JPS594646U - Heat sink mounting device - Google Patents

Heat sink mounting device

Info

Publication number
JPS594646U
JPS594646U JP10030282U JP10030282U JPS594646U JP S594646 U JPS594646 U JP S594646U JP 10030282 U JP10030282 U JP 10030282U JP 10030282 U JP10030282 U JP 10030282U JP S594646 U JPS594646 U JP S594646U
Authority
JP
Japan
Prior art keywords
heat sink
mounting device
sink mounting
semiconductor element
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10030282U
Other languages
Japanese (ja)
Inventor
一彦 冨田
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to JP10030282U priority Critical patent/JPS594646U/en
Publication of JPS594646U publication Critical patent/JPS594646U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

;   第1図は本考案の放熱板の取付装置の一実施例
・  を示す斜視図、第2図は同装置の側面図である。 1・・・・・・半導体素子、1a・・・・・・端子、2
,2′・・パ  ・・・ネジ、3・・・・・・放熱板、
3a・・・・・・係止部、3b・・・: ・・・停止部
、4・・・・・・基板、4a・・・・・・端子挿入孔1
、  4b・・・・・・放熱板取付孔。
FIG. 1 is a perspective view showing an embodiment of the heat sink mounting device of the present invention, and FIG. 2 is a side view of the same device. 1...Semiconductor element, 1a...Terminal, 2
, 2'...Pa...screw, 3...heat sink,
3a... Locking part, 3b... Stop part, 4... Board, 4a... Terminal insertion hole 1
, 4b... Heat sink mounting hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 下部両側端に形成される係止部と裏面下部に形成される
停止部とを有し中央部付近に半導体素子を取付ける放熱
板の取付装置であって、該放熱板の係止部に対応する複
数個の長円状の放熱板取付孔と、該半導体素子の端子に
対応する複数個の長円状の端子挿入孔とを基板上に互い
に平行に穿孔することを特徴とする放熱板の取付装置。
A heat sink mounting device for attaching a semiconductor element near the center, which has locking portions formed at both ends of the lower part and a stop portion formed at the bottom of the back surface, the device corresponding to the locking portions of the heat sink. Mounting of a heat sink characterized in that a plurality of oval heat sink mounting holes and a plurality of oval terminal insertion holes corresponding to the terminals of the semiconductor element are bored in parallel to each other on a substrate. Device.
JP10030282U 1982-07-01 1982-07-01 Heat sink mounting device Pending JPS594646U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10030282U JPS594646U (en) 1982-07-01 1982-07-01 Heat sink mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10030282U JPS594646U (en) 1982-07-01 1982-07-01 Heat sink mounting device

Publications (1)

Publication Number Publication Date
JPS594646U true JPS594646U (en) 1984-01-12

Family

ID=30237331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10030282U Pending JPS594646U (en) 1982-07-01 1982-07-01 Heat sink mounting device

Country Status (1)

Country Link
JP (1) JPS594646U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6448097U (en) * 1987-09-19 1989-03-24

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6448097U (en) * 1987-09-19 1989-03-24

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