JPH0446591U

JPH0446591U -

Info

Publication number: JPH0446591U
Application number: JP8937290U
Authority: JP
Priority date: 1990-08-27
Filing date: 1990-08-27
Publication date: 1992-04-21

Description

[Brief explanation of the drawing]

第１図はこの考案の一実施例の回路基板の放熱
構造の概略断面図、第２図は従来例の回路基板の
放熱構造の概略断面図である。Ｂ……回路基板の放熱構造、Ｂ１……回路基板
、Ｂ１２，Ｂ１３……電子部品、Ｂ１５……端子
、２１……筐体、２１ａ……表面、２１ｂ……内
面、２２，２３……凹部、２４……絶縁物。 FIG. 1 is a schematic sectional view of a heat dissipation structure for a circuit board according to an embodiment of the invention, and FIG. 2 is a schematic sectional view of a heat dissipation structure for a conventional circuit board. B... Heat dissipation structure of circuit board, B1... Circuit board, B12, B13... Electronic component, B15... Terminal, 21... Housing, 21a... Surface, 21b... Inner surface, 22, 23... Recessed part , 24...Insulator.

Claims

[Claims for Utility Model Registration] A heat dissipation structure for a circuit board in which a circuit board on which electronic components are mounted is brought into close contact with the inner surface of a casing to dissipate heat generated from the electronic components, wherein the circuit board is mounted on an upper surface. The electronic component includes a substrate on which a circuit pattern is formed and a through hole formed in a mounting part of the electronic component, and a terminal is inserted into the through hole and a tip of the terminal protrudes vertically downward from the bottom surface of the substrate. A heat dissipation structure for a circuit board, characterized in that a recess is provided in a portion of the inner surface of the casing that corresponds to a terminal of the electronic component, and the recess is filled with an insulator made of a material with good thermal conductivity.