. Moreover, the heat dissipation sheet 6 corresponds to the bonding material in the present invention.
　図２Ａは、図１に示す電子部品２の底面を矢印の方向から見た平面図である。図２Ｂは、図２Ａに示す電子部品２の斜視図である。図２Ａ、図２Ｂにおいて、銅インレイ３１に相当するエリアは破線で示す。銅インレイ３１は、図２Ａ、図２Ｂの向きで電子部品２より上の面に配置されている。電子部品２は、放熱パッド２１が配置された面と同じ面に、複数の第１の電極２２及び第２の電極２３を有する。放熱パッド２１と接続された銅インレイ３１は、二の第１の電極２２に接触する。第１の電極２２は、放熱パッド２１と同電位であるか、あるいは不使用の電極であるかのいずれかである。第１の電極２２が放熱パッド２１と同電位である場合は、電子部品２の内部で放熱パッド２１と第１の電極２２が接続しており、第１の電極２２は例えばグランドに接地している。これによって、銅インレイ３１が第１の電極２２に接触しても短絡が生じない。第２の電極２３は放熱パッド２１と電位が異なり、銅インレイ３１は、第２の電極２３には接触しない。なお、本適用例における電子部品２が有する第１の電極２２及び第２の電極２３の数や位置は、図２Ａ、図２Ｂに示す限りではない。また、第１の電極２２及び第２の電極２３は、不図示の端子と電気的に接続している。また、第１の電極２２及び第２の電極２３は、必ずしも図２Ａ、図２Ｂに示すように電子部品２の底面に設けられるのではなく、電子部品２の側面からリードを延出することで形成されてもよい。 FIG. 2A is a plan view of the bottom surface of the electronic component 2 shown in FIG. 1, viewed from the direction of the arrow. FIG. 2B is a perspective view of the electronic component 2 shown in FIG. 2A. In FIGS. 2A and 2B, the area corresponding to the copper inlay 31 is indicated by broken lines. The copper inlay 31 is arranged on the surface above the electronic component 2 in the orientation of FIGS. 2A and 2B. The electronic component 2 has a plurality of first electrodes 22 and second electrodes 23 on the same surface as the heat dissipation pads 21 are arranged. A copper inlay 31 connected with the heat dissipation pad 21 contacts the two first electrodes 22 . The first electrode 22 is either at the same potential as the thermal pad 21 or is an unused electrode. When the first electrode 22 has the same potential as the heat radiation pad 21, the heat radiation pad 21 and the first electrode 22 are connected inside the electronic component 2, and the first electrode 22 is grounded, for example. there is As a result, even if the copper inlay 31 contacts the first electrode 22, no short circuit occurs. The second electrode 23 has a different potential than the heat dissipation pad 21 , and the copper inlay 31 does not contact the second electrode 23 . Note that the numbers and positions of the first electrodes 22 and the second electrodes 23 included in the electronic component 2 in this application example are not limited to those shown in FIGS. 2A and 2B. Also, the first electrode 22 and the second electrode 23 are electrically connected to terminals (not shown). Moreover, the first electrode 22 and the second electrode 23 are not necessarily provided on the bottom surface of the electronic component 2 as shown in FIGS. may be formed.
〔実施例〕
　以下、本発明の実施例に係る実装基板１、及び電気機器の例としてのパワーコンディショナ７について、図面（上記の適用例で一旦説明した図面も含む）を用いてより詳細に説明する。なお、本発明に係る実装基板１、及びパワーコンディショナ７は、以下の構成に限定する趣旨のものではない。 〔Example〕
Hereinafter, the mounting substrate 1 according to the embodiment of the present invention and the power conditioner 7 as an example of the electrical equipment will be described in more detail with reference to the drawings (including the drawings once described in the application example above). It should be noted that the mounting board 1 and the power conditioner 7 according to the present invention are not intended to be limited to the following configurations.
＜プリント基板の構成＞
　ここで、図２Ａ、図２Ｂの説明に戻る。放熱パッド２１と接続された銅インレイ３１は、第１の電極２２に接触していることに加えて、銅インレイ３１の面積は、放熱パッド２１の面積と比較して大きい。上述の通り、電子部品２から銅インレイ３１に伝達した熱は、銅インレイ３１をさらに伝達してプリント基板３から拡散されるため、銅インレイ３１の面積が大きい程、電子部品２からの発熱を拡散しやすくなる。これによって、より確実に電子部品２のオーバーヒートを防止することができる。また、本実施例における実装基板１において、銅インレイ３１は複数の電子部品２と共有していてもよい。すなわち、銅インレイ３１が複数の電子部品２の各々の放熱パッド２１と接続されており、各々の第１の電極２２に接触していてもよい。 <Structure of printed circuit board>
Now, return to the description of FIGS. 2A and 2B. The copper inlay 31 connected to the heat dissipation pad 21 is in contact with the first electrode 22 , and the area of the copper inlay 31 is larger than the area of the heat dissipation pad 21 . As described above, the heat transmitted from the electronic component 2 to the copper inlay 31 is further transmitted through the copper inlay 31 and diffused from the printed circuit board 3. Therefore, the larger the area of the copper inlay 31, the more heat is generated from the electronic component 2. easier to spread. As a result, overheating of the electronic component 2 can be prevented more reliably. Moreover, in the mounting board 1 of the present embodiment, the copper inlay 31 may be shared with a plurality of electronic components 2 . In other words, the copper inlay 31 may be connected to the thermal pad 21 of each of the electronic components 2 and may be in contact with the first electrode 22 of each.
　図３は、本発明の実施例に係るプリント基板３のうち銅インレイ３１が配置された部分の一例を示す平面図である。図３において、電子部品２及び放熱パッド２１に相当するエリアは破線で示す。プリント基板３は、銅インレイ３１が配置されていない箇所に電極パッド３２を備えており、電子部品２をプリント基板３に実装する際には、電極パッド３２が電子部品２の第２の電極２３と接続される。同時に、銅インレイ３１は、放熱パッド２１と接続されるとともに、第１の電極２２に接触するような位置に配置される。 FIG. 3 is a plan view showing an example of a portion of the printed circuit board 3 according to the embodiment of the present invention where the copper inlay 31 is arranged. In FIG. 3, areas corresponding to the electronic component 2 and the heat radiation pad 21 are indicated by dashed lines. The printed circuit board 3 is provided with electrode pads 32 at locations where the copper inlays 31 are not arranged. connected with At the same time, the copper inlay 31 is connected to the heat dissipation pad 21 and positioned to contact the first electrode 22 .
　図４Ａ、図４Ｂ、図４Ｃは、銅インレイ３１、３１ａ、３１ｂの面積の違いによる放熱性（熱抵抗）の測定値の差を示す比較評価の結果である。図４Ａ、図４Ｂ、図４Ｃにおいて、銅インレイ３１、３１ａ、３１ｂ以外の構成要素は同一である。図４Ａには、本実施例における銅インレイ３１を示す。図４Ｂに示す銅インレイ３１ａの面積は、本実施例と同様に、放熱パッド２１の面積と比較して大きいが、銅インレイ３１ａは第１の電極２２に接触していない。図４Ｃに示す銅インレイ３１ｂの面積は、放熱パッド２１の面積と同等であり、さらに銅インレイ３１ｂは第１の電極２２に接触していない。銅インレイ３１、３１ａ、３１ｂの熱抵抗の測定値は、それぞれ３．２Ｋ／Ｗ、４．１Ｋ／Ｗ、４．５Ｋ／Ｗであり、銅インレイ３１の放熱量が最も多かった。以上の比較評価の結果より、銅インレイ３１は第１の電極２２と接触しており、且つ、銅インレイ３１の面積を放熱パッド２１の面積と比較して大きくすることによって、銅インレイ３１の電気的な性能を悪化させることなくプリント基板３の放熱性を向上させることができる。 FIGS. 4A, 4B, and 4C are comparative evaluation results showing differences in measured values of heat dissipation (thermal resistance) due to differences in the areas of the copper inlays 31, 31a, and 31b. 4A, 4B and 4C, the components are the same except for the copper inlays 31, 31a and 31b. FIG. 4A shows a copper inlay 31 in this embodiment. The area of the copper inlay 31a shown in FIG. 4B is larger than the area of the heat radiation pad 21, as in the present embodiment, but the copper inlay 31a does not contact the first electrode 22. As shown in FIG. The area of the copper inlay 31b shown in FIG. 4C is the same as the area of the heat dissipation pad 21, and the copper inlay 31b does not contact the first electrode 22. As shown in FIG. The measured thermal resistance values of the copper inlays 31, 31a, and 31b were 3.2 K/W, 4.1 K/W, and 4.5 K/W, respectively, and the heat dissipation amount of the copper inlay 31 was the largest. From the results of the above comparative evaluation, the copper inlay 31 is in contact with the first electrode 22, and by increasing the area of the copper inlay 31 compared to the area of the heat dissipation pad 21, the electrical power of the copper inlay 31 is reduced. It is possible to improve the heat dissipation of the printed circuit board 3 without deteriorating the general performance.
＜パワーコンディショナの構成＞
　図５は、本発明の実施例に係る実装基板１を搭載したパワーコンディショナ７の一例を示す断面模式図である。実装基板１は電気機器に搭載されてよく、電気機器は、例えば、パワーコンディショナ７等の電力変換装置、モータ駆動機器、電源機器等でよい。パワーコンディショナ７は、太陽光電池等の電力供給装置（不図示）に接続され、電力供給装置から供給される電力の電圧を昇圧し、交流に変換し、ノイズを除去して波形を整えた後に、負荷（不図示）や連系する電力系統（不図示）に交流電力を供給する。 <Configuration of power conditioner>
FIG. 5 is a cross-sectional schematic diagram showing an example of the power conditioner 7 on which the mounting board 1 according to the embodiment of the present invention is mounted. The mounting board 1 may be mounted on an electric device, and the electric device may be, for example, a power conversion device such as the power conditioner 7, a motor drive device, a power source device, or the like. The power conditioner 7 is connected to a power supply device (not shown) such as a solar cell, boosts the voltage of the power supplied from the power supply device, converts it to alternating current, removes noise, and adjusts the waveform. , AC power is supplied to a load (not shown) and an interconnected power system (not shown).
　パワーコンディショナ７の筐体７１の一側面には、熱伝導性を有する金属ベース７２が設置されている。プリント基板３を接続したヒートシンク４は、ネジ８によって金属ベース７２にネジ締めされる。このようにして電子部品２から発生した熱を吸収したヒートシンク４は、外部の空気中に熱を伝達しやすくなる。金属ベース７２に伝達した熱は、さらに筐体７１に伝達され、外気によって冷却される。 A thermally conductive metal base 72 is installed on one side of the housing 71 of the power conditioner 7 . The heat sink 4 to which the printed circuit board 3 is connected is screwed to the metal base 72 with screws 8 . After absorbing the heat generated from the electronic component 2 in this way, the heat sink 4 easily transfers the heat to the outside air. The heat transferred to the metal base 72 is further transferred to the housing 71 and cooled by the outside air.
　プリント基板３は、スペーサ７３を介してヒートシンク４にネジ締めされる。また、一端がスペーサ７４を介してプリント基板３にネジ締めされ、他端がスペーサ７５を介して金属ベース７２にネジ締めされたベース７６には、端子台７７が固定されて取り付けられる。さらに、プリント基板３の表面と反対側の面には、コネクタ（不図示）を介して制御回路基板（不図示）が取り付けられるようにしてもよい。このようにして、プリント基板３における回路パターンが金属ベース７２に接続される。 The printed circuit board 3 is screwed to the heat sink 4 via spacers 73 . A terminal block 77 is fixedly attached to a base 76 whose one end is screwed to the printed circuit board 3 via a spacer 74 and whose other end is screwed to the metal base 72 via a spacer 75 . Furthermore, a control circuit board (not shown) may be attached to the surface of the printed circuit board 3 opposite to the front surface through a connector (not shown). Thus, the circuit pattern on the printed circuit board 3 is connected to the metal base 72 .
＜付記１＞
　電子素子を含み、放熱性を有する放熱パッド（２１）を有する電子部品（２）と、
　金属を主成分とするインレイ（３１）が内部に配置され、前記放熱パッドと当該インレイとが接続されて前記電子部品が実装されたプリント基板（３）と、を備え、
　前記電子部品は、前記放熱パッドと同電位である、または不使用の電極である第１の電極（２２）を有し、
　前記インレイは、前記第１の電極に接触していることを特徴とする、実装基板（１）。 <Appendix 1>
An electronic component (2) including an electronic element and having a heat dissipation pad (21) having heat dissipation properties;
a printed circuit board (3) in which an inlay (31) mainly composed of metal is arranged, the heat radiation pad and the inlay are connected, and the electronic component is mounted;
The electronic component has a first electrode (22) that has the same potential as the heat dissipation pad or is an unused electrode,
A mounting substrate (1), characterized in that said inlay is in contact with said first electrode.
＜付記２＞
　金属を主成分とするインレイ（３１）が内部に配置され、放熱性を有する放熱パッド（２１）が内部に配置された電子部品（２）を実装可能なプリント基板（３）であって、
　前記インレイは、前記電子部品を実装する際に、前記放熱パッドと接続されるとともに、前記電子部品が有する、前記放熱パッドと同電位である、または不使用の電極である第１の電極（２２）に接触することを特徴とする、プリント基板（３）。 <Appendix 2>
A printed circuit board (3) on which an electronic component (2) can be mounted, in which an inlay (31) mainly made of metal is arranged inside and a heat dissipation pad (21) having heat dissipation properties is arranged inside,
The inlay is connected to the heat radiation pad when the electronic component is mounted, and the first electrode (22) of the electronic component has the same potential as the heat radiation pad or is an unused electrode ), characterized in that it is in contact with the printed circuit board (3).
１　　　　　　　　　　：実装基板
２　　　　　　　　　　：電子部品
２１　　　　　　　　　：放熱パッド
２２　　　　　　　　　：第１の電極
２３　　　　　　　　　：第２の電極
３　　　　　　　　　　：プリント基板
３１、３１ａ、３１ｂ　：銅インレイ
３２　　　　　　　　　：電極パッド
４　　　　　　　　　　：ヒートシンク
５　　　　　　　　　　：はんだ層
６　　　　　　　　　　：放熱シート
７　　　　　　　　　　：パワーコンディショナ
７１　　　　　　　　　：筐体
７２　　　　　　　　　：金属ベース
７３―７５　　　　　　：スペーサ
７６　　　　　　　　　：ベース
７７　　　　　　　　　：端子台
８　　　　　　　　　　：ネジ 1: Mounting board 2: Electronic component 21: Heat dissipation pad 22: First electrode 23: Second electrode 3: Printed circuit board 31, 31a, 31b: Copper inlay 32: Electrode pad 4: Heat sink 5: Solder layer 6: Heat dissipation Sheet 7 : Power conditioner 71 : Housing 72 : Metal base 73-75 : Spacer 76 : Base 77 : Terminal block 8 : Screw

Claims (10)

  1. 　電子素子を含み、放熱性を有する放熱パッドを有する電子部品と、
    　金属を主成分とするインレイが内部に配置され、前記放熱パッドと当該インレイとが接続されて前記電子部品が実装されたプリント基板と、を備え、
    　前記電子部品は、前記放熱パッドと同電位である、または不使用の電極である第１の電極を有し、
    　前記インレイは、前記第１の電極に接触していることを特徴とする、実装基板。     An electronic component including an electronic element and having a heat dissipation pad having heat dissipation properties;
    a printed circuit board on which an inlay containing metal as a main component is arranged inside, the heat dissipation pad and the inlay are connected, and the electronic component is mounted;
    The electronic component has a first electrode that has the same potential as the heat dissipation pad or is an unused electrode,
    The mounting board, wherein the inlay is in contact with the first electrode.
  2. 　放熱性を有し、接合材を介して前記プリント基板が接合された冷却構造部をさらに有する、請求項１に記載の実装基板。 The mounting board according to claim 1, further comprising a cooling structure part having heat dissipation properties and having the printed board bonded thereto via a bonding material.
  3. 　前記電子部品は、前記第１の電極以外に、前記放熱パッドと電位が異なる第２の電極を有することを特徴とする、請求項１または２に記載の実装基板。 3. The mounting board according to claim 1, wherein the electronic component has a second electrode having a potential different from that of the heat dissipation pad, in addition to the first electrode.
  4. 　前記インレイの面積は、前記放熱パッドの面積と比較して大きいことを特徴とする、請求項１から３のいずれか一項に記載の実装基板。 The mounting board according to any one of claims 1 to 3, wherein the area of the inlay is larger than the area of the heat dissipation pad.
  5. 　前記インレイは、複数の前記電子部品の各々の前記放熱パッドと接続されており、各々の前記第１の電極に接触していることを特徴とする、請求項１から４のいずれか一項に記載の実装基板。 5. The inlay according to any one of claims 1 to 4, wherein the inlay is connected to the heat dissipation pad of each of the plurality of electronic components and is in contact with the first electrode of each. Mounting board as described.
  6. 　電力供給装置から供給される電力の電力変換を行う電気機器であって、
    　請求項１から５のいずれか一項に記載の実装基板を搭載した電気機器。     An electrical device that performs power conversion of power supplied from a power supply device,
    An electrical device on which the mounting board according to any one of claims 1 to 5 is mounted.
  7. 　金属を主成分とするインレイが内部に配置され、放熱性を有する放熱パッドが内部に配置された電子部品を実装可能なプリント基板であって、
    　前記インレイは、前記電子部品を実装する際に、前記放熱パッドと接続されるとともに、前記電子部品が有する、前記放熱パッドと同電位である、または不使用の電極である第１の電極に接触することを特徴とする、プリント基板。     A printed circuit board capable of mounting an electronic component in which an inlay mainly composed of metal is arranged inside and a heat dissipation pad having heat dissipation is arranged inside,
    The inlay is connected to the heat dissipation pad when the electronic component is mounted, and is in contact with a first electrode of the electronic component that has the same potential as the heat dissipation pad or is an unused electrode. A printed circuit board characterized by:
  8. 　前記電子部品に設けられた、前記放熱パッドと電位が異なる第２の電極を接続する電極パッドを備え、
    　前記電極パッドは、前記電極パッドに前記電子部品の前記第２の電極が接続された際に、前記インレイが、前記放熱パッドと接続されるとともに前記第１の電極に接触するような位置に配置されたことを特徴とする、請求項７に記載のプリント基板。     an electrode pad provided on the electronic component for connecting a second electrode having a potential different from that of the heat dissipation pad;
    The electrode pad is arranged at a position such that when the second electrode of the electronic component is connected to the electrode pad, the inlay is connected to the heat dissipation pad and is in contact with the first electrode. 8. The printed circuit board according to claim 7, characterized in that it is
  9. 　前記インレイの面積は、前記放熱パッドの面積と比較して大きいことを特徴とする、請求項７または８に記載のプリント基板。 The printed circuit board according to claim 7 or 8, wherein the area of the inlay is larger than the area of the heat dissipation pad.
  10. 　前記インレイは、複数の前記電子部品を実装する際に、複数の前記電子部品の各々の前記放熱パッドと接続され、各々の前記第１の電極に接触することを特徴とする、請求項７から９のいずれか一項に記載のプリント基板。 From claim 7, wherein the inlay is connected to the heat radiation pad of each of the plurality of electronic components and is in contact with each of the first electrodes when the plurality of electronic components are mounted. 10. The printed circuit board according to any one of 9.
PCT/JP2022/039981 2021-11-19 2022-10-26 Mounting board and electrical equipment having mounting board installed thereon WO2023090102A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002076215A (en) * 2000-08-29 2002-03-15 Sony Corp Semiconductor device package and its manufacturing method
JP2003338577A (en) * 2002-05-21 2003-11-28 Murata Mfg Co Ltd Circuit board device
JP2009231729A (en) * 2008-03-25 2009-10-08 Nec Corp Semiconductor device
JP2017520902A (en) * 2014-06-23 2017-07-27 サムソン エレクトロ−メカニックス カンパニーリミテッド． Circuit board and circuit board assembly

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002076215A (en) * 2000-08-29 2002-03-15 Sony Corp Semiconductor device package and its manufacturing method
JP2003338577A (en) * 2002-05-21 2003-11-28 Murata Mfg Co Ltd Circuit board device
JP2009231729A (en) * 2008-03-25 2009-10-08 Nec Corp Semiconductor device
JP2017520902A (en) * 2014-06-23 2017-07-27 サムソン エレクトロ−メカニックス カンパニーリミテッド． Circuit board and circuit board assembly

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