JPH07106721A - Printed circuit board and heat radiating method - Google Patents
Printed circuit board and heat radiating methodInfo
- Publication number
- JPH07106721A JPH07106721A JP5269485A JP26948593A JPH07106721A JP H07106721 A JPH07106721 A JP H07106721A JP 5269485 A JP5269485 A JP 5269485A JP 26948593 A JP26948593 A JP 26948593A JP H07106721 A JPH07106721 A JP H07106721A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- electronic component
- circuit board
- printed circuit
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント配線板上に発
熱性の電子部品を実装してなるプリント回路板の構造と
その放熱方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a printed circuit board having heat-generating electronic components mounted on a printed wiring board and a heat dissipation method thereof.
【０００２】[0002]
【従来の技術】電子機器には、プリント配線板上に回路
素子部品として色々な電子部品が実装されてなるプリン
ト回路板が組み込まれており、その電子部品の中には使
用時に発熱を伴うものも少なくない。このような電子機
器では、発熱する電子部品の放熱を行い焼損を防止する
必要がある。2. Description of the Related Art Electronic equipment includes a printed circuit board in which various electronic components are mounted as circuit element components on a printed wiring board, and some of the electronic components generate heat during use. Not a few. In such electronic equipment, it is necessary to radiate heat from the electronic components that generate heat to prevent burnout.
【０００３】そこで、この発熱する電子部品の放熱に関
する技術は従来より研究されており、これまでにも数多
くの技術が提案されている。例えば（１）高発熱ＩＣ
（集積回路）等の電子部品の場合では、電子部品毎に凹
凸やフィンのある放熱機構を持つパッケージを用いると
か、（２）特開平３−６０１４５号で見られるように、
回路部品を覆っているケースの全周に設けたフランジの
一部に舌片を設け、この舌片をプリント配線板の印刷さ
れている銅箔上に接触させて載せ、舌片と銅箔との接触
を通じてプリント配線板に放熱させ、ケース内部に蓄積
されることがないようにする構造等が採られている。Therefore, techniques for heat dissipation of the electronic components that generate heat have been studied in the past, and many techniques have been proposed so far. For example (1) High heat generation IC
In the case of electronic components such as (integrated circuit), a package having a heat dissipation mechanism having irregularities and fins is used for each electronic component, or (2) as seen in JP-A-3-60145.
Provide a tongue piece on a part of the flange provided on the entire circumference of the case covering the circuit parts, place this tongue piece in contact with the printed copper foil of the printed wiring board, and attach the tongue piece and the copper foil. A structure is adopted in which heat is radiated to the printed wiring board through the contact between the two and prevents the heat from being accumulated inside the case.
【０００４】[0004]
【発明が解決しようとする課題】ところで、近年では、
半導体の高速・高周波化に伴い、高発熱のＩＣ等、比較
的高熱を発生する電子部品を、多数個プリント配線板に
実装する必要が生じて来ている。By the way, in recent years,
As semiconductors operate at higher speeds and higher frequencies, it has become necessary to mount a large number of electronic components that generate relatively high heat, such as ICs that generate high heat, on a printed wiring board.
【０００５】しかしながら、上述した従来の放熱構造で
は、何れもパッケージを個々に使用する等の方法が採ら
れているが、放熱機能を有するパッケージは一般に高価
であるのでコストが高くなると言う問題点があった。However, in each of the above-described conventional heat dissipation structures, a method of individually using the package is adopted, but since a package having a heat dissipation function is generally expensive, there is a problem that the cost becomes high. there were.
【０００６】また、近年では、電子機器の小型・軽量化
が要求されており、これに伴ってプリント回路板も小型
化されている。このため、プリント回路板を電子機器の
筐体に固定しない構造のものも増えてきており、このよ
うな構造で効率の良い放熱が期待できない。Further, in recent years, there has been a demand for downsizing and weight reduction of electronic devices, and accordingly, printed circuit boards have been downsized. Therefore, the number of structures in which the printed circuit board is not fixed to the housing of the electronic device is increasing, and efficient heat dissipation cannot be expected with such a structure.
【０００７】さらに、放熱機能を有するパッケージ等を
個々に用いた場合では、高密度実装の妨げや重量が増す
等、小型・軽量化の要求を十分に満足できるものではな
かった。Further, in the case of individually using a package having a heat radiation function, it has not been possible to sufficiently satisfy the requirements for downsizing and weight reduction, such as hindering high-density mounting and increasing weight.
【０００８】本発明は、上記問題点に鑑みてなされたも
のであり、その目的は小型・軽量化が可能で、コストも
低く、かつ放熱効率の良い構造にしたプリント回路板及
びその放熱方法を提供することにある。The present invention has been made in view of the above problems, and an object of the present invention is to provide a printed circuit board and a heat dissipation method thereof which are small in size and light in weight, low in cost, and good in heat dissipation efficiency. To provide.
【０００９】[0009]
【課題を解決するための手段】この目的は、本発明にあ
っては、プリント配線板上に発熱性の電子部品を実装し
てなるプリント回路板において、前記電子部品より突出
されて形成された第１の熱伝導手段と、放熱部とこの放
熱部より突出されて形成された第２の熱伝導手段を有し
てなる放熱体と、前記プリント配線板に積層されて設け
られているとともに、前記プリント配線板上に装着され
た前記電子部品の前記第１の熱伝導手段と前記放熱体の
前記第２の熱伝導手段と各々熱伝導結合される熱伝導層
とを備え、前記プリント配線板上に装着された前記電子
部品より発生される熱を前記第１の熱伝導手段と前記熱
伝導層と前記第２の熱伝導手段を通して前記放熱体に伝
達させて放熱するようにして達成される。また、前記熱
伝導層としては前記プリント回路板に積層された接地層
を使用することも可能である。さらに、好ましくは前記
熱伝導層を前記電子部品が配線される配線層に比べて遠
い位置に配すると良く、また前記放熱体を前記発熱性の
電子部品に隣接させて設けるとさらに良い。また、前記
プリント配線板は、少なくとも信号層と接地兼熱伝導層
と電源層とを積層してなる配線板として形成されている
ものを使用しても良い。According to the present invention, there is provided a printed circuit board in which a heat-generating electronic component is mounted on a printed wiring board, which is formed so as to protrude from the electronic component. A heat radiator having a first heat conducting means, a heat radiating portion and a second heat conducting means formed so as to project from the heat radiating portion, and a laminate provided on the printed wiring board, and The printed wiring board is provided with a heat conductive layer that is thermally conductively coupled to the first heat conducting means of the electronic component mounted on the printed wiring board and the second heat conducting means of the radiator. The heat generated from the electronic component mounted above is transferred to the radiator through the first heat conducting means, the heat conducting layer, and the second heat conducting means to radiate the heat. . A ground layer laminated on the printed circuit board may be used as the heat conductive layer. Furthermore, it is preferable to dispose the heat conducting layer at a position farther than a wiring layer in which the electronic component is wired, and it is more preferable to dispose the heat radiator adjacent to the heat generating electronic component. The printed wiring board may be a wiring board formed by laminating at least a signal layer, a ground / heat conductive layer, and a power supply layer.
【００１０】また、この目的は、本発明にあっては、プ
リント配線板上に実装されている電子部品より発生され
る熱の放熱方法において、前記電子部品より突出された
第１の熱伝導手段と、放熱部とこの放熱部より突出され
た第２の熱伝導手段を有してなる放熱体と、前記プリン
ト配線板に積層して形成されるとともに、前記プリント
配線板上に装着された前記電子部品の前記第１の熱伝導
手段と前記放熱体の前記第２の熱伝導手段と各々熱伝導
結合される熱伝導層とを設け、前記プリント配線板上に
装着された電子部品より発生される熱を前記第１の熱伝
導手段と前記熱伝導層と前記第２の熱伝導手段を通して
前記放熱体に伝達させて放熱するようにして達成され
る。Another object of the present invention is to dissipate heat generated by an electronic component mounted on a printed wiring board in the present invention, the first heat conducting means protruding from the electronic component. A heat radiating portion and a heat radiating body having a second heat conducting means protruding from the heat radiating portion; and a heat radiating body laminated on the printed wiring board and mounted on the printed wiring board. The first heat conducting means of the electronic component and the second heat conducting means of the radiator are provided with heat conducting layers respectively thermally conductively coupled to each other, and are generated by the electronic component mounted on the printed wiring board. Heat is transferred to the radiator through the first heat conducting means, the heat conducting layer, and the second heat conducting means to radiate heat.
【００１１】[0011]
【作用】これによれば、プリント配線板上に装着された
電子部品より発生された熱は、第１の熱伝導手段と熱伝
導層と第２の熱伝導手段を通して放熱専用の放熱体に伝
達され、この放熱体より放熱される。したがって、高発
熱を伴う複数の電子部品が実装される場合でも放熱機能
を有するパッケージを個々に設けなくても１つの放熱体
を互いに兼用して効率良く放熱させることができる。ま
た、プリント回路板が電子機器の筐体等に取り付けられ
ていなくても、放熱専用の放熱体を通して効率良く放熱
させることができる。According to this, the heat generated from the electronic component mounted on the printed wiring board is transferred to the radiator dedicated to heat dissipation through the first heat conducting means, the heat conducting layer and the second heat conducting means. Then, the heat is dissipated from this radiator. Therefore, even when a plurality of electronic components with high heat generation are mounted, it is possible to efficiently radiate heat by using one heat radiating body as the other heat radiating body without individually providing a package having a heat radiating function. Further, even if the printed circuit board is not attached to the housing of the electronic device or the like, heat can be efficiently dissipated through the heat dissipating body dedicated to heat dissipation.
【００１２】[0012]
【実施例】以下、本発明の実施例について図面を用いて
詳細に説明する。図１乃至図３は本発明に係るプリント
回路板の一実施例を示すもので、図１は図２のＡ−Ａ線
に沿う概略断面図、図２はそのプリント回路板の概略全
体斜視図、図３は図１のＢ部拡大図である。Embodiments of the present invention will be described in detail below with reference to the drawings. 1 to 3 show an embodiment of a printed circuit board according to the present invention. FIG. 1 is a schematic sectional view taken along the line AA of FIG. 2, and FIG. 2 is a schematic overall perspective view of the printed circuit board. 3 is an enlarged view of part B in FIG.
【００１３】図１乃至図３において、このプリント回路
板１は、プリント配線板２上に、リード部品３、チップ
部品４、比較的高い熱を発生する高発熱ＩＣ（集積回
路）５、コネクタ６、放熱専用器としての放熱体７等が
実装された構成になっている。1 to 3, the printed circuit board 1 includes a printed wiring board 2, a lead component 3, a chip component 4, a high heat generation IC (integrated circuit) 5 for generating relatively high heat, and a connector 6. The heat radiator 7 as a heat dissipation device is mounted.
【００１４】さらに詳述すると、高発熱ＩＣ５は、ＩＣ
パッケージの下側に突出されて形成された熱伝導手段と
しての、ピン状をしたサーマルビア８が複数設けられて
いる。このサーマルビア８は熱伝導性の良い材料、例え
ばＣｕ等で形成される。More specifically, the high heat generating IC 5 is an IC
A plurality of pin-shaped thermal vias 8 are provided as heat conduction means formed by projecting to the lower side of the package. The thermal via 8 is formed of a material having good thermal conductivity, such as Cu.
【００１５】放熱体７は、熱伝導性の良いＣｕＷ等で形
成されており、プリント配線板２上に密着して配設され
る本体部７Ａと、この本体部７Ａの上面より上方に突出
されて本体部７Ａと共に放熱部を形成している複数のフ
ィン７Ｂと、本体部７Ａの下面より下方に突出された熱
伝導手段としてのピン状をしたサーマルビア９とが一体
に設けられている。The radiator 7 is formed of CuW or the like having good thermal conductivity, and is provided with a main body portion 7A closely arranged on the printed wiring board 2 and an upper surface of the main body portion 7A. A plurality of fins 7B forming a heat dissipation portion together with the main body portion 7A and a pin-shaped thermal via 9 as a heat conducting means protruding downward from the lower surface of the main body portion 7A are integrally provided.
【００１６】プリント配線板２は、マルチワイヤ配線板
で、信号層１１と、接地を兼ねる熱伝導層１２と、電源
層１３を有し、これらの層１１，１２，１３が各々の間
にポリイミド樹脂等の絶縁材１４を介在して積層され、
全体として一枚の板状に形成されている。The printed wiring board 2 is a multi-wire wiring board and has a signal layer 11, a heat conductive layer 12 also serving as a ground, and a power supply layer 13, and these layers 11, 12 and 13 are polyimide layers between them. Laminated with an insulating material 14 such as resin,
It is formed as a single plate as a whole.
【００１７】また、このプリント配線板２には、リード
部品３、チップ部品４、高発熱ＩＣ５、コネクタ６の各
電気端子（図示せぬ）と対応する位置に、これら各電気
端子がそれぞれ挿入されるスルーホール（図示せぬ）が
設けられているとともに、高発熱ＩＣ５を装着する位置
にサーマルビア８が遊びを持って挿入される孔１５と、
放熱体７を装着する位置にサーマルビア９が遊びを持っ
て挿入される孔１６等が形成されている。なお、この孔
１５及び孔１６内には、それぞれ接地兼熱伝導層１２が
露出された状態になっている。加えて、放熱体７のサー
マルビア９が装着される孔１６は、高発熱ＩＣ５からの
熱伝導が良く得られるように、サーマルビア８とできる
だけ接近した位置に形成されており、さらに孔１５が複
数設けられる場合も出来るだけその平均して離れた位置
に形成される。また、放熱体７は高発熱ＩＣ５の位置、
数等により、必要数設けられるものである。Further, on the printed wiring board 2, the respective electric terminals (not shown) of the lead component 3, the chip component 4, the high heat generating IC 5 and the connector 6 are inserted respectively at the positions corresponding to these electrical terminals. A through hole (not shown) is provided, and a hole 15 into which the thermal via 8 is inserted with play at a position where the high heat generating IC 5 is mounted;
A hole 16 or the like into which the thermal via 9 is inserted with play is formed at a position where the radiator 7 is mounted. In addition, the grounding / heat conducting layer 12 is exposed in the holes 15 and 16. In addition, the hole 16 in which the thermal via 9 of the radiator 7 is mounted is formed at a position as close as possible to the thermal via 8 so that heat conduction from the high heat generating IC 5 can be obtained well, and the hole 15 is further formed. Even when a plurality of them are provided, they are formed at positions that are as far apart as possible on average. In addition, the radiator 7 is located at the position of the high heat generation IC 5,
The necessary number is provided depending on the number.
【００１８】そして、このように形成されたプリント配
線板２上に、リード部品３、チップ部品４、高発熱ＩＣ
５、コネクタ６、放熱体７を実装する場合は、まずリー
ド部品３、チップ部品４、高発熱ＩＣ５、コネクタ６の
各電気端子（図示せぬ）をスルーホール（図示せぬ）に
装着する。すると、これと同時に高発熱ＩＣ５のサーマ
ルビア８も孔１５内に遊びを持って装着される。また、
放熱体７もサーマルビア９を孔１６内に遊びを持たせて
装着する。Then, on the printed wiring board 2 thus formed, the lead parts 3, the chip parts 4, the high heat generating IC
When mounting the connector 5, the connector 6, and the radiator 7, first, the lead component 3, the chip component 4, the high heat generation IC 5, and the electrical terminals (not shown) of the connector 6 are mounted in the through holes (not shown). Then, at the same time, the thermal via 8 of the high heat generating IC 5 is also mounted with play in the hole 15. Also,
The thermal radiator 7 is also mounted with the thermal via 9 having a play in the hole 16.
【００１９】次いで、この状態でプリント配線板２をは
んだディップする。すると、リード部品３、チップ部品
４、高発熱ＩＣ５、コネクタ６のそれぞれの電気端子が
対応するスルーホール内で信号層１１、接地兼熱伝導層
１２、電源層１３と予め決められた電気接続が図られ
る。これと同時に、孔１５，１６内では、はんだディッ
プ時に孔１５，１６内に流れ込んだはんだ１７によって
サーマルビア８と接地兼熱伝導層１２との間、及びサー
マルビア９と接地兼熱伝導層１２との間がそれぞれ接続
され、プリント配線板２上にリード部品３、チップ部品
４、高発熱ＩＣ５、コネクタ６、放熱体７等が実装され
たプリント回路板１が形成される。Next, in this state, the printed wiring board 2 is solder-dipped. Then, the predetermined electrical connection with the signal layer 11, the ground / heat conductive layer 12, and the power supply layer 13 is established in the through holes corresponding to the respective electrical terminals of the lead component 3, the chip component 4, the high heat generation IC 5, and the connector 6. Planned. At the same time, in the holes 15 and 16, the space between the thermal via 8 and the ground / heat conductive layer 12 and between the thermal via 9 and the ground / heat conductive layer 12 are caused by the solder 17 flowing into the holes 15 and 16 during the solder dipping. Are connected to each other, and the printed circuit board 1 on which the lead component 3, the chip component 4, the high heat generation IC 5, the connector 6, the radiator 7 and the like are mounted is formed on the printed wiring board 2.
【００２０】したがって、このように構成されたプリン
ト回路板１では、高発熱ＩＣ（発熱性電子部品）５より
発生された熱は、第１の熱伝導手段としてのサーマルビ
ア８と、接地兼熱伝導層１２と第２の熱伝導手段として
のサーマルビア９を通って放熱体７に伝達され、この放
熱体７より放熱される。よって、複数の高発熱ＩＣ５等
が実装される場合でも、各発熱ＩＣ５に放熱機能を持た
せたパッケージを個々に設けなくても１つの放熱体７を
兼用して効率良く放熱させることができることになる。
これにより、高密度実装の実現とコストの低減、並びに
小型・軽量化が可能になる。Therefore, in the printed circuit board 1 thus constructed, the heat generated from the high heat generating IC (heat generating electronic component) 5 and the thermal via 8 as the first heat conducting means and the grounding / heat It is transmitted to the radiator 7 through the conductive layer 12 and the thermal via 9 as the second heat conducting means, and is radiated from the radiator 7. Therefore, even when a plurality of high heat generating ICs 5 and the like are mounted, it is possible to efficiently radiate heat by using one heat radiating body 7 without having to individually provide a package having a heat radiating function for each heat generating IC 5. Become.
As a result, it is possible to realize high-density mounting, reduce cost, and reduce size and weight.
【００２１】なお、上記実施例では、プリント配線板２
として、信号層１１と、接地を兼ねる熱伝導層１２と、
電源層１３を有し、この層１１，１２，１３が間にポリ
イミド樹脂等の絶縁材１４を介在して積層され、全体と
して一枚の板状に形成されている構造のものを開示した
が、熱伝導層と接地層は別々に形成しても差し支えない
ものである。In the above embodiment, the printed wiring board 2 is used.
As a signal layer 11, a heat conductive layer 12 also serving as a ground,
A structure having a power supply layer 13 and having layers 11, 12, and 13 laminated with an insulating material 14 such as a polyimide resin interposed therebetween and formed into a single plate as a whole has been disclosed. The heat conductive layer and the ground layer may be formed separately.
【００２２】また、熱伝導層と接地層を別々に形成した
プリント配線板２とした場合では、熱伝導層を、リード
部品３、チップ部品４、高発熱ＩＣ５、コネクタ６等が
配線される面に対して、信号層１１，電源層１３よりも
遠い位置に配置すると、配線用のスルーホールは短いま
ま、熱伝導層を厚くしたりするのが可能になる。Further, in the case of the printed wiring board 2 in which the heat conducting layer and the ground layer are separately formed, the heat conducting layer is a surface on which the lead parts 3, the chip parts 4, the high heat generating IC 5, the connector 6 and the like are wired. On the other hand, if it is arranged at a position farther than the signal layer 11 and the power supply layer 13, it is possible to increase the thickness of the heat conduction layer while keeping the through hole for wiring short.
【００２３】さらに、例えば図４に示すように表面に銅
箔等で配線層２１を設けたプリント基板２２の裏面に、
放熱専用の熱伝導層２３を設け、この熱伝導層２３に各
サーマルビア８，９を接続させた構造にしても差し支え
ないものである。この場合では、熱伝導層２３が外側に
露出しているので、この熱伝導層２３の部分での放熱も
得られ、さらに放熱性の良いプリント回路板１が得られ
る。Further, for example, as shown in FIG. 4, on the back surface of the printed circuit board 22 having the wiring layer 21 formed of copper foil or the like on the surface,
A structure in which the heat conduction layer 23 dedicated to heat dissipation is provided and the thermal vias 8 and 9 are connected to the heat conduction layer 23 is also acceptable. In this case, since the heat conducting layer 23 is exposed to the outside, heat can be dissipated at this heat conducting layer 23, and the printed circuit board 1 having a better heat dissipation can be obtained.
【００２４】[0024]
【発明の効果】以上説明したとおり、本発明によれば、
プリント配線板上に装着された電子部品より発生された
熱は、第１の熱伝導手段と熱伝導層と第２の熱伝導手段
を通して放熱専用の放熱体に伝達され、この放熱体より
放熱されるので、高発熱を伴う複数の電子部品が実装さ
れる場合でも放熱機能を持たせたパッケージを個々に設
けなくても１つの放熱体を互いに兼用して効率良く放熱
させることができることになり、高密度実装の実現とコ
ストの低減、並びに小型・軽量化が可能になる等の効果
が期待できる。また、プリント回路板が電子機器の筐体
等に取り付けられていなくても、放熱専用の放熱体を通
して効率良く放熱させることができるので、放熱性が向
上する等の効果も期待できる。As described above, according to the present invention,
The heat generated by the electronic component mounted on the printed wiring board is transmitted to the heat radiator dedicated to heat radiation through the first heat conducting means, the heat conducting layer and the second heat conducting means, and is radiated from this heat radiator. Therefore, even when a plurality of electronic components that generate high heat are mounted, it is possible to efficiently dissipate heat by using one heat radiator as one without using individual packages having a heat dissipation function. It is expected that high-density mounting will be realized, cost will be reduced, and size and weight will be reduced. Further, even if the printed circuit board is not attached to the housing of the electronic device, the heat can be efficiently dissipated through the heat dissipating body dedicated to heat dissipating, so that the effect of improving the heat dissipating property can be expected.
【図１】Ａ−Ａ線に沿う概略断面図である。FIG. 1 is a schematic cross-sectional view taken along the line AA.
【図２】本発明に係るプリント回路板の一実施例を示す
概略全体斜視図である。FIG. 2 is a schematic overall perspective view showing an embodiment of a printed circuit board according to the present invention.
【図３】図１のＢ部拡大図である。FIG. 3 is an enlarged view of part B in FIG.
【図４】本発明に係るプリント回路板の一変形例を示す
要部概略断面図である。FIG. 4 is a schematic cross-sectional view of essential parts showing a modified example of the printed circuit board according to the present invention.
１ プリント回路板 ２ プリント配線板 ５ 高発熱ＩＣ ７ 放熱体 ８ サーマルビア（第１の熱伝導手段） ９ サーマルビア（第２の熱伝導手段） １１ 信号層 １２ 接地兼熱伝導層 １３ 電源層 １５ 孔 １６ 孔 ２１ 配線層 ２２ プリント基板 ２３ 熱伝導層 1 Printed Circuit Board 2 Printed Wiring Board 5 High Heat Generation IC 7 Heat Dissipator 8 Thermal Via (First Heat Conducting Means) 9 Thermal Via (Second Heat Conducting Means) 11 Signal Layer 12 Grounding / Heat Conducting Layer 13 Power Supply Layer 15 Hole 16 hole 21 wiring layer 22 printed circuit board 23 heat conduction layer
Claims (6)
実装してなるプリント回路板において、 前記電子部品より突出されて形成された第１の熱伝導手
段と、 放熱部とこの放熱部より突出されて形成された第２の熱
伝導手段を有してなる放熱体と、 前記プリント配線板に積層されて設けられているととも
に、前記プリント配線板上に装着された前記電子部品の
前記第１の熱伝導手段と前記放熱体の前記第２の熱伝導
手段と各々熱伝導結合される熱伝導層とを備え、 前記プリント配線板上に装着された前記電子部品より発
生される熱を前記第１の熱伝導手段と前記熱伝導層と前
記第２の熱伝導手段を通して前記放熱体に伝達させて放
熱するようにしたことを特徴とするプリント回路板。1. A printed circuit board having a heat-generating electronic component mounted on a printed wiring board, comprising: a first heat conducting means projecting from the electronic component; a heat radiating portion; A heat radiator having a second heat conducting means formed in a protruding manner, and the electronic component of the electronic component mounted on the printed wiring board, the laminated body being provided on the printed wiring board. 1 heat conduction means and a second heat conduction means of the heat radiator, and heat conduction layers respectively heat conduction-coupled, and heat generated from the electronic component mounted on the printed wiring board is A printed circuit board, characterized in that the heat is dissipated by being transmitted to the radiator through the first heat conducting means, the heat conducting layer and the second heat conducting means.
に積層された接地層を使用する請求項１に記載のプリン
ト回路板。2. The printed circuit board according to claim 1, wherein a ground layer laminated on the printed circuit board is used as the heat conductive layer.
る配線層に比べて遠い位置に配した請求項１に記載のプ
リント回路板。3. The printed circuit board according to claim 1, wherein the heat conductive layer is arranged at a position farther than a wiring layer on which the electronic component is wired.
接させて設けた請求項１に記載のプリント回路板。4. The printed circuit board according to claim 1, wherein the radiator is provided adjacent to the heat-generating electronic component.
層と接地兼熱伝導層と電源層とを積層してなる配線板と
して形成されている請求項１に記載のプリント回路板。5. The printed circuit board according to claim 1, wherein the printed wiring board is formed as a wiring board in which at least a signal layer, a ground / heat conductive layer, and a power supply layer are laminated.
部品より発生される熱の放熱方法において、 前記電子部品より突出された第１の熱伝導手段と、 放熱部とこの放熱部より突出された第２の熱伝導手段を
有してなる放熱体と、 前記プリント配線板に積層して形成されるとともに、前
記プリント配線板上に装着された前記電子部品の前記第
１の熱伝導手段と前記放熱体の前記第２の熱伝導手段と
各々熱伝導結合される熱伝導層とを設け、 前記プリント配線板上に装着された電子部品より発生さ
れる熱を前記第１の熱伝導手段と前記熱伝導層と前記第
２の熱伝導手段を通して前記放熱体に伝達させて放熱す
るようにしたことを特徴とするプリント回路板の放熱方
法。6. A method of radiating heat generated by an electronic component mounted on a printed wiring board, comprising: first heat conducting means protruding from the electronic component; a heat radiating portion; and a heat radiating portion protruding from the heat radiating portion. A heat dissipating body having second heat conducting means, and the first heat conducting means of the electronic component mounted on the printed wiring board while being laminated on the printed wiring board. The second heat conducting means of the radiator is provided with a heat conducting layer that is thermally conductively coupled to the second heat conducting means, and heat generated by an electronic component mounted on the printed wiring board is transferred to the first heat conducting means. A method for radiating heat from a printed circuit board, characterized in that the heat is radiated by being transmitted to the radiator through the heat conducting layer and the second heat conducting means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5269485A JPH07106721A (en) | 1993-10-04 | 1993-10-04 | Printed circuit board and heat radiating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5269485A JPH07106721A (en) | 1993-10-04 | 1993-10-04 | Printed circuit board and heat radiating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07106721A true JPH07106721A (en) | 1995-04-21 |
Family
ID=17473102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5269485A Pending JPH07106721A (en) | 1993-10-04 | 1993-10-04 | Printed circuit board and heat radiating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07106721A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000216307A (en) * | 1999-01-20 | 2000-08-04 | Nec Corp | Amplifying device |
| WO2004068923A1 (en) * | 2003-01-28 | 2004-08-12 | Cmk Corporation | Metal core multilayer printed wiring board |
| JP2006318986A (en) * | 2005-05-10 | 2006-11-24 | Sumitomo Electric Printed Circuit Inc | Flexible printed circuit board and its manufacturing method |
| JP2006339588A (en) * | 2005-06-06 | 2006-12-14 | Nitto Denko Corp | Wiring circuit substrate |
| JP2009088571A (en) * | 2009-01-26 | 2009-04-23 | Sumitomo Electric Printed Circuit Inc | Flexible printed circuit board and its manufacturing method |
| JP2009094303A (en) * | 2007-10-10 | 2009-04-30 | Nec Access Technica Ltd | Through-hole structure and printed circuit board using the same |
| JP2013138068A (en) * | 2011-12-28 | 2013-07-11 | Denso Corp | Multilayer printed board |
| JP2016207743A (en) * | 2015-04-17 | 2016-12-08 | 新光電気工業株式会社 | Wiring board and manufacturing method therefor, and semiconductor device |
| JP2020047867A (en) * | 2018-09-20 | 2020-03-26 | Fdk株式会社 | Module and printed circuit board |
-
1993
- 1993-10-04 JP JP5269485A patent/JPH07106721A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000216307A (en) * | 1999-01-20 | 2000-08-04 | Nec Corp | Amplifying device |
| WO2004068923A1 (en) * | 2003-01-28 | 2004-08-12 | Cmk Corporation | Metal core multilayer printed wiring board |
| US7087845B2 (en) | 2003-01-28 | 2006-08-08 | Cmk Corporation | Metal core multilayer printed wiring board |
| JP2006318986A (en) * | 2005-05-10 | 2006-11-24 | Sumitomo Electric Printed Circuit Inc | Flexible printed circuit board and its manufacturing method |
| JP2006339588A (en) * | 2005-06-06 | 2006-12-14 | Nitto Denko Corp | Wiring circuit substrate |
| JP2009094303A (en) * | 2007-10-10 | 2009-04-30 | Nec Access Technica Ltd | Through-hole structure and printed circuit board using the same |
| JP2009088571A (en) * | 2009-01-26 | 2009-04-23 | Sumitomo Electric Printed Circuit Inc | Flexible printed circuit board and its manufacturing method |
| JP2013138068A (en) * | 2011-12-28 | 2013-07-11 | Denso Corp | Multilayer printed board |
| JP2016207743A (en) * | 2015-04-17 | 2016-12-08 | 新光電気工業株式会社 | Wiring board and manufacturing method therefor, and semiconductor device |
| JP2020047867A (en) * | 2018-09-20 | 2020-03-26 | Fdk株式会社 | Module and printed circuit board |
| CN110931447A (en) * | 2018-09-20 | 2020-03-27 | Fdk株式会社 | Module and printed circuit board |
| CN110931447B (en) * | 2018-09-20 | 2023-10-10 | Fdk株式会社 | Control module and printed board |
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| LAPS | Cancellation because of no payment of annual fees |