JPS61166543U - - Google Patents
Info
- Publication number
- JPS61166543U JPS61166543U JP4963785U JP4963785U JPS61166543U JP S61166543 U JPS61166543 U JP S61166543U JP 4963785 U JP4963785 U JP 4963785U JP 4963785 U JP4963785 U JP 4963785U JP S61166543 U JPS61166543 U JP S61166543U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- substrate
- dissipation structure
- contact type
- type transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は、本考案の実施例を説明するためのａ
は要部断面図、ｂは要部平面図、第２図は、従来
のトランジスタの放熱構造を説明するための要部
断面図である。
図中、１は筐体、２はプリント基板、３はＴＲ
、４は電子部品、６は放熱器、７は半田、２２は
パターン形成側、２１は部品実装側、２３はパタ
ーン、２４はＴＲ用パターン、２５はスルーホー
ル用孔、６１は半田流入孔、をそれぞれ示す。
FIG. 1 is a diagram for explaining an embodiment of the present invention.
2 is a sectional view of the main part, b is a plan view of the main part, and FIG. 2 is a sectional view of the main part for explaining the heat dissipation structure of a conventional transistor. In the figure, 1 is the housing, 2 is the printed circuit board, and 3 is the TR
, 4 is an electronic component, 6 is a heatsink, 7 is solder, 22 is a pattern forming side, 21 is a component mounting side, 23 is a pattern, 24 is a pattern for TR, 25 is a hole for a through hole, 61 is a solder inflow hole, are shown respectively.
Claims (1)
スタ３の放熱構造を、 前記基板密着形トランジスタ３を前記プリント
基板２のパターン側２２に実装し、 前記基板密着形トランジスタ３の放熱器６を部
品実装側２１に付設して、 半田流入孔６１を穿設した放熱器６と基板密着
形トランジスタ３を複数のスルーホール用孔２５
を介して一体的に半田接着するようにしたことを
特徴とするトランジスタの放熱構造。[Claims for Utility Model Registration] A heat dissipation structure for a substrate-contact type transistor 3 mounted on a printed circuit board 2, wherein the substrate-contact type transistor 3 is mounted on the pattern side 22 of the printed circuit board 2; A heatsink 6 is attached to the component mounting side 21, and the heatsink 6 with solder inlet holes 61 and the substrate contact type transistor 3 are connected to the plurality of through-hole holes 25.
A heat dissipation structure for a transistor, characterized in that it is integrally soldered and bonded through a heat dissipation structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4963785U JPH0316289Y2 (en) | 1985-04-02 | 1985-04-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4963785U JPH0316289Y2 (en) | 1985-04-02 | 1985-04-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61166543U true JPS61166543U (en) | 1986-10-16 |
| JPH0316289Y2 JPH0316289Y2 (en) | 1991-04-08 |
Family
ID=30567025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4963785U Expired JPH0316289Y2 (en) | 1985-04-02 | 1985-04-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0316289Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003289191A (en) * | 2002-03-28 | 2003-10-10 | Denso Corp | Electronic control device |
-
1985
- 1985-04-02 JP JP4963785U patent/JPH0316289Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003289191A (en) * | 2002-03-28 | 2003-10-10 | Denso Corp | Electronic control device |
| US7031165B2 (en) | 2002-03-28 | 2006-04-18 | Denso Corporation | Electronic control unit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0316289Y2 (en) | 1991-04-08 |
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