JP3281220B2 - Circuit module cooling system - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit module having a circuit board provided with wiring and a semiconductor chip mounted on the circuit board, and more particularly to an apparatus for cooling a semiconductor chip which generates heat during operation. .

[0002]

2. Description of the Related Art Recently, a portable computer of a book type or a notebook type has been developed to be more compact and more sophisticated. For this reason, even for an LSI package mounted on a computer, the capacity and the number of functions are increasing. The increase in the capacity and the number of functions of the LSI package leads to an increase in chip size and an increase in the number of pins. In order to cope with the increase in the number of pins while suppressing the area occupied by the LSI package, it is necessary to reduce the lead pitch of the LSI package.

Recently, a TCP (tape carrier package) has attracted attention as a compact package that can be adapted to increase the number of pins. TCP has a resin film having leads and a semiconductor chip supported by the resin film. In this TCP, the tip of the lead is led out to the outer peripheral edge of the resin film, and the tip of the lead is soldered to the connection pad on the circuit board.

In this type of TCP, the semiconductor chip is not molded with resin, and the semiconductor chip is exposed to the outside. Therefore, TCP is P
Although the mechanical strength is lower than that of a GA (pin grid array) and the amount of heat generated during operation is large, it is difficult to directly attach a heat sink having a large number of radiation fins. Therefore, when housing the heat-producing TCP together with the circuit board in the housing of the computer, it is important to reduce the thermal resistance of the TCP.

[0005] Japanese Patent Publication No. 5-52079 discloses a means for achieving a low thermal resistance of a semiconductor chip having a large calorific value. In this prior art, an electronic device including a semiconductor chip is mounted on a surface of a circuit board. The circuit board has one relatively large through hole at a portion facing the electronic device.

[0006] A cooling plate is disposed on the back side of the circuit board. The cooling plate has a separate or integral projection fitted into the through hole. This protrusion is
It is made of a thermally conductive material such as copper or brass. The tip surface of the projection is in contact with the back surface of the electronic device without any gap, and the contact allows heat of the electronic device to escape to the cooling plate through the projection.

[0007]

However, according to the above prior art, since the convex portion of the cooling plate is in contact with the plating layer covering the inner surface of the through hole, the heat transmitted from the electronic device to the convex portion is reduced. It is transmitted directly to the circuit board through the plating layer. Moreover, the diameter of the through hole is much smaller than the planar shape of the electronic device, and most of the back surface of the electronic device is in contact with the surface of the circuit board via a layer of solder or a thermal compound.

[0008] Therefore, the heat of the electronic device is more easily transmitted to the circuit board, and the heat of the electronic device tends to accumulate on the circuit board. Then, since a large number of semiconductor chips and circuit components are mounted on the circuit board in addition to the electronic device that generates a large amount of heat, the heat of the electronic device is transmitted to these semiconductor chips and circuit components through the circuit board. I will. For this reason, there is a problem that other semiconductor chips and circuit components located around the electronic device have a large thermal effect.

Further, as described above, since the through hole has a diameter much smaller than the planar shape of the electronic device, the contact area between the projection and the electronic device is small, and the heat of the electronic device is efficiently transferred to the projection. I can't tell you well. Therefore, despite the configuration in which the heat conduction path from the electronic device to the cooling plate is formed, the heat dissipation effect of the electronic device becomes insufficient, and there is still room for improvement in reducing the thermal resistance of the electronic device. .

The present invention has been made in view of the above circumstances, and efficiently dissipates heat of a semiconductor chip to the outside.
Can reduce the thermal effect on the circuit board.
It is an object of the present invention to provide a cooling device for a circuit module that can be used .

[0011]

[0012]

In order to achieve the above object, a circuit module according to claim 1 has a first surface having connection pads and a second surface located opposite to the first surface. And a semiconductor chip connected to connection pads of the circuit board via leads and generating heat during operation.

The semiconductor chip has a first chip surface having a connection portion of the lead, and a second chip surface located on the opposite side of the first chip surface. Is mounted on the circuit board with the chip surface of the circuit board facing the first surface of the circuit board, and the circuit board has an opening shape larger than that of the semiconductor chip in a portion facing the semiconductor chip. A hole on a second surface of the circuit board opposite to the semiconductor chip,
A heat conductive heat dissipating member having a convex portion that enters the hole is disposed, and the convex portion of the heat dissipating member is provided on the second side of the semiconductor chip.
The second chip has an area larger than the chip surface of the second chip.
It includes a contact surface which is thermally connected to the flop surface, also, the circuit
The semiconductor chip and the lead are provided on a first surface of a substrate.
Thermally conductive cover for covering the connection part with the connection pad
And place the cover and the first chip of the semiconductor chip.
By interposing a heat conducting member between the
Insert the semiconductor chip between the cover and the contact surface of the convex part.
It is characterized by being sandwiched .

According to the second aspect , the heat dissipating member and the circuit
Between the circuit board and the inner peripheral surface of the hole and the convex portion.
In addition, a gap for heat insulation is formed in each of them.

According to the third aspect , the cover and the heat radiation
The members are opposed to each other with the circuit board
Then, a fastening member that penetrates the circuit board in the thickness direction
Characterized by being connected to each other via

According to claim 4 , the circuit board has a
A ground wiring layer on the second surface;
Is made of a conductive metal material.
The ground wiring layer is in contact with the material.

According to the fifth aspect, the contact surface of the projection and the upper surface
The second chip surface of the semiconductor chip is a conductive adhesive.
Are adhered to each other via a .

[0018] To achieve the above object, according to claim 6
The circuit module described in (1) above includes a circuit board including a first surface having a connection pad and a second surface located on the opposite side of the first surface, and a lead connected to the connection pad of the circuit board. A semiconductor chip that is connected and generates heat during operation.

The semiconductor chip has a first chip surface having a connection portion of the lead, and a second chip surface located on the opposite side of the first chip surface. The circuit board is mounted on the circuit board with the chip surface facing the first surface of the circuit board, and the circuit board has a hole having a larger opening shape than the semiconductor chip in a mounting portion of the semiconductor chip. A plurality of fitting holes located around the hole, and a heat-radiating member having thermal conductivity is arranged on a second surface of the circuit board opposite to the semiconductor chip. The member has a convex portion that enters the hole and a plurality of legs that are press-fitted into the fitting hole, and the convex portion has an area larger than a second surface of the semiconductor chip, This second chip surface is thermally
Including a flat contact surface connected to , between the heat dissipation member and the circuit board and between the inner peripheral surface of the hole and the convex portion,
Each is characterized by forming a heat shielding gap.

According to claim 7, said circuit board has a ground wiring layer on the second surface, also the heat dissipation member is constituted by a metal material having conductivity, the heat radiating member The invention is characterized in that the ground wiring layers are in contact with each other.

According to an eighth aspect, the contact surface of the projection and the second surface of the semiconductor chip are bonded to each other via a conductive adhesive.

According to a ninth aspect of the present invention, the heat radiating member is provided with a large number of cooling fins protruding toward the side opposite to the convex portion.

According to the tenth aspect , the circuit board has a plurality of
A multi-layer structure in which a number of wiring layers and insulating layers are alternately stacked.
The fitting hole of the circuit board is
Characterized in that it is arranged between the pad and the hole .

According to claim 11 , the circuit board is insulated.
With a ground wiring layer covered by an edge layer
The inner surface of the fitting hole is electrically connected to the ground wiring layer.
Covered by a conductive layer connected to the
The heat radiating member is made of a conductive metal material.
Is characterized in that the legs of the heat radiation member are pressed against the conductive layer .

According to the twelfth aspect , the first part of the circuit board is provided.
Surface of the semiconductor chip and the leads
A cover for covering a connection portion with the node is provided.

According to a thirteenth aspect, the cover is provided with a heat transfer member.
It is made of conductive metal material and
Being thermally connected to the first surface of the semiconductor chip
It is characterized by.

[0027]

[0028]

[0029]

[0030]

[0031]

[0032]

[0033]

According to the structure of the first aspect, the semiconductor chip is mounted on the circuit board in a so-called face-up posture in which the first chip surface on which the leads are continuous faces in a direction opposite to the circuit board. Then, when the semiconductor chip generates heat in accordance with the operation of the semiconductor chip, the heat of the semiconductor chip is released from the second chip surface to the heat dissipation member through the convex portion. In this case, the second chip surface of the semiconductor chip that is in contact with the contact surface of the projection has no lead connection portion.
Up to every corner of the chip surface can be used as a flat heat conducting surface. At the same time, since the contact surface of the projection has a larger area than the second chip surface of the semiconductor chip, heat of the semiconductor chip is transmitted to the projection from the entire surface of the second chip.

Therefore, the contact area between the semiconductor chip and the projection increases, and the heat of the semiconductor chip can be efficiently transmitted to the heat radiating member. In addition, the semiconductor chip is
Since it is sandwiched between the contact surface and the heat conductive cover,
The first chip surface of the conductive chip and the cover are thermally connected.
It is. Therefore, heat of the semiconductor chip is transferred to the first chip surface.
From the cover through the heat conducting member.
Heat of the semiconductor chip is transferred to both the first and second chip surfaces.
Can be released from Therefore, the release of the semiconductor chip
The thermal properties are improved, and the heat of this semiconductor chip is transmitted to the circuit board.
Becomes difficult.

According to the configuration of claim 2, the hole of the circuit board is
The gap between the inner peripheral surface and the projection, the heat radiation member and the circuit board
Gaps function as heat insulating layers. for that reason,
It becomes difficult for the heat of the semiconductor chip transmitted to the projections and the heat radiation member to be directly transmitted to the circuit board, and it is possible to prevent the heat from being trapped inside the circuit board.

According to the third aspect of the present invention, the cover and the radiator
By joining with the material, the contact surface of the convex part and the heat conductive part
The semiconductor chip can be sandwiched between the material and the material. this
Therefore, the second chip surface of the semiconductor chip is
Pressed, and the contact between these semiconductor chips and heat dissipation member
The condition becomes good.

According to the structure of claim 4, the semiconductor chip is
Ground wiring layer of circuit board via convex part and heat dissipation member
Is electrically connected to Therefore, the heat radiation member
And grounding of the semiconductor chip while attaching the cover
And a special grounding operation can be omitted.

According to the fifth aspect of the present invention, the second chip surface of the semiconductor chip is firmly and closely contacted with the contact surface of the projection without any gap, and the heat of the semiconductor chip can be efficiently released to the projection.

[0039]

[0040]

According to the sixth aspect of the present invention, the heat radiating member is fixed to the circuit board by press-fitting its legs into the fitting holes of the circuit board, and the heat radiating member is fixed to the circuit board. No special screws are required for the operation. Further, the semiconductor chip is mounted on the circuit board in a so-called face-up posture in which the first chip surface on which the leads are continuous faces in a direction opposite to the circuit board. Therefore, when the heat radiating member is fixed to the circuit board, the contact surface of the convex portion becomes the second surface of the semiconductor chip.
Is thermally connected to the chip surface. Then, when the semiconductor chip generates heat in accordance with the operation of the semiconductor chip, the heat of the semiconductor chip is released from the contact surface to the heat radiating member through the convex portion. In this case, since there is no lead connection portion on the second chip surface of the semiconductor chip, every corner of the second chip surface can be used as a flat heat conducting surface. In addition, the contact surface of the projection is the second surface of the semiconductor chip.
Therefore, the heat of the semiconductor chip is transmitted from the entire surface of the second chip surface to the projection.

Further, since there are gaps between the projections and the holes of the circuit board and between the heat radiation member and the circuit board, the air in these gaps functions as a heat insulating layer. Therefore, the heat of the semiconductor chip transmitted to the protrusions and the heat dissipation member is
It is difficult to directly transfer the heat to the circuit board, and it is possible to prevent heat from accumulating inside the circuit board.

In the structure of the seventh aspect , when the leg of the heat radiating member is press-fitted into the fitting hole of the circuit board, the semiconductor chip is electrically connected to the ground wiring layer of the circuit board via the projection and the heat radiating member. . Therefore, the semiconductor chip is grounded at the same time when the heat radiating member is attached to the circuit board, and a special grounding operation is not required.

According to the structure of the eighth aspect, the second chip surface of the semiconductor chip is firmly and closely contacted with the contact surface of the convex portion.
And, it is possible to miss the heat of the semiconductor chip to efficiently protrusion.

According to the ninth aspect , the heat radiation area of the heat radiation member increases due to the presence of the heat radiation fins. For this reason,
The heat dissipation of the heat dissipation member is improved, and the heat of the semiconductor chip can be efficiently released to the outside.

According to the tenth aspect , the region between the connection pad and the hole in the circuit board is opposed to the lead, and there is usually no wiring layer in this region. The fitting hole can be opened in the circuit board without receiving. Conversely, since there are no fitting holes around the connection pads, the degree of freedom in arranging the wiring layers on the circuit board increases.

According to the eleventh aspect , when the leg of the heat radiating member is pressed into the fitting hole, the leg electrically contacts the conductive layer, and the semiconductor chip is connected to the circuit board via the leg and the conductive layer. It is electrically connected to the ground wiring layer. Therefore, the semiconductor chip is grounded at the same time when the heat radiating member is attached to the circuit board, and a special grounding operation is not required.

According to the twelfth aspect of the present invention, since the cover bears an external impact, it is possible to sufficiently ensure the impact resistance of the bare semiconductor chip having a low mechanical strength.
According to the configuration of claim 13 , since the first chip surface of the semiconductor chip and the cover are thermally connected via the heat transfer sheet, heat of the semiconductor chip can be released from the first chip surface to the cover. Thus, heat can be radiated from both the first and second chip surfaces of the semiconductor chip. Moreover,
When an external impact is applied to the cover, this impact can be received by the heat transfer sheet,
This impact is absorbed and reduced by the deformation of the heat transfer sheet.
Therefore, no impact is directly applied to the semiconductor chip, and the impact resistance of the semiconductor chip can be sufficiently ensured.

[0049]

[0050]

[0051]

[0052]

[0053]

[0054]

[0055]

[0056]

[0057]

[0058]

[0059]

[0060]

[0061]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIGS. 1 to 7 applied to a book-type portable computer. FIG. 5 shows an A4-size book-type portable computer 1. This computer 1
Has a box-shaped housing 2 and a flat panel display unit 3 supported by the housing 2. The housing 2 is divided into a lower housing 4 and an upper housing 5. The lower housing 4 and the upper housing 5 are made of, for example, a synthetic resin material such as an ABS resin.

The housing 2 has a bottom wall 6a, an upper wall 6b, and four side walls 6c connected to both of the walls 6a, 6b. A keyboard 8 is provided on the front half of the upper wall 6b of the housing 2.
Is arranged. A hollow protrusion 9 is arranged at the rear end of the upper wall 6b. The convex portion 9 extends in the width direction of the housing 2, and display support portions 10 a and 10 b are formed on both left and right ends of the convex portion 9.

The display unit 3 includes a flat box-shaped housing 12 and a liquid crystal display 13 housed inside the housing 12. The housing 12 has a pair of pivot legs 14a and 14b. These pivoting legs 14a, 14b are rotatably supported by the display supporting portions 10a, 10b via hinge devices (not shown).

As shown in FIG. 7, a frame 16 is housed inside the lower housing 4. Frame 16
The first support 17 supports a hard disk drive or a floppy disk drive (not shown), and the second support 19 supports the circuit module 11 according to the present invention.
Are integrally provided. The frame 16 is made of a thermally conductive magnesium alloy or aluminum alloy, and has a size such that it fits tightly inside the lower housing 4.

As shown in FIG. 6, a metal shield plate 15 is attached to the second support 19 of the frame 16. The shield plate 15 is used for the circuit module 1
1 and the upper wall 6b of the housing 2, and covers the circuit module 11 from above.

The circuit module 11 has a rectangular circuit board 18. The circuit board 18
A front surface 18a serving as a first surface and a back surface 18 serving as a second surface
b. As shown in FIG. 4, the circuit board 18 is supported by the second support 19 in a posture parallel to the bottom wall 6a and the top wall 6b of the housing 2. The second support 19 has a wall 20 facing the right end of the back surface 18 b of the circuit board 18.

As shown in FIG. 1, the circuit board 18 has a multilayer structure in which a plurality of signal wiring layers 21 and insulating layers 22 are alternately laminated, and one of the signal wiring layers 21 18 on the surface 18a. The ground wiring layer 23 is disposed on the back surface 18b of the circuit board 18.

Front surface 18 a and back surface 18 of circuit board 18
In b, a plurality of connectors 24 and a plurality of QFPs (quad flat packages) 25 as LSI packages are mounted. A TCP (tape carrier package) 26 is mounted on the right end of the surface 18a of the circuit board 18. The TCP 26 generates an extremely large amount of heat during operation in order to increase the speed and increase the capacity in response to a demand for more versatile functions of the computer 1.

As shown in FIGS. 1 and 3, the TCP 26
A carrier 27 made of a flexible resin film and a semiconductor chip 28 supported by the carrier 27 are provided. The carrier 27 has four edges 27 orthogonal to each other.
It has a rectangular frame shape having a to 27d. A large number of leads 30 made of copper foil are formed on the carrier 27 by etching. The tips of the leads 30 are led out from the edges 27 a to 27 d of the carrier 27.

The semiconductor chip 28 has a front surface 28a and a back surface 2a.
8b. A plurality of bumps 31 are formed on the outer periphery of the surface 28a of the semiconductor chip 28, and the base ends of the leads 30 are bonded to these bumps 31. For this reason, in the case of the present embodiment, the first surface 28 a having the connection portion of the lead 30
The lead 30 and the bump 31
Is sealed with a potting resin 32. This potting resin 32 is used for the semiconductor chip 2
8 is located on the surface 28a.

The back surface 28b of the semiconductor chip 28
Without being covered by the potting resin 32,
It is exposed to the outside as it is. This semiconductor chip 28
Conductive plating is applied to the entire surface of the back surface 28b.

As shown in FIG. 1, such a TCP 26 is formed on the surface 2 of the semiconductor chip 28 to which the leads 30 are connected.
8a is mounted on the circuit board 18 in a so-called face-up posture with the direction 8a facing away from the circuit board 18.
For this reason, the back surface 28b of the semiconductor chip 28 is
18 and faces the surface 18a of the back surface 28b
Is a second chip surface located on the opposite side of the connection portion of the lead 30.

The tips of the leads 30 are soldered to a plurality of connection pads 33 on the circuit board 18. The connection pads 33 are arranged on the surface 18 a of the circuit board 18 along the edges 27 a to 27 d of the carrier 27. These connection pads 33 are electrically connected to desired signal wiring layers 21 of the circuit board 18.

As shown in FIG. 3, the circuit board 18 is provided with a square hole 35 at a position where the TCP 26 is mounted. The hole 35 faces the semiconductor chip 28 and is located at a portion surrounded by the connection pad 33. The hole 35 has a similar shape to the semiconductor chip 28, and has an opening area larger than the planar shape of the semiconductor chip 28.

As shown in FIG. 1, the signal wiring layer 21 of the circuit board 18 does not exist in the mounting area of the TCP 26, and the mounting area of the TCP 26 in the circuit board 18 is only the insulating layer 22. ing. Therefore, the hole 35
Are formed in the insulating layer 22.

A radiator 40 is attached to a portion of the circuit board 18 where the TCP 26 is mounted. The radiator 40
Heat radiating member 41 arranged on back surface 18b of circuit board 18
And a cover 42 arranged on the surface 18a of the circuit board 18.
It is equipped with a door. The heat dissipating member 41 and the cover 42
Cooperate with each other to sandwich the circuit board 18 therebetween.

The heat dissipating member 41 is made of a metal material having excellent thermal conductivity such as aluminum alloy and having conductivity. The heat radiating member 41 is provided in the hole 35.
It is in the form of a flat rectangular plate having a plane shape much larger than that of the first embodiment. The heat dissipating member 41 has a flat upper surface 41 a facing the back surface 18 b of the circuit board 18,
1a and a flat lower surface 41b which is parallel to the lower surface 1b.

At the four corners of the upper surface 41a, boss portions 44 each having a screw hole 43 are integrally provided.
Each boss portion 44 has a flat support surface 44a in which a screw hole 43 is opened. The support surfaces 44a are located on the same plane, and are respectively provided on the back surface 18 of the circuit board 18.
b is in surface contact.

Further, the circuit board 18 has a plurality of mounting holes 45 at a portion in contact with the boss 44. The mounting holes 45 are arranged outside the mounting area of the TCP 26, and each mounting hole 45 is connected to the screw hole 43.

At the center of the upper surface 41a of the heat radiating member 41,
A seat 47 is protruded. The seat portion 47 has a flat seating surface 47a facing the hole 35, and the seating surface 47a
Has an area larger than the opening area of the hole 35.
The seat surface 47a is provided on the support surface 44a of the boss 44.
The outer periphery of the seat surface 47a is in contact with the back surface 18b of the circuit board 18. Therefore, the heat radiating member 41 closes the hole 35 from the direction of the back surface 18 b of the circuit board 18.

In this case, the ground wiring layer 23 on the back surface 18b of the circuit board 18 has holes 35 as shown in FIGS.
Of the ground wiring layer 2
3 is in contact with the seat surface 47a of the seat portion 47. When the heat radiating member 41 is overlaid on the back surface 18b of the circuit board 18, the upper surface 41a of the heat radiating member 41
4 and the seat 47 are spaced apart from the rear surface 18b of the circuit board 18 by the height of the protrusion.
1a, a first gap 48 is formed.

At the center of the seating surface 47a, a projection 50 is integrally provided. The convex portion 50 enters inside the hole 35. A second gap 51 that is continuous in the circumferential direction is formed between the outer peripheral surface of the projection 50 and the inner peripheral surface of the hole 35.

The tip of the projection 50 forms a flat contact surface 50a. The contact surface 50a is exposed on the surface 18a of the circuit board 18 through the hole 35. The contact surface 50a has a larger area than the back surface 28b of the semiconductor chip 28, and is flush with the front surface 18a of the circuit board 18. Here, the term “level” includes some unevenness due to a manufacturing error, and it does not matter at all if the contact surface 50a slightly protrudes from the surface 18a or is slightly depressed.

In the case of this embodiment, the projection 50
The back surface 28b of the semiconductor chip 28 is adhered to the contact surface 50a of the semiconductor chip 28 without a gap through a conductive adhesive 52 as a die attach material. Therefore, the protrusion 50 and the semiconductor chip
28 is thermally connected via an adhesive 52.

On the other hand, the cover 42 is
A substantially square panel 53 having substantially the same size as 1;
A support frame 54 made of synthetic resin adhered to the lower surface of the panel 53. The panel 53 is made of a metal material having excellent thermal conductivity such as an aluminum alloy, for example, and the center of the lower surface of the panel 53 faces the surface 28a of the semiconductor chip 28. The support frame 54 extends along the periphery of the panel 53, and the support frame 54
The connection between the lead 30 of the CP 26 and the connection pad 33 is surrounded.

The panel 53 has insertion holes 55 at four corners thereof. The insertion hole 55 is located outside the mounting area of the TCP 26, and is connected to the screw hole 43 of the heat radiation member 41 via the mounting hole 45 of the circuit board 18.

A screw 56 as a fastening member is inserted into each of the insertion holes 55. The screw 56 is attached to the mounting hole 4
5, penetrates the circuit board 18 in the thickness direction, and its tip is screwed into the screw hole 43. By this screwing, the cover 42 and the heat radiating member 41 are tightened in a direction approaching each other to sandwich the circuit board 18, and the TCP 26 is accommodated between the cover 42 and the heat radiating member 41. .

A soft heat transfer sheet 58 is arranged between the panel 53 and the surface 28a of the semiconductor chip 28. The heat transfer sheet 58 is a rubber-like elastic body obtained by adding alumina to a silicone resin, for example, and has thermal conductivity. The heat transfer sheet 58 is sandwiched between the panel 53 and the surface 28a of the semiconductor chip 28 by tightening the screws 56, and thermally connects the panel 53 and the semiconductor chip 28. I have.

As shown in FIG. 4, the heat radiating member 41 of the heat radiator 40 is located directly above the wall portion 20 of the frame 16. On the upper surface of the wall part 20, a seat part 60 is integrally provided. As shown in FIG. 6, the seat portion 60 has a flat seat surface 60a, and the lower surface 41b of the heat radiation member 41 is in contact with the seat surface 60a. The seat 60 and the heat radiating member 4
1 is located directly below the semiconductor chip 28. The cover 42 of the radiator 40 is located directly below the shield plate 15. This cover 42
Also has a function of protecting the TCP 26 from impact.

In such a configuration, the computer 1
During the operation, the semiconductor chip 28 of the TCP 26 generates heat. In this case, a radiator 40 sandwiching the TCP 26 is attached to the circuit board 18 on which the TCP 26 is mounted, and a radiator 41 of the radiator 40
Has a convex portion 50 that enters the hole 35 of FIG. This convex part 5
The contact surface 50a at the leading end of the circuit board 18 is
And the semiconductor chip 2 is exposed on the contact surface 50a.
The back surface 28b of the substrate 8 is bonded via a heat conductive adhesive 52.

From this, the heat of the semiconductor chip 28 is
The heat is released from the contact surface 50a to the heat radiating member 41 through the convex portion 50, and a heat conduction path is formed so as to be directly connected from the semiconductor chip 28 to the heat radiating member 41.

According to the above configuration, the contact surface 50a
The lead 3 is provided on the back surface 28b of the semiconductor chip 28 in contact with
Since there is no connection portion of No. 0, all the corners of the back surface 28b can be used as flat heat conducting surfaces. At the same time, the contact surface 50a of the projection 50 is
8 has a larger area than the rear surface 28b, so that the heat of the semiconductor chip 28 is transmitted to the projection 50 from the entire surface of the rear surface 28b.

At this time, the heat radiating member 41 cooperates with the cover 42.
The semiconductor chip 28 is sandwiched between the contact surface 50 a of the heat dissipating member 41 and the heat transfer sheet 58 because the circuit board 18 is interposed therebetween. Therefore, the semiconductor chip 2
8 receives a force pressed against the contact surface 50a of the convex portion 50, and the semiconductor chip 28 and the contact surface 50a are pressed.
The contact state with a is improved.

In particular, in this embodiment, since the semiconductor chip 28 and the projection 50 are bonded to each other via the conductive adhesive 52, the contact portions between these two parts are shifted or the heat conduction is prevented therefrom. No gap is generated, and heat conduction from the semiconductor chip 28 to the heat dissipation member 41 can be efficiently performed.

Further, since the heat dissipating member 41 is in surface contact with the seat portion 60 of the metal frame 16, the heat dissipating member 4
The heat transferred to 1 is transmitted to the frame 16 through the seat 60 and is spread over a wide area of the frame 16.

Therefore, even in the case of the TCP 26, which is conventionally difficult to cool by the general radiating fins, the heat of the semiconductor chip 28 can be efficiently released to the outside.
Low thermal resistance of the TCP 26 can be realized.

Further, the heat transfer sheet 58 in contact with the surface 28a of the semiconductor chip 28 and the panel 53 of the cover 42
Since both have thermal conductivity, the heat of the semiconductor chip 28 is also diffused to the panel 53 via the heat transfer sheet 58, and the heat dissipation path is also provided on the side of the semiconductor chip 28 opposite to the circuit board 18. Can be secured. Therefore, the heat of the semiconductor chip 28 is transferred not only to the back surface 28b but also to the front surface 2b.
8a can escape to the outside, and the heat radiation effect of the TCP 26 can be further enhanced.

Further, according to the above configuration, the first space is provided between the back surface 18b of the circuit board 18 and the upper surface 41a of the heat radiating member 41 and between the inner circumferential surface of the hole 35 and the outer circumferential surface of the projection 50, respectively.
Since the second gaps 48 and 51 exist, the air in the gaps 48 and 51 functions as a heat insulating layer. Therefore, it is difficult for the heat transmitted to the protrusions 50 and the heat radiation member 41 to be directly transmitted to the circuit board 18, and it is possible to prevent the heat from being trapped inside the circuit board 18.

Therefore, it is possible to prevent the heat of the TCP 26 from being transmitted to other circuit components on the circuit board 18, for example, the QFP 25 and the connector 24, and it is possible to minimize the thermal influence on these other circuit components.

In addition, in the case of the above configuration, when the circuit board 18 is sandwiched between the heat radiating member 41 and the cover 42, the heat radiating member 4
The first bearing surface 47a contacts the ground wiring layer 23 on the back surface 18b of the circuit board 18. Since the heat dissipating member 41 has conductivity, the semiconductor chip 28 and the ground wiring layer 2
3 can be electrically connected using the heat dissipation member 41. Therefore, the semiconductor chip 28 can be grounded at the same time that the heat radiating member 41 is attached to the circuit board 18, and a special grounding operation is not required.

On the other hand, the circuit board 1 on which the TCP 26 is mounted
No. 8 generally has poor dimensional accuracy, and in particular, its thickness tends to vary from product to product. Therefore, even if the heat dissipating member 41 including the convex portion 50 is finished to a predetermined size, the convex portion 50 penetrates the circuit board 18 in the thickness direction, so that the contact surface 50a of the convex portion 50 There may be a risk of projecting beyond the range of the error or of retracting inside the hole 35.

However, the semiconductor chip 28 of the TCP 26
Is supported by the flexible carrier 27, the contact surface 50a of the convex portion 50 in contact with the semiconductor chip 28 protrudes greatly from the surface 18a of the circuit board 18, or is retracted inside the hole 35, and so on. Even if the position of the semiconductor chip 28 on the substrate 18 fluctuates, the carrier 27 is elastically deformed and absorbs the dimensional error of the circuit board 18.

Therefore, the semiconductor chip 28 and the lead 3
0 and the connection between the lead 30 and the connection pad 33 are not subjected to excessive force.
The reliability of connection with the CP 26 can be sufficiently ensured.

Note that the present invention is not limited to the first embodiment, and FIG. 8 shows a second embodiment of the present invention. In the second embodiment, the back surface 28b of the semiconductor chip 28 is brought into direct contact with the contact surface 50a of the convex portion 50 without using an adhesive, and other configurations are the same as those of the first embodiment. It is.

In such a configuration, the heat dissipating member 41
The convex portion 50 sandwiches the semiconductor chip 28 in cooperation with the heat transfer sheet 58 on the cover 42 side, so that the contact surface 50a of the convex portion 50 comes into contact with the back surface 28b of the semiconductor chip 28 without any gap. Therefore, the protrusion 5
The heat of the semiconductor chip 28 can be efficiently released to the heat dissipating member 41.

FIG. 9 shows a third embodiment which is an extension of the first embodiment. The third embodiment is different from the first embodiment in the shape of the heat radiating member 41, and the other configuration is the same as the first embodiment.

[0107] heat dissipating member 41 of the third embodiment is provided with integrally multiple radiating fins 71 on the underside 41 b.
The heat radiation fins 71 are located on the lower surface 41 b of the heat radiation member 41 on the side opposite to the convex portions 50. The heat radiation fins 71 are exposed in a space between the wall 20 of the frame 16 and the circuit board 18 inside the housing 2.

According to such a configuration, the semiconductor chip 2
Since the heat dissipating member 41 to which the heat of No. 8 is transmitted has the heat dissipating fins 71, the surface area of the heat dissipating member 41 increases accordingly. In this case, if blowing actively cooling air in the space portion where the heat radiation fins 71 are exposed, the heat radiating fins 71
Can further enhance the heat dissipation effect, which is more convenient in realizing a low thermal resistance of the TCP 26.

FIGS. 10 to 12 show a fourth embodiment of the present invention. In the fourth embodiment, the structure mainly for attaching the radiator 40 to the circuit board 18 is the same as that of the first embodiment.
The third embodiment is different from the first embodiment, and the other configuration is the same as that of the first embodiment. Therefore, in the fourth embodiment,
The same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

As shown in FIG. 10 and FIG.
Each of the four support surfaces 44a is integrally provided with a fitting projection 81. Each fitting projection 81 has a prismatic shape. Further, four fitting holes 82 are opened in the circuit board 18. The fitting hole 82 is formed around the hole 35.
It is located between adjacent connection pads 33. The fitting holes 82 have a square hole shape, and the fitting projections 81 are fitted into the fitting holes 82 without gaps. By this fitting, the heat radiation member 41 is held on the back surface 18 b of the circuit board 18, and the convex portion 50 enters the hole 35.

The lower surface of the support frame 54 of the cover 42 is fixed to the front surface 18 a of the circuit board 18 via an adhesive 83. Therefore, in the case of the present embodiment, the heat radiation member 4
The cover 1 and the cover 42 are individually held on the circuit board 18, and the projection 50 of the heat radiating member 41 and the heat transfer sheet 58 on the cover 42 are in contact with the semiconductor chip 28, respectively.

The fourth embodiment having such a configuration is the same as the first embodiment except that the heat radiating member 41 and the cover 42 are not connected to each other.
8 can be released to both the heat dissipating member 41 and the cover 42. Therefore, the heat dissipation of the semiconductor chip 28 can be efficiently performed, and the thermal resistance of the TCP 26 can be reduced.

In implementing the fourth embodiment, a large number of heat radiation fins 71 may be integrally formed on the lower surface 41b of the heat radiation member 41, as shown by a two-dot chain line in FIG. The circuit board 18 is held by the circuit board 18 by press-fitting the fitting protrusions 81 into the fitting holes 82.
The cover 42 is not always necessary. In some cases, the TCP 26 may be exposed on the surface 18a of the circuit board 18.

FIG. 13 shows a fifth embodiment which is an extension of the fourth embodiment. In the fifth embodiment, the ground wiring layer 23 is stacked inside the circuit board 18 and covered with the insulating layer 22. Therefore, the heat radiation member 4
1, the convex portion 50 is directly provided on the upper surface 41a of the heat radiating member 41 without a seat portion in contact with the peripheral edge of the opening of the hole 35.

The circuit board 18 has four through holes 91 into which the fitting projections 81 are fitted. As shown in FIG. 13B, the through hole 91 has a circular cross section, and its inner surface is covered with a conductive plating layer 92. This plating layer 92 is electrically connected to the ground wiring layer 23 inside the circuit board 18.

When the fitting projections 81 of the heat radiating member 41 are fitted into the through holes 91, the corners of the fitting projections 81 come into tight contact with the plating layer 92. Due to this pressure contact, mechanical connection between the circuit board 18 and the heat radiating member 41 and electrical connection between the ground wiring layer 23 and the heat radiating member 41 are simultaneously performed.

According to the fifth embodiment having such a configuration, the heat of the semiconductor chip 28 can be released to both the heat radiating member 41 and the cover 42, and the heat of the semiconductor chip 28 can be efficiently released.

Further, since the fitting projection 81 of the conductive heat radiating member 41 is in contact with the plating layer 92 on the inner surface of the through hole 91, a semiconductor portion is formed by utilizing the joint between the heat radiating member 41 and the circuit board 18. The chip 28 is connected to the ground wiring layer 23
Can be electrically connected to Therefore, there is an advantage that a special operation for grounding the semiconductor chip 28 becomes unnecessary.

FIG. 14 shows a sixth embodiment which is a further development of the fourth embodiment. In the sixth embodiment, the fitting projection 81 on the upper surface 41a of the heat radiating member 41 is arranged at a position closer to the convex portion 50 than the corner of the heat radiating member 41. Therefore, the fitting hole 82 of the circuit board 18 is also disposed between the hole 35 and the connection pad 33, and the fitting portion between the fitting hole 82 and the fitting protrusion 81 is T
It is located inside the outer periphery of the CP 26. The signal wiring layer 21 inside the circuit board 18 is
2 is extended toward the direction of the hole 35 by a displacement, and the extension 21 a is located below the connection pad 33.

According to such a structure, since the signal wiring layer 21 does not normally exist in the region between the connection pad 33 and the hole 35 in the circuit board 18,
The signal wiring layer 21 does not hinder the opening of the fitting holes 82 in the holes, and the degree of freedom in arranging the fitting holes 82 increases.

In addition, since there is no fitting hole 82 around the connection pad 33, the signal wiring layer 21 is connected to the connection pad 3
3 can be easily extended. Therefore, the degree of freedom in forming the signal wiring layer 21 is increased, which is advantageous when the circuit board 18 has a multilayer structure.

FIG. 16 shows a seventh embodiment of the present invention. The seventh embodiment mainly includes a semiconductor chip 2
8 is different from that of the first embodiment in that the heat is dissipated.
The basic configurations of the CP 26 and the circuit board 18 are the same as in the first embodiment. Therefore, in the seventh embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

As shown in FIG.
The heat radiating member 101 is arranged in the inside of the device 5. The heat dissipating member 101 is made of a metal material having conductivity, such as an aluminum alloy, and having excellent heat conductivity. The heat dissipating member 101 has a shape similar to the hole 35 and has a rectangular plate shape having the same thickness as the circuit board 18. The heat radiation member 101 is fixed inside the hole 35 via an adhesive 102. This adhesive 10
2 is filled in a gap between the outer peripheral surface of the heat radiation member 101 and the inner peripheral surface of the hole 35. The adhesive 102 is selected and used as a non-conductive material having a large thermal resistance.
Thereby, the heat radiation member 101 and the circuit board 18
They are integrated while being electrically insulated from each other.

The heat radiating member 101 has a flat contact surface 10.
1a and a heat radiation surface 101b. Heat dissipation member 101
The contact surface 101a is flush with the surface 18a of the circuit board 18. Similarly, the heat radiation surface 1 of the heat radiation member 101
01b is flush with the back surface 18b of the circuit board 18. Here, the term “level” includes some unevenness due to a manufacturing error, and the contact surface 101a may be slightly protruded or slightly depressed from the surface 18a. Then, the contact surface 101 of the heat radiation member 101
a has a larger area than the back surface 28b of the semiconductor chip 28, and the back surface 28b of the semiconductor chip 28 is bonded to the contact surface 101a via an adhesive 52.

The ground wiring layer 23 is formed on the circuit board 1.
8 on the rear surface 18b. On the back surface 18b, a solder layer 103 as a conductive coating straddling the heat radiating surface 101b of the heat radiating member 101 is applied.

In order to form the solder layer 103, first, the heat radiating member 101 is bonded to the circuit board 18, and the back surface 18b of the circuit board 18 and the heat radiating surface 1 of the heat radiating member 101 are formed.
01b is applied with solder paste. next,
The circuit board 18 is heated to melt the paste solder, and the melted solder is hardened. This allows
The solder layer 103 has a thin film shape, and the back surface 18b of the circuit board 18 including the heat radiating surface 101b of the heat radiating member 101 is kept flat without irregularities.

Therefore, the ground wiring layer 23 and the heat radiating member 101 are electrically connected via the film-like solder layer 103. The back surface 18 b of the circuit board 18 covered with the solder layer 103 is connected to the seat surface 60 of the frame 16.
a.

According to such a configuration, the semiconductor chip 2
The heat of No. 8 is transmitted to the heat radiating member 101 from the entire surface of the back surface 28b through the adhesive 52, and is released to the frame 16 from the heat radiating surface 101b of the heat radiating member 101. for that reason,
The heat of the semiconductor chip 28 can be efficiently radiated using the frame 16.

Since the solder layer 103 has a thin film shape, the back surface 18b of the circuit board 18 has a flat surface without unevenness, and the back surface 18b of the circuit board 18 is Can be contacted. Therefore, there is no gap between the heat radiating member 101 and the frame 16 that hinders heat conduction, and the heat transmitted to the heat radiating member 101 can be efficiently released to the frame 16.

Moreover, according to the above configuration, the circuit board 18
The ground wiring layer 23 and the heat radiation member 101
03, so that the heat radiating member 1
01 can be used as a part of the ground circuit. Therefore, a special operation for grounding the semiconductor chip 28 becomes unnecessary.

The adhesive 102 for bonding the heat radiating member 101 to the circuit board 18 has a large thermal resistance.
It also functions as a kind of heat insulating layer that hinders heat transfer to 8.
For this reason, it is difficult for the heat transmitted to the heat radiation member 101 to be directly transmitted to the circuit board 18, and it is possible to prevent the heat from being trapped inside the circuit board 18.

Therefore, it is possible to prevent the heat of the TCP 26 from being transmitted to other circuit components on the circuit board 18, for example, the QFP 25 and the connector 24, and it is possible to minimize the influence of heat on these other circuit components.

In the seventh embodiment, for example, a cover 42 as shown in the sixth embodiment is adhered to the surface 18a of the circuit board 18, and the TCP 42
6 may be covered.

FIGS. 17 to 20 show an eighth embodiment of the present invention. The eighth embodiment is mainly concerned with a method of connecting the circuit board 18 to the TCP 26 and the TCP connection method.
26 is different from that of the first embodiment, and TC
The basic configuration of P26 is the same as in the first embodiment. Therefore, in the eighth embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

As shown in FIG. 17, the TCP 26 is mounted on the circuit board 18 in a so-called face-down posture in which the surface 28a of the semiconductor chip 28 to which the leads 30 are connected faces the circuit board 18. Therefore, the surface 18a of the circuit board 18 is a chip mounting surface.

Also, the back surface 28b of the semiconductor chip 28
Facing the opposite direction to the surface 18a of the circuit board 18,
A gap 120 is formed between the surface 18a of the circuit board 18 and the surface 28a of the semiconductor chip 28.

The circuit board 18 has a ground wiring layer 23 covered by the insulating layer 22. The ground wiring layer 23 is formed at a position outside the mounting area of the TCP 26, as shown in FIG. Therefore, the portion of the circuit board 18 corresponding to the mounting area of the TCP 26 is:
Only the insulating layer 22 is provided.

A heat dissipating member 123 is attached to a portion of the circuit board 18 where the TCP 26 is mounted. Heat dissipation member 1
Reference numeral 23 is made of a metal material having excellent heat conductivity such as an aluminum alloy and having conductivity. The heat dissipating member 123 integrally has a substantially square panel portion 124 having a planar shape larger than the TCP 26 and a frame portion 125 extending downward from a peripheral portion of the panel portion 124. The frame 125 is located outside the mounting area of the TCP 26, and the lower surface of the frame 125 is overlapped with the front surface 18 a of the circuit board 18.

As shown in FIG. 18, the panel section 124
Each of the four corners has a screw hole 126. The screw hole 126 is located outside the mounting area of the TCP 26 and faces the mounting hole 45 of the circuit board 18. Screws 127 are inserted into the mounting holes 45 of the circuit board 18 from the direction of the back surface 18b, and the tips of the screws 127 are screwed into the screw holes 126. By this screwing, the heat radiating member 123 is fixed to the surface 18a of the circuit board 18, and the lead 30 of the TCP 26 and the connection pad 33
Is concealed by the heat dissipating member 123.

The center of the lower surface of the panel portion 124 of the heat radiating member 123 faces the back surface 28b of the semiconductor chip 28. The back surface 28b of the semiconductor chip 28
Is bonded via a conductive adhesive 128 as a die attach material to the panel 124, thermal This panel section 124
It is connected to the.

As shown in FIG. 17, a conductive layer 131 is disposed on the surface 18a of the circuit board 18. Conductive layer 1
Reference numeral 31 is located outside the mounting area of the TCP 26. The conductive layer 131 is formed by the heat radiating member 123.
Is fixed to the front surface 18a of the circuit board 18 so as to come into contact with the lower surface of the frame portion 125 of the heat radiation member 123.

The conductive layer 131 is formed of the ground wiring layer 23.
Is located above. The conductive layer 131 and the ground wiring layer 23 are electrically connected via the conductive pin 132. The conductive pin 132 penetrates the circuit board 18 and the ground wiring layer 23 in the thickness direction, and the tip of the conductive pin 132 is in contact with the conductive layer 131.
Therefore, when the heat radiating member 123 is fixed to the surface 18a of the circuit board 18 via the screw 127, the heat radiating member 123 is fixed.
Frame portion 125 is electrically connected to the ground wiring layer 23 via the conductive layer 131 and the conductive pin 132.

Therefore, according to this configuration, the semiconductor chip 28 can be connected to the ground wiring layer 23 at the same time when the heat radiating member 123 is attached to the circuit board 18.
Special grounding work of the TCP 26 can be omitted.

The circuit board 18 is
Is provided in the thickness direction. Through hole 1
35 is located on the mounting portion of the TCP 26,
It faces the surface 28a of the semiconductor chip 28.

On the other hand, when the TCP 26 is mounted on the circuit board 18 in a face-down posture, a gap 120 is formed between the surface 28a of the semiconductor chip 28 and the surface 18a of the circuit board 18 as described above. 28 cannot be supported by the circuit board 18. Therefore, as shown in FIG. 20, the semiconductor chip 28 is pressed against the panel portion 124 of the heat radiating member 123 via the pressing member 136 until the adhesive 128 is hardened.

The pressing member 136 extends out of the main body 136a interposed between the front surface 18a of the circuit board 18 and the front surface 28a of the semiconductor chip 28 and the rear surface 18b of the circuit board 18 through the through hole 135. Guide part 136b
And The pressing member 136 is made of, for example, a rubber-like elastic body that can be elastically deformed.

Then, the through holes 135 of the circuit board 18 are formed.
After the adhesive 128 is cured, the pressing member 136
From the circuit board 18 and the semiconductor chip 28, and has an opening area smaller than that of the main body 136a. That is, as shown in FIG. 20, the guide portion 136b of the pressing member 136 is
Is drawn out in the direction of the back surface 18b of the circuit board 18 in the state where the adhesive 128 is hardened.
When the distal end of the guide portion 136b is pulled, the main body 13
6a is drawn into the through hole 135 while being elastically deformed, and is taken out to the back surface 18b side of the circuit board 18 through the through hole 135.

Therefore, the semiconductor chip 18 of the TCP 26
Is held in a state of being suspended on the lower surface of the panel portion 124 via the adhesive 128. Next, a procedure for mounting the TCP 26 on the circuit board 18 will be described.

As shown in FIG. 19, first, the circuit board 18
The pressing member 136 is inserted into the through hole 135 from the direction of the surface 18a of the circuit board 18, and the main body 136a of the pressing member 136 is hooked on the opening edge of the hole 135.

Next, TCP 18a is applied to the surface 18a of the circuit board 18.
26. At this time, the TCP 26 supplies the surface 28 a of the semiconductor chip 28 to which the leads 30 are connected to the circuit board 18 in a face-down attitude toward the circuit board 18,
The tip of the lead 30 is soldered to the connection pad 33. By this soldering, the main body 136a of the pressing member 136 contacts the surface 18a of the semiconductor chip 18, and the semiconductor chip 18 is supported via the pressing member 136.

Next, an adhesive 128 is applied to the back surface 28b of the semiconductor chip 28. Thereafter, the surface 1 of the circuit board 18 is
A heat radiating member 123 is put on 8a, and the heat radiating member 123 covers the TCP 26 and the connection portion between the lead 30 and the connection pad 33 of the TCP 26. Then, the screw 1 is inserted into the mounting hole 45 of the circuit board 18 from the direction of the back surface 18b.
27, and the screw 127 is screwed into the screw hole 126, whereby the heat radiation member 123 is fastened and fixed to the circuit board 18.

By this fixing, the semiconductor chip 28 is sandwiched between the panel portion 124 of the heat radiating member 123 and the pressing member 136, and the adhesive 128 is applied between the back surface 28 b of the semiconductor chip 28 and the lower surface of the panel portion 124. Will be filled.
In this case, since the pressing member 136 has elasticity, the semiconductor chip 28 is pressed toward the panel portion 124. Therefore, it is possible to prevent the semiconductor chip 28 from hanging down or moving out of the panel portion 124 until the adhesive 128 is hardened, and the posture of the semiconductor chip 28 is kept constant .

When the adhesive 128 is cured and the semiconductor chip 28 is fixed to the panel portion 124, as shown by an arrow in FIG. 20, the guide portion 136b of the pressing member 136 led out from the through hole 135 is removed. pull. Then, the main body 136a of the pressing member 136 is elastically deformed while the through hole 135 is
Of the circuit board 18 through the through hole 135, and is taken out to the back surface 18b side of the circuit board 18.
6 is removed from between the TCP 26 and the circuit board 18.

According to the eighth embodiment of the present invention,
When the semiconductor chip 28 generates heat, the semiconductor chip 28
Is released to the heat radiating member 123 from the back surface 28b opposite to the circuit board 18. Back surface 28 of semiconductor chip 28
Since b is bonded to the lower surface of the panel portion 124 via the adhesive 128, there is no gap between the semiconductor chip 28 and the panel portion 124 that hinders heat conduction. Heat dissipating member 12 for efficient heat
3 can escape.

Therefore, even when the TCP 26 is mounted on the circuit board 18 in a face-down posture, a sufficient heat dissipation path can be secured on the side of the semiconductor chip 28 opposite to the circuit board 18, and the heat dissipation of the TCP 26 can be reduced. Substrate 18
It can be done positively without using.

When the pressing member 136 is removed from between the circuit board 18 and the semiconductor chip 28, a gap 120 is provided between the circuit board 18 and the semiconductor chip 28.
Therefore, the gap 120 serves as a kind of adiabatic space that blocks radiant heat from the semiconductor chip 28 toward the circuit board 18, and the influence of heat on the circuit board 18 can be reduced.

When the pressing member 136 is removed, the through-hole 135 of the circuit board 18 is connected to the gap 120, and the through-hole 135 is formed on the surface 28a of the semiconductor chip 28.
Through the radiant heat of the semiconductor chip 28
It can escape to the outside through 35. Therefore, the semiconductor chip 2 is placed between the heat radiating member 123 and the circuit board 18.
8 is less likely to be trapped, and the heat effect on the circuit board 18 can be reduced.

In addition, according to the above configuration, the semiconductor chip 2
8 is pressed against the panel portion 124 of the heat radiating member 123 via the pressing member 136 during the period until the adhesive 128 is cured, so that the posture of the semiconductor chip 28 is kept constant. Therefore, the back surface 28b of the semiconductor chip 28 can be securely bonded to the lower surface of the panel portion 124, and the heat of the semiconductor chip 28 can be efficiently transmitted to the panel portion 124.

FIG. 21 shows a ninth embodiment which is a further development of the eighth embodiment. The ninth embodiment is different from the eighth embodiment in the shape of the heat radiation member 123, and the other configuration is the same as the eighth embodiment.

The heat dissipating member 123 of the ninth embodiment has a large number of heat dissipating fins 141 integrally provided on the upper surface of the panel portion 124. These radiating fins 141 are connected to the semiconductor chip 2.
8 and a panel portion 124.

According to such a configuration, the semiconductor chip 2
Since the heat radiation area of the panel portion 124 to which the heat of No. 8 is directly transmitted increases, the heat radiation effect of the panel portion 124 can be further enhanced, and there is an advantage that it is more convenient in realizing a low thermal resistance of the TCP 26.

In the above embodiment, the leads formed on the carrier were connected to the bumps on the surface of the semiconductor chip. However, the present invention is not limited to this, and the bumps on the semiconductor chip and the connection pads on the circuit board may be connected to wires. -Connection may be made by bonding.

Furthermore, the cooling device for a circuit module according to the present invention is not specified for a portable computer, but can be applied to other electronic devices and various fields.

[0164]

According to the present invention described in detail above, the heat of the semiconductor chip is released from the entire surface of the second chip surface to the heat radiating member through the convex portion . For this reason , a wide heat dissipation path can be formed so as to directly connect the semiconductor chip that generates heat and the heat dissipation member, and the heat of the semiconductor chip can be efficiently transmitted to the heat dissipation member . In addition, the first chip of the semiconductor chip
The chip surface and the cover are thermally connected, so the semiconductor chip
Heat from the first chip surface to the cover via the heat conducting member
I can do it. Therefore, the heat of the semiconductor chip is first and first.
And the second chip surface.
The heat dissipation of the semiconductor chip is improved,
Heat is hardly transmitted to the circuit board.

[0165]

[0166]

[0167]

[0168]

[0169]

[0170]

[0171]

Further, since the gap between the inner peripheral surface of the hole of the circuit board and the convex portion and the gap between the heat radiating member and the circuit board function as a heat insulating layer, the semiconductor chip transmitted to the convex portion and the heat radiating member is provided. Heat is hardly transmitted directly to the circuit board. Therefore, it is possible to prevent heat from being trapped inside the circuit board, and it is possible to reduce the influence of heat on other circuit components mounted on the circuit board.

[0173]

[0174]

[0175]

[0176]

[0177]

[0178]

[0179]

[0180]

[0181]

[0182]

[0183]

[0184]

[0185]

[0186]

[0187]

[Brief description of the drawings]

FIG. 1 is a sectional view showing a mounting portion of a TCP according to a first embodiment of the present invention.

FIG. 2 is a sectional view showing a state where a circuit board, a TCP, and a radiator are separated from each other.

FIG. 3 is a perspective view showing a state where a circuit board, a TCP, and a radiator are separated from each other.

FIG. 4 is a cross-sectional view of the portable computer showing a state in which a circuit board having a TCP is accommodated in a housing.

FIG. 5 is a perspective view of a portable computer.

FIG. 6 is a perspective view showing a state where a frame, a circuit board, and a shield plate are separated from each other.

FIG. 7 is a perspective view showing a state in which a frame is incorporated in a lower housing of a housing.

FIG. 8 is a sectional view showing a mounting portion of a TCP according to a second embodiment of the present invention.

FIG. 9 is a sectional view showing a mounting part of a TCP according to a third embodiment of the present invention.

FIG. 10 is a sectional view showing a mounting portion of a TCP according to a fourth embodiment of the present invention.

FIG. 11 is a sectional view showing a state where the circuit board, the TCP, and the radiator are separated from each other.

FIG. 12 is a perspective view showing a state where a circuit board, a TCP, and a radiator are separated from each other.

FIG. 13A is a diagram showing a TC according to a fifth embodiment of the present invention.
Sectional drawing which shows the mounting part of P. FIG. 13B is a sectional view taken along line AA of FIG.

FIG. 14 is a sectional view showing a mounting portion of a TCP according to a sixth embodiment of the present invention.

FIG. 15 is a perspective view showing a state where a circuit board, a TCP, and a radiator are separated from each other.

FIG. 16 is a sectional view showing a mounting part of a TCP according to a seventh embodiment of the present invention.

FIG. 17 is a sectional view showing a mounting portion of a TCP according to an eighth embodiment of the present invention.

FIG. 18 is a perspective view showing a state where a circuit board, a TCP, and a heat radiating member are separated from each other.

FIG. 19 is a sectional view showing a state in which the circuit board, the TCP, the pressing member, and the heat radiating member are separated from each other.

FIG. 20 is a sectional view showing a state in which a TCP semiconductor chip is pressed against a heat dissipation member via a pressing member.

FIG. 21 is a sectional view showing a mounting portion of a TCP according to a ninth embodiment of the present invention.

[Explanation of symbols]

 18 Circuit board 18a First surface (front surface) 18b Second surface (back surface) 28 Semiconductor chip 28a First chip surface (front surface) 28b Second chip surface (back surface) 30 Lead 33 ... connection pad 35 ... hole 41 ... heat dissipation member 42 ... cover 48, 51 ... gap (first gap, second gap) 50 ... convex part 50a ... contact surface 58 ... heat conduction member (heat transfer sheet)

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-6-85120 (JP, A) JP-A-5-315712 (JP, A) JP-A-6-295962 (JP, A) JP-A-5-295962 152470 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 23/36-23/473

Claims (13)

(57) [Claims] 1. A circuit board including a first surface having a connection pad and a second surface located on the opposite side of the first surface, the circuit board being connected to a connection pad of the circuit board via a lead,
A semiconductor chip that generates heat during operation, wherein the semiconductor chip has a first lead connection portion.
And a second chip surface located on the opposite side of the first chip surface, and the circuit is oriented in such a manner that the second chip surface faces the first surface of the circuit board. Mount on board
And the circuit board has a hole having an opening shape larger than that of the semiconductor chip in a portion facing the semiconductor chip, and a second surface of the circuit board opposite to the semiconductor chip has A heat conductive heat radiating member having a convex portion that enters the hole is disposed, and the convex portion of the heat radiating member has a larger area than the second chip surface of the semiconductor chip, and
A contact surface that is thermally connected to the chip surface; and a first surface of the circuit board on which the semiconductor chip and the semiconductor chip are connected.
And the heat covering the connection between the lead and the connection pad
Place a conductive cover, and place this cover and the semiconductor chip
A heat conductive member should be interposed between the first chip surface of the
By the above, between the cover and the contact surface of the convex portion,
A circuit module cooling device comprising a semiconductor chip sandwiched therebetween . 2. A heat shielding gap according to claim 1, wherein a heat shielding gap is formed between the heat radiating member and the circuit board and between the inner peripheral surface of the hole and the projection . A cooling device for a circuit module, comprising: 3. The method according to claim 1, wherein
The cover and the heat radiating member sandwich the circuit board therebetween.
Face each other and penetrate this circuit board in the thickness direction.
A cooling device for a circuit module, wherein the cooling device is coupled to each other via a passing fastening member . 4. The circuit board according to claim 1 , wherein
Has a ground wiring layer on its second surface, and
Radiating member is, consists of a metal material having conductivity, this
The cooling device for a circuit module, wherein the ground wiring layer is in contact with the heat radiation member . 5. The method according to claim 1, wherein
The cooling device for a circuit module, wherein the contact surface of the protrusion and the second chip surface of the semiconductor chip are bonded to each other via a conductive adhesive. 6. A first surface having connection pads and a first surface having connection pads.
Circuit board including a second surface located opposite the first surface
When connected via the lead connection pads of the circuit board,
A semiconductor chip that generates heat during operation.
Joule, the semiconductor chip has a first connection portion having the lead connection portion.
And a chip surface opposite to the first chip surface.
Having a second chip surface, and the second chip surface
Mounted on the circuit board with the posture facing the first surface of the circuit board
And the circuit board is mounted on the mounting portion of the semiconductor chip.
A hole having an opening shape larger than the conductor chip, and this hole
And a plurality of fitting holes located around the second surface of the circuit board, the second surface being opposite to the semiconductor chip.
A heat dissipating member having thermal conductivity,
Is press-fitted into the fitting hole and the convex portion entering the hole.
And a plurality of legs, and the protrusion is
Having a larger area than the second surface of the body chip,
2 and a flat contact surface thermally connected to the chip surface, between the heat dissipating member and the circuit board, and inside the hole.
A cooling device for a circuit module, wherein a gap for heat shielding is formed between the surface and the projection . 7. The circuit board according to claim 6 , wherein:
Has a ground wiring layer on its second surface, and
The heat radiating member is made of a conductive metal material.
The cooling device for a circuit module, wherein the ground wiring layer is in contact with the heat radiation member . 8. The method according to claim 6 , wherein the contact of the projection is formed.
The contact surface and the second surface of the semiconductor chip are electrically conductively bonded.
A cooling device for a circuit module, which is adhered to each other via an agent . 9. The heat dissipating member according to claim 6 , wherein:
Are a large number of heat radiation fans protruding toward the side
Cooling apparatus for circuit modules, characterized in that it comprises a fin. 10. The circuit board according to claim 6 , wherein
The board consists of multiple layers of wiring layers and insulating layers alternately stacked
And the fitting hole of the circuit board is
A cooling device for a circuit module, which is disposed between the connection pad and the hole . 11. The circuit board according to claim 6 , wherein
The board has a ground wiring layer covered by an insulating layer
At the same time, the inner surface of the fitting hole is
Covered by an electrically connected conductive layer,
The heat radiation member is made of a conductive metal material.
The legs of the heat radiating member are pressed against the conductive layer.
Cooling apparatus for circuit module characterized by Rukoto. 12. The circuit board according to claim 6 , wherein
The semiconductor chip and the leads are provided on a first surface of the plate.
A circuit module cooling device, comprising a cover for covering a connection portion with a connection pad . In the description of 13. The method of claim 12, said cover
Is made of a metal material having thermal conductivity.
Between the semiconductor chip and the first chip surface of the semiconductor chip.
A cooling device for a circuit module, wherein a heat transfer sheet made of a conductive material is disposed .