JPH0332488U - - Google Patents
Info
- Publication number
- JPH0332488U JPH0332488U JP9381689U JP9381689U JPH0332488U JP H0332488 U JPH0332488 U JP H0332488U JP 9381689 U JP9381689 U JP 9381689U JP 9381689 U JP9381689 U JP 9381689U JP H0332488 U JPH0332488 U JP H0332488U
- Authority
- JP
- Japan
- Prior art keywords
- conductor layer
- housing
- inner conductor
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000011521 glass Substances 0.000 description 1
Description
第１図は本考案の実施例の断面図、第２図は従
来例の断面図である。
図において、１……筺体、２……カバー、３，
１０……プリント配線板、４……導体パターン、
５……半導体部品、６……リード、７……ガラス
端子、８……回路部品、９……Ｌ形金具、１１…
…最下部導体層、１２……内部導体層、１３……
バイヤホール、１５，１６……接着媒体、１８…
…テープキヤリア、２０……凹部、２１……切欠
部をそれぞれ示す。
FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional example. In the figure, 1... Housing, 2... Cover, 3,
10...Printed wiring board, 4...Conductor pattern,
5...Semiconductor parts, 6...Leads, 7...Glass terminals, 8...Circuit components, 9...L-shaped fittings, 11...
...Lowest conductor layer, 12...Inner conductor layer, 13...
Via hole, 15, 16... Adhesive medium, 18...
. . . tape carrier, 20 . . . recessed portion, 21 . . . cutout portion, respectively.
Claims (1)
０が、金属筺体１に収容される電子装置において
、 該プリント配線板１０は、内部導体層１２と最
下部導体層１１とが、複数のバイヤホール１３を
介して接続されてなり、 該半導体部品５の底面を、熱伝導性の良い接着
媒体１５を用いて内部導体層１２に固着し、 該最下部導体層１１を熱伝導性の良い接着媒体
１６を用いて、該筺体１の底板１Ａに密着させる
とともに、 該内部導体層１２の周縁部を、該筺体１の側壁
１Ｂに半田付け固着したことを特徴とする半導体
部品の実装構造。[Scope of claim for utility model registration] Printed wiring board 1 on which semiconductor components 5 are surface mounted
0 is an electronic device housed in a metal housing 1, the printed wiring board 10 has an internal conductor layer 12 and a lowermost conductor layer 11 connected through a plurality of via holes 13, and the semiconductor component 5 is fixed to the inner conductor layer 12 using an adhesive medium 15 with good thermal conductivity, and the lowermost conductor layer 11 is attached to the bottom plate 1A of the housing 1 using an adhesive medium 16 with good thermal conductivity. A semiconductor component mounting structure characterized in that the inner conductor layer 12 is brought into close contact with the side wall 1B of the housing 1, and the peripheral edge of the inner conductor layer 12 is soldered and fixed to the side wall 1B of the housing 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9381689U JPH0332488U (en) | 1989-08-09 | 1989-08-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9381689U JPH0332488U (en) | 1989-08-09 | 1989-08-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0332488U true JPH0332488U (en) | 1991-03-29 |
Family
ID=31643179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9381689U Pending JPH0332488U (en) | 1989-08-09 | 1989-08-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0332488U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1098287A (en) * | 1996-09-19 | 1998-04-14 | Toshiba Corp | Cooler for circuit board module and portable electronic equipment having the cooler |
-
1989
- 1989-08-09 JP JP9381689U patent/JPH0332488U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1098287A (en) * | 1996-09-19 | 1998-04-14 | Toshiba Corp | Cooler for circuit board module and portable electronic equipment having the cooler |
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