JPS6144871U - Mounting structure of transistor on printed circuit board - Google Patents
Mounting structure of transistor on printed circuit boardInfo
- Publication number
- JPS6144871U JPS6144871U JP12923684U JP12923684U JPS6144871U JP S6144871 U JPS6144871 U JP S6144871U JP 12923684 U JP12923684 U JP 12923684U JP 12923684 U JP12923684 U JP 12923684U JP S6144871 U JPS6144871 U JP S6144871U
- Authority
- JP
- Japan
- Prior art keywords
- transistor
- circuit board
- printed circuit
- mounting structure
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例を示す斜視図、第２図は、別
の実施例を示す断面図、第３図は従来例を示す斜視図で
ある。
１・・・・・・リード、２・・・・・・プリント基板、
３，７・・・・・・穴、４ ”” トランジスタ、４ａ
・・・・・・ケース、５・・・・・・放熱板、６・・・
・・・セラミック基板からなる放熱板、８・・・・・・
導電部、９・・・・・・半田。FIG. 1 is a perspective view showing one embodiment of the present invention, FIG. 2 is a sectional view showing another embodiment, and FIG. 3 is a perspective view showing a conventional example. 1...Lead, 2...Printed circuit board,
3,7...hole, 4"" transistor, 4a
...Case, 5... Heat sink, 6...
... Heat sink made of ceramic substrate, 8...
Conductive part, 9...Solder.
Claims (2)
熱板を重合載置し、トランジスタのリードを前記プリン
ト基板及び放熱板の穴を貫通して、かつ前記放熱板に接
触した状態を保ってプリント基板の裏面に導出したこと
を特徴とするトランジスタのプリント基板への取付構造
。(1) Place a heat sink made of a ceramic substrate overlappingly on the surface of a printed circuit board, pass the transistor lead through the hole in the printed circuit board and the heat sink, and keep it in contact with the heat sink. A structure for mounting a transistor on a printed circuit board, characterized in that it is led out on the back side of the transistor.
け、トランジスタのリードと前記導電部を半田付けした
ことを特徴とする実用新案登録請求の範囲の第｛１｝項
に記載されたトランジスタのプリント基板への取付構造
。(2) According to item {1} of the claims registered as a utility model, a conductive part is provided on the inner periphery of each hole of the heat sink and the printed circuit board, and the conductive part is soldered to the lead of the transistor. Mounting structure of a transistor on a printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12923684U JPS6144871U (en) | 1984-08-28 | 1984-08-28 | Mounting structure of transistor on printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12923684U JPS6144871U (en) | 1984-08-28 | 1984-08-28 | Mounting structure of transistor on printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6144871U true JPS6144871U (en) | 1986-03-25 |
Family
ID=30687853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12923684U Pending JPS6144871U (en) | 1984-08-28 | 1984-08-28 | Mounting structure of transistor on printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6144871U (en) |
-
1984
- 1984-08-28 JP JP12923684U patent/JPS6144871U/en active Pending
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