JPH1098287A - Cooler for circuit board module and portable electronic equipment having the cooler - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent disturbances to a wiring formed on a circuit board by providing a circuit board, which has a thermal conductive layer for radiation with a high thermal conductivity provided in an insulating layer, then forming an aperture for exposing the thermal conductive layer in the insulating layer, and conducting the heat of an electronic component mounted on the circuit board to the thermal conductive layer from the aperture. SOLUTION: A circuit board 23 is formed in a multilayer structure in which a thermal conductive layer 25 for radiation with a high thermal conductivity and a signal wiring layer 26 are buried in an insulating layer 24. On the surface of the circuit board 23, an aperture 34 is formed for exposing the thermal conductive layer 25 in the insulating layer 24 to a mounting portion of a TCP component 27. In addition, a metal plate (thermal conduction means) 35, having substantially the same size as a semiconductor ship 29 and having high thermal conductivity, is mounted in a buried state in the aperture 34 of the circuit board 23. When a personal computer is operated, the semiconductor chip 29 of the TCP component 27 is heated. In this case, the heat of the semiconductor chip 29 is conducted to the thermal conductive layer 25 in the insulating layer 24, through the metal plate 35 in the aperture 34 on the surface side of the circuit board 23.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to, for example, TCP (T
The present invention relates to a cooling device for a circuit board module on which a circuit element that generates heat during operation, such as an ape carrer package, and a portable electronic device having the cooling device.

[0002]

2. Description of the Related Art Generally, various types of circuit board modules are incorporated in a portable electronic device such as a notebook computer. Then, as shown in FIG. 5, the MPU is mounted on a circuit board 1 which is a printed wiring board as this circuit board module.
Also, a configuration in which a TCP (Tape Carrer Package) component 2 such as an ASIC is mounted has been developed.

The TCP component 2 has a flexible resin film 3 and a semiconductor chip 4 supported by the resin film 3.
Are provided. Here, a large number of conductive leads 5 are formed on the resin film 3. These leads 5
Are drawn out from the outer peripheral edge of the resin film 3 and are soldered to the connection pads 6 on the circuit board 1.

In this type of TCP component 2, the semiconductor chip 4 is not molded with resin, and the semiconductor chip 4 is exposed to the outside. Therefore, T
The CP component 2 has lower mechanical strength than a PGA (pin grid array) component, and generates a large amount of heat during operation.

[0005] As a cooling means for the TCP component 2 mounted on the circuit board 1, a cooling means having a configuration shown in FIG. 5 has been developed. Here, a through hole 7 larger than the semiconductor chip 4 of the TCP component 2 is formed at the mounting position of the TCP component 2 on the circuit board 1.

Further, the back surface of the circuit board 1 (TCP component 2)
The cold plate 8 is disposed on the surface opposite to the mounting surface of the substrate. On one surface side of the cold plate 8, a projection 8a to be fitted into the through hole 7 is formed. The semiconductor chip 4 of the TCP component 2 is joined to the tip surface of the projection 8a without any gap. Further, a large number of fins 8b are protruded from the other surface of the cold plate 8. Then, the heat of the TCP component 2, which generates heat during operation, is conducted from the semiconductor chip 4 to the cold plate 8, and is cooled by natural air cooling from the cold plate 8 or forced air cooling from a fan (not shown). .

[0007]

However, in the above-mentioned prior art, since the large through hole 7 is formed in the circuit board 1 which is a printed wiring board, there is a problem that the wiring formed on the circuit board 1 becomes an obstacle. is there.

Further, a cold plate 8 is provided on the back side of the TCP component 2 which is a heat-generating component mounted on the circuit board 1.
Is mounted, the weight of the entire circuit board module becomes heavy, and the component mounting and wiring cannot be performed on the back surface of the mounting portion of the TCP component 2 on the circuit board 1, which poses a problem in downsizing the entire circuit board module. is there.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to prevent the wiring formed on a circuit board from becoming an obstacle, and to mount components on the back surface of a mounting portion of a heat generating component on the circuit board. Also, the present invention provides a circuit board module cooling device advantageous in miniaturizing the entire circuit board module and reducing the size of the housing of the portable electronic device by enabling wiring, and a portable electronic device having the cooling device. Is to do.

[0010]

According to a first aspect of the present invention, there is provided a circuit board provided with a heat transfer layer having a high heat transfer property in an insulating layer, and exposing the heat transfer layer to the insulating layer. And a heat transfer means for transferring heat of the electronic components mounted on the circuit board from the opening to the heat transfer layer. is there. With the above configuration, the heat of the electronic component is transferred from the opening of the insulating layer to the heat transfer layer in the insulating layer to dissipate heat, so that the electronic component is also provided on the back surface of the mounting portion of the electronic component that generates heat on the circuit board. Mounting and wiring can be performed so that high-density mounting can be realized.

According to a second aspect of the present invention, the heat transfer means embeds a heat transfer member having good heat conductivity in the opening of the circuit board, and transfers heat of the electronic component through the heat transfer member. 2. The cooling device for a circuit board module according to claim 1, wherein heat is transferred to the layer. With the above configuration, the same effect as the first aspect of the present invention can be obtained by transferring the heat of the electronic component to the heat transfer layer in the insulating layer via the heat transfer member embedded in the opening of the circuit board. It was made.

According to a third aspect of the present invention, in the first or second aspect, the heat transfer layer is formed by an electric ground layer and includes means for connecting to a ground of the electronic component. It is a cooling device of the circuit board module described. According to the above configuration, the electrical ground layer, which is the heat transfer layer in the insulating layer, is connected to the ground of the electronic component, so that the electrical stability is obtained in addition to the effect described in claim 1. is there.

According to a fourth aspect of the present invention, there is provided a circuit board provided with a heat transfer layer for heat dissipation having a high heat conductivity in an insulating layer, and a first opening for exposing the heat transfer layer to the insulating layer. And heat transfer means for transferring heat of the electronic component mounted on the circuit board from the first opening to the heat transfer layer, and the insulating layer has a first opening and a second opening. Forming a second opening exposing the heat transfer layer at a different position, further contacting the heat transfer layer through the second opening,
A cooling device for a circuit board module, comprising a heat radiating plate for radiating heat of the heat transfer layer. With the above configuration, the heat of the electronic component is transferred from the opening of the insulating layer to the heat transfer layer in the insulating layer, and the heat of the heat transfer layer is further radiated from the radiator plate so that the heat radiating effect is further improved. It was done.

According to a fifth aspect of the present invention, there is provided a circuit board in which a heat transfer layer for heat radiation having high heat conductivity is provided in an insulating layer, and a first opening for exposing the heat transfer layer to the insulating layer. And heat transfer means for transferring heat of the electronic component mounted on the circuit board from the first opening to the heat transfer layer, and the first opening in the insulating layer. Is provided with a through hole connected to the heat transfer layer at a different position, further provided with a radiator plate connected to the through hole, the heat of the heat transfer layer is transferred through the through hole. This is a cooling device for a circuit board module to be used. According to the above configuration, the heat of the electronic component is transferred from the opening of the insulating layer to the heat transfer layer in the insulating layer, and further from the heat transfer layer to the heat radiating plate through the through hole, thereby further improving the heat radiating effect. It is like that.

According to a sixth aspect of the present invention, there is provided a circuit board having a heat transfer layer for heat radiation having high heat conductivity provided in an insulating layer, and an opening for exposing the heat transfer layer is formed in the insulating layer. A heat transfer means for transferring heat of the electronic components mounted on the circuit board from the opening to the heat transfer layer to form a cooling device for the circuit board module; Arrange the above circuit board module inside the body,
A portable electronic device having a cooling device for a circuit board module, wherein a heat radiating means for transferring heat of the heat transfer layer to the housing and radiating the heat is provided. With the above configuration, the heat of the electronic component is transferred from the opening of the insulating layer to the heat transfer layer in the insulating layer, and the heat of the heat transfer layer is further transferred to the housing of the portable electronic device body and radiated. Thereby, the heat radiation effect is further improved.

According to a seventh aspect of the present invention, the heat radiating means includes a heat radiating plate in contact with the heat transfer layer, and the heat radiating plate is brought into contact with the housing to transfer heat. Item 7. A portable electronic device according to item 6. With the above configuration, the heat of the heat transfer layer of the circuit board is radiated to the housing via the radiator plate, so that the heat radiation effect is further improved.

According to the present invention, there is provided a circuit board having a heat transfer layer for heat radiation having high heat conductivity provided in an insulating layer, and a first opening for exposing the heat transfer layer to the insulating layer. And heat transfer means for transferring heat of the electronic component mounted on the circuit board from the first opening to the heat transfer layer, and the insulating layer has a first opening and a second opening. Forming a second opening exposing the heat transfer layer at a different position, further contacting the heat transfer layer through the second opening,
A heat radiating plate for radiating heat of the heat transfer layer is provided to constitute a cooling device for the circuit board module, and further, the circuit board module is provided inside a housing of the portable electronic device main body, and A portable electronic device having a cooling device for a circuit board module, wherein a heat radiating means is provided for contacting a housing to conduct heat and radiating heat from the housing.
With the above configuration, the heat of the electronic component is transferred from the opening of the insulating layer to the heat transfer layer in the insulating layer, and the heat of the heat transfer layer is further radiated to the housing via the heat sink. .

According to a ninth aspect of the present invention, there is provided a circuit board having a heat transfer layer for heat radiation having high heat conductivity provided in an insulating layer, and a first opening for exposing the heat transfer layer to the insulating layer. And heat transfer means for transferring heat of the electronic component mounted on the circuit board from the first opening to the heat transfer layer, and the first opening in the insulating layer. Is provided with a through-hole connected to the heat transfer layer at a different position, further provided with a radiator plate connected to the through-hole, the heat of the heat transfer layer is transferred through the through-hole of the circuit board module A radiator for constituting a cooling device, further arranging the circuit board module inside a housing of the portable electronic device main body, bringing the radiator plate into contact with the housing to conduct heat, and radiating heat from the housing; Circuit board module characterized by providing It is a portable electronic device having a cooling apparatus Lumpur. With the above configuration, the heat of the electronic component is transferred from the opening of the insulating layer to the heat transfer layer in the insulating layer, and from the heat transfer layer, through the through hole, and further to the case via the heat sink. It was done.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIGS. FIG. 1 shows the overall appearance of the notebook personal computer 11 in the present embodiment. The personal computer 11 is provided with a housing 12 having a flat, substantially box shape, and a flat panel display unit 13 supported by the housing 12. Further, the housing 12 is divided into a lower housing 14 and an upper housing 15. Here, the lower housing 14 is formed of a metal material having high thermal conductivity, and the upper housing 15 is formed of a synthetic resin material such as ABS resin.

A keyboard 16 is provided on the upper surface of the housing 12.
Are arranged. An armrest 17 is provided on the front side of the keyboard 16. Further, display support protrusions 18 are provided at the rear end of the upper surface of the housing 12 on both right and left sides to protrude upward. Each of these display support projections 18 is formed with a support hole in the shape of a horizontal hole whose inner surface is opened.

The display unit 13 is provided with a flat box-shaped housing 19 and a liquid crystal display 20 housed inside the housing 19. Further, a connecting portion 21 with the housing 12 is provided at one end of the housing 19. The connecting portion 21 is provided with a pair of pivoting legs inserted into the respective support holes of the left and right display support projections 18. The display unit 13 is supported so as to be rotatable around the connecting portion 21 in a state where the pivoting support legs are inserted into the support holes of the left and right display support protrusions 18.

A frame (not shown) is provided inside the lower housing 14 of the housing 12. The frame supports a hard disk drive (not shown), a floppy disk drive, and the circuit board module 22 of the present embodiment shown in FIG.

The circuit board module 22 is provided with a circuit board 23 which is a printed wiring board. This circuit board 23 is formed in a multilayer structure in which a heat transfer layer 25 having high heat transfer and a signal wiring layer 26 are embedded in an insulating layer 24. Here, the thickness of the heat transfer layer 25 is equal to that of the signal wiring layer 2.
The thickness of the heat transfer layer 25 is set to be larger than the thickness of the signal wiring layer 26 so as to improve the thermal conductivity. A part of the insulating layer 24 is interposed between the heat transfer layer 25 in the insulating layer 24 and the signal wiring layer 26, and the two layers are laminated in a state where they are insulated.
Further, signal wiring layers 26 are also formed on the front surface (upper surface in FIG. 2) and the back surface (lower surface in FIG. 2) of the circuit board 23, respectively.

On the surface of the circuit board 23, a TCP component (electronic component) 27 is mounted. This TCP part 2
7, a rectangular frame-shaped carrier 28 made of a flexible resin film and a substantially square semiconductor chip 29 supported by the carrier 28 are provided. Here, a large number of conductive leads 30 made of copper foil are formed on the carrier 28 by etching. The tips of these leads 30 are led out from the outer peripheral edge of the carrier 28.

Further, a plurality of bumps 31 are formed on the outer peripheral portion of the surface of the semiconductor chip 29. The base ends of the leads 30 are bonded to these bumps 31. The joint between the bump 31 and the lead 30 is sealed with a potting resin 32. In addition,
The back surface of the semiconductor chip 29 is exposed to the outside without being covered with the potting resin 32. Then, conductive plating is applied to the entire back surface of the semiconductor chip 29.

The tip of the lead 30 of the TCP component 27 is connected to a connection pad 33 formed on the surface of the circuit board 23.
Soldered. These connection pads 33 are electrically connected to desired signal wiring layers 26 of the circuit board 23.

On the surface of the circuit board 23, an opening 34 for exposing the heat transfer layer 25 in the insulating layer 24 is formed at the mounting portion of the TCP component 27. This opening 34 is T
The opening area of the CP component 27 is set to be larger than that of the semiconductor chip 29.

Further, a metal plate (heat transfer means) 35 having substantially the same size as the semiconductor chip 29 and having good heat conductivity is embedded in the opening 34 of the circuit board 23. Here, the lower surface of the metal plate 35 and the heat transfer layer 25 are joined via a heat conductive grease or a heat conductive adhesive so as not to impair the heat conductivity. It is configured to conduct heat between them.

The TCP component 2 is provided on the upper surface of the metal plate 35.
Seven semiconductor chips 29 are mounted. Here, the upper surface of the metal plate 35 and the lower surface of the semiconductor chip 29 are joined via a heat conductive grease or a heat conductive adhesive so as not to impair the heat conductivity. As a result, heat released from the semiconductor chip 29 of the TCP component 27 is
Through the heat transfer layer 25.

A first cool plate 36 and a second cool plate 37 are mounted on the back surface of the circuit board 23. Here, the first cool plate 36 has a substantially flat cool plate body 36a having a large heat transfer area.
And a convex portion 36b protruding from one surface side of the cool plate main body 36a. A screw hole 36c is formed on the tip end surface of the projection 36b.

Further, a concave portion 38 into which the convex portion 36b of the first cool plate 36 is inserted is formed on the back surface of the circuit board 23.
Are formed. The heat transfer layer 25 is exposed at the inner bottom of the recess 38. Note that the recess 38 is disposed on the surface of the circuit board 23 at a position different from the mounting position of the TCP component 27.

A recess 3 is formed on the front side of the circuit board 23.
8 are formed.
The fixing screw 40 of the first cool plate 36 is inserted into the through hole 39. The tip of the fixing screw 40 is connected to the screw hole 3 of the first cool plate 36.
6c, the first cool plate 3
6 with the projections 36b joined to the heat transfer layer 25,
Is mounted on the back surface of the circuit board 23. Thereby, the heat of the heat transfer layer 25 is transferred to the first cool plate 36, and the first cool plate 3
6 is radiated.

The second cool plate 37 is provided with a substantially flat cool plate body 37a having a large heat transfer area. A plurality of screw holes 37b are formed in the cool plate main body 37a.

A plurality of through holes 41 for mounting a second cool plate are formed on the front side of the circuit board 23 at a position different from the mounting position of the TCP component 27. These through holes 41 penetrate to the back side of the circuit board 23. Further, a heat transfer member 42 having conductivity and high heat conductivity is mounted on the peripheral wall of each through hole 41. The heat transfer member 42 of each through hole 41 is joined to the heat transfer layer 25.

The fixing screw 43 of the second cool plate 37 is inserted into each through hole 41. The tip of each fixing screw 43 is the second cool plate 3
The second cool plate 37 is attached to the back surface of the circuit board 23 by being screwed into the screw hole 37b of No. 7. Thereby, the heat of the heat transfer layer 25 is transferred to each through hole 4.
The heat is transferred to the second cool plate 37 via the first heat transfer member 42 and is radiated from the second cool plate 37.

The signal wiring layer 26 is provided on the back surface of the circuit board 23, and various electronic components 44 are mounted thereon. The signal wiring layer 26 and the electronic component 44 are mounted on the back surface of the mounting portion of the TCP component 27 in the same manner as the other portions.

Next, the operation of the above configuration will be described.
When the personal computer 11 operates, the semiconductor chip 29 of the TCP component 27 generates heat. At this time, the heat of the semiconductor chip 29 is conducted to the heat transfer layer 25 in the insulating layer 24 via the metal plate 35 in the opening 34 on the front side of the circuit board 23. Therefore, the heat of the semiconductor chip 29 is transferred to the heat transfer layer 25 in the insulating layer 24.
The semiconductor chip 29 can be dissipated and dissipated, so that the heat dissipation of the semiconductor chip 29 can be enhanced, and the cooling effect of the semiconductor chip 29 can be enhanced.

The heat conducted to the heat transfer layer 25 is further transferred to the heat transfer layer 25 and the convex portions 36 b of the first cool plate 36.
The heat is transferred to the first cool plate 36 through the junction with the first cool plate 36 and is radiated from the first cool plate 36. At this time, the heat of the heat transfer layer 25 is simultaneously applied to each of the through holes 41.
The heat is transferred to the second cool plate 37 via the heat transfer member 42, and is radiated from the second cool plate 37. Therefore, the heat of the semiconductor chip 29 is conducted to the heat transfer layer 25 in the insulating layer 24, and the heat of the heat transfer layer 25 is further transferred to the first cool plate 36 and the second cool plate 3.
Since the heat can be transferred to the heat sink 7 to dissipate the heat, the heat dissipation of the semiconductor chip 29 can be further enhanced, and the cooling effect of the semiconductor chip 29 can be further enhanced.

Therefore, the above configuration has the following effects. That is, the circuit board 2 in which the heat transfer layer 25 for heat dissipation is disposed in the insulating layer 24 of the circuit board module 22
3 is provided, and the heat of the TCP component 27 mounted on the circuit board 23 is transferred from the opening 34 formed in the insulating layer 24 to the heat transfer layer 25 via the metal plate 35 to dissipate the heat. The electronic component 44 can be mounted and the signal wiring layer 26 can be provided also on the back surface of the portion where the TCP component 27 is mounted on the substrate 23. For this reason, the circuit board 23
The electronic component 44 is mounted on the back side of the mounting part of the TCP component 27 on the circuit board 23, as in the case where a through hole 7 (see FIG. 5) penetrating to the rear side is formed in the mounting part of the TCP component 27 in FIG. Higher-density mounting can be realized as compared with the case where the signal wiring layer 26 cannot be provided.

The TCP component 2 is provided on the surface of the circuit board 23.
A recess 38 is formed on the back surface of the insulating layer 24 at a location different from the portion on which the first cooling plate 7 is mounted, and the projection of the first cool plate 36 inserted into the recess 38 is formed. Since the first cool plate 36 is attached to the back surface of the circuit board 23 in a state where the portion 36b is joined to the heat transfer layer 25, heat from the TCP components 27 is radiated through the metal plate 35. The heat of 25 can be transferred to the first cool plate 36 and radiated from the first cool plate 36. Therefore, the heat dissipation effect of the heat transfer layer 25 can be enhanced, and the cooling effect of the semiconductor chip 29 can be further enhanced.

Further, the circuit board 2 is placed in a place different from the portion where the TCP component 27 is mounted on the surface of the circuit board 23.
A plurality of through-holes 41 for attaching a second cool plate, which penetrates to the back surface side of No. 3, are formed, and the heat transfer member 42 mounted on the peripheral wall of each through-hole 41 is joined to the heat transfer layer 25 to form Fixing screw 4 inserted into through hole 41
3, the second cool plate 37 is attached to the back surface of the circuit board 23, so that the heat from the TCP component 27 is radiated through the metal plate 35 to the heat transfer layer 25 and the heat transfer member of each through hole 41. The second cool plate 3 via 42
7, and the heat can be radiated from the second cool plate 37. Therefore, the heat dissipation effect of the heat transfer layer 25 can be further enhanced, and the cooling effect of the semiconductor chip 29 can be enhanced.

In this embodiment, a soft cool sheet (heat transfer sheet) having good heat conductivity may be used instead of the metal plate 35 in the present embodiment. This cool sheet is a rubber-like elastic body obtained by adding alumina to a silicone resin, for example, and has thermal conductivity. Also in this case, the temperature of the TCP component 27 can be reduced as in the case of the metal plate 35 of the first embodiment.

Further, the heat transfer layer 25 in the circuit board 23 can be electrically a ground layer. In this case, the electrical ground layer, which is the heat transfer layer 25 in the insulating layer 24, is replaced by TCP.
By connecting to the ground of the component 27, the TCP component 27 can be electrically stabilized.

FIG. 3 shows a second embodiment of the present invention. In the present embodiment, the configuration of the circuit board module 22 of the first embodiment (see FIG. 2) is changed as follows. That is, the semiconductor chip 29 of the TCP component 27 is mounted in the opening part 34 of the circuit board 23 in an embedded state. Here, the semiconductor chip 29
Is bonded to the heat transfer layer 25 via a heat conductive grease or a heat conductive adhesive so as not to impair the heat conductivity, and the heat conduction between the semiconductor chip 29 and the heat transfer layer 25 is directly performed. It is configured to be performed.

In this embodiment, the heat of the semiconductor chip 29 of the TCP component 27, which generates heat when the personal computer 11 operates, is transferred from the semiconductor chip 29 in the opening 34 on the front side of the circuit board 23 to the heat transfer layer 25 in the insulating layer 24. Is conducted directly to Therefore, the heat of the semiconductor chip 29 is transferred to the heat transfer layer 25 in the insulating layer 24.
In this case as well, the heat dissipation of the semiconductor chip 29 can be enhanced and the cooling effect of the semiconductor chip 29 can be enhanced as in the first embodiment.

FIG. 4 shows a third embodiment of the present invention. In this embodiment, the TCP component 27 is brought into contact with the first cool plate 36 and the second cool plate 37 of the first embodiment (see FIG. 2) by contacting the lower housing 14 of the housing 12 of the personal computer 11. In this configuration, the heat radiation effect of the semiconductor chip 29 is further enhanced.

That is, in the present embodiment, a plurality of bosses 51 for attaching the first cool plate
And a plurality of bosses 5 for attaching a second cool plate
2 project upward. Further, a screw hole 53 is formed in each of the bosses 51 and 52.

The first cool plate 36 and the second cool plate 37 are formed with screw insertion holes 54, respectively. These screw insertion holes 54 are formed at positions corresponding to the screw holes 53 of the bosses 51 and 52 of the housing 12. Then, the fixing screw 55 for attaching the first cool plate is inserted into the screw insertion hole 54 of the first cool plate 36, and the tip of each fixing screw 55 is screwed into the screw hole 53 of each boss 51. By doing
A first cool plate 36 is mounted on the bottom surface of the housing 12. Similarly, the fixing screw 56 for attaching the second cool plate is connected to the screw insertion hole 5 of the second cool plate 37.
4 and the tip of each fixing screw 56 is
The second cool plate 37 is attached to the bottom surface of the housing 12 by being screwed into the screw hole portion 53.

Therefore, in this embodiment, the first cool plate 36 and the second cool plate 37 are brought into contact with the lower housing 14 of the housing 12 of the personal computer 11, so that the heat of the heat transfer layer 25 is The heat can be transferred to the heat-conductive casing 12 via the cool plate 36 and the second cool plate 37 to release the heat. for that reason,
In the present embodiment, the heat dissipation effect of the heat transfer layer 25 can be further enhanced as compared with the first and second embodiments, and
Since the cooling effect of the semiconductor chip 29 of the component 27 can be further enhanced, it is advantageous in miniaturizing the entire circuit board module 22 and miniaturizing the housing 12 of the personal computer 11.

It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications can be made without departing from the spirit of the present invention. For example, the bosses 51 and 52 of the housing 12 of the third embodiment (see FIG. 4) are inserted into the recesses 38 on the back surface of the circuit board 23, and
5 or may be in direct contact with the heat transfer member 42 of each through-hole 41. In this case, the same heat radiation effect can be provided.

[0051]

According to the first aspect of the present invention, a circuit board provided with a heat transfer layer having high heat conductivity for heat dissipation is provided in an insulating layer, and an opening for exposing the heat transfer layer is formed in the insulating layer. And a heat transfer means for transferring heat of the electronic component mounted on the circuit board from the opening to the heat transfer layer, and transferring the heat of the electronic component from the opening of the insulating layer to the heat transfer layer in the insulating layer. Since the heat is transferred to dissipate the heat, there is no risk of the wiring formed on the circuit board becoming a hindrance. This is advantageous in reducing the size of the entire module to reduce the size of the housing of the portable electronic device.

According to the second aspect of the present invention, the heat of the electronic component is transferred to the heat transfer layer in the insulating layer via the heat transfer member embedded in the opening of the circuit board. The same effect as the invention can be obtained.

According to the third aspect of the present invention, by connecting the electrical ground layer, which is the heat transfer layer in the insulating layer, to the ground of the electronic component, in addition to the effects described in the first aspect,
It can be electrically stabilized.

According to the present invention, the heat of the electronic component is transferred from the opening of the insulating layer to the heat transfer layer in the insulating layer, and the heat of the heat transfer layer is further radiated from the radiator plate. The heat radiation effect is further improved.

According to the fifth aspect of the present invention, the heat of the electronic component is transferred from the opening of the insulating layer to the heat transfer layer in the insulating layer, and the heat is further transferred from the heat transfer layer to the heat sink through the through hole. Thereby, the heat radiation effect is further improved.

According to the invention of claim 6, the heat of the electronic component is transferred from the opening of the insulating layer to the heat transfer layer in the insulating layer, and the heat of the heat transfer layer is further transferred to the housing of the portable electronic device body. By dissipating the heat and dissipating the heat, the heat dissipating effect is further improved.

According to the seventh aspect of the present invention, the heat of the heat transfer layer of the circuit board is radiated to the housing via the heat radiating plate, so that the heat radiating effect is further improved. According to the invention of claim 8, the heat of the electronic component is transferred from the opening of the insulating layer to the heat transfer layer in the insulating layer, and the heat of the heat transfer layer is further radiated to the housing via the heat sink. Can be.

According to the ninth aspect, the heat of the electronic component is transferred from the opening of the insulating layer to the heat transfer layer in the insulating layer, and the heat transfer layer passes through the through-hole and further through the heat sink. Heat can be conducted to the housing.

[Brief description of the drawings]

FIG. 1 is an exemplary perspective view showing the external appearance of an entire notebook personal computer according to a first embodiment of the present invention;

FIG. 2 is an exemplary longitudinal sectional view showing a schematic configuration inside the personal computer according to the embodiment;

FIG. 3 is a longitudinal sectional view showing a schematic configuration inside a personal computer according to a second embodiment of the present invention.

FIG. 4 is a longitudinal sectional view showing a schematic configuration inside a personal computer according to a third embodiment of the present invention.

FIG. 5 is a longitudinal sectional view of a main part showing a conventional cooling structure for TCP parts.

[Explanation of symbols]

 Reference Signs List 23 circuit board 24 insulating layer 25 heat transfer layer 27 TCP component (electronic component) 34 opening 35 metal plate (heat transfer means)

Claims (9)

[Claims] 1. A circuit board having a heat transfer layer for heat radiation having high heat conductivity provided in an insulating layer, an opening for exposing the heat transfer layer is formed in the insulating layer, and the circuit board is provided. A cooling device for a circuit board module, further comprising heat transfer means for transferring heat of an electronic component mounted on the heat transfer layer from the opening to the heat transfer layer. 2. The heat transfer means embeds a heat transfer member having good thermal conductivity in the opening of the circuit board, and transfers heat of the electronic component to the heat transfer layer via the heat transfer member. The cooling device for a circuit board module according to claim 1, wherein 3. The circuit board module according to claim 1, wherein the heat transfer layer is formed by an electric ground layer, and includes means for connecting to a ground of the electronic component. Cooling system. 4. A circuit board having a heat transfer layer for heat radiation having high heat conductivity provided in an insulating layer, a first opening for exposing the heat transfer layer is formed in the insulating layer, A heat transfer means for transferring heat of the electronic component mounted on the circuit board from the first opening to the heat transfer layer; and providing the insulating layer at a position different from the first opening. A second opening for exposing the heat transfer layer is formed, and a heat radiating plate is provided for contacting the heat transfer layer through the second opening and radiating heat of the heat transfer layer. Cooling device for circuit board module. 5. A circuit board in which a heat transfer layer having high heat conductivity for heat dissipation is provided in an insulating layer, and a first opening for exposing the heat transfer layer is formed in the insulating layer. A heat transfer means for transferring heat of the electronic component mounted on the circuit board from the first opening to the heat transfer layer; and providing a heat transfer means in the insulating layer at a position different from the first opening. A through hole connected to the heat transfer layer, further provided with a radiator plate connected to the through hole, wherein the heat of the heat transfer layer is transferred through the through hole. Cooling system. 6. A circuit board provided with a heat transfer layer for heat radiation having high heat conductivity provided in an insulating layer, an opening for exposing the heat transfer layer is formed in the insulating layer, and the circuit board is provided. A heat transfer means for transferring heat of the electronic component mounted on the heat transfer layer from the opening to the heat transfer layer to form a cooling device for the circuit board module; and A portable electronic device having a cooling device for a circuit board module, comprising a circuit board module, and a heat radiating means for transferring the heat of the heat transfer layer to the housing and radiating the heat. 7. The heat dissipating means according to claim 6, wherein said heat dissipating means includes a heat dissipating plate in contact with said heat transfer layer, and said heat dissipating plate contacts said housing to transfer heat. Portable electronic devices. 8. A circuit board having a heat transfer layer for heat radiation having a high heat conductivity provided in an insulating layer, a first opening for exposing the heat transfer layer is formed in the insulating layer, A heat transfer means for transferring heat of the electronic component mounted on the circuit board from the first opening to the heat transfer layer; and providing the insulating layer at a position different from the first opening. Forming a second opening for exposing the heat transfer layer, further providing a radiator plate for contacting the heat transfer layer through the second opening and radiating heat of the heat transfer layer, and cooling the circuit board module; A heat radiation means for arranging the circuit board module inside a housing of the main body of the portable electronic device, contacting the heat radiating plate with the housing to conduct heat, and radiating heat from the housing. Mobile phone having a circuit board module cooling device, characterized by being provided Electronic devices. 9. A circuit board having a heat transfer layer for heat radiation having a high heat transfer property provided in an insulating layer, a first opening for exposing the heat transfer layer is formed in the insulating layer, A heat transfer means for transferring heat of the electronic component mounted on the circuit board from the first opening to the heat transfer layer; and providing a heat transfer means in the insulating layer at a position different from the first opening. A cooling device for a circuit board module is provided by providing a through hole connected to the heat transfer layer and further providing a radiator plate connected to the through hole and transmitting heat of the heat transfer layer through the through hole. Further, the circuit board module is disposed inside the housing of the main body of the portable electronic device, and the heat radiating plate is provided with a heat radiating means for bringing the heat radiating plate into contact with the housing to conduct heat and radiating heat from the housing. Characteristic circuit board module cooling device Portable electronic device having.