JPS58120663U - insulation pad - Google Patents
insulation padInfo
- Publication number
- JPS58120663U JPS58120663U JP1593682U JP1593682U JPS58120663U JP S58120663 U JPS58120663 U JP S58120663U JP 1593682 U JP1593682 U JP 1593682U JP 1593682 U JP1593682 U JP 1593682U JP S58120663 U JPS58120663 U JP S58120663U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- hole
- electronic component
- insulation pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の実装態様の一例の斜視図、第２図は従来
の他の例の部分分解斜視図、第３図はその不具合を説明
するための実装状態の正面図、第４図は本考案の絶縁パ
ッドを使用した実装状態の部分分解斜視図、第５図は実
装状態の正面図、第一６図は変形例の斜視図、第７図は
他の変形例のパッドを用いた実装状態め正面図である。
１０・・・・・・プリント基板、１１・・・・・・トラ
ンジスタ、１２・・・・・・リード、１３・・・・・・
トランジスタ本体、１゛４・・・・・・放熱器、１５，
１５Ａ、１５Ｂ・・・・・・絶縁パッド、１６・・・・
・・Ｌ １７，１？Ａ、１７Ｂ・・・・・・（上側の
）突起、１８．１８Ａ、１８Ｂ・・・・・・（下側）の
突起、１９．２０・・・・・・突起、２１・・・・・・
支持孔。Fig. 1 is a perspective view of an example of a conventional mounting mode, Fig. 2 is a partially exploded perspective view of another conventional example, Fig. 3 is a front view of the mounting state to explain the problem, and Fig. 4 is a perspective view of an example of a conventional mounting mode. Fig. 5 is a front view of the mounted state, Fig. 16 is a perspective view of a modified example, and Fig. 7 is a partially exploded perspective view of a mounted state using the insulating pad of the present invention. FIG. 3 is a front view of the mounted state. 10...Printed board, 11...Transistor, 12...Lead, 13...
Transistor body, 1゛4... Heatsink, 15,
15A, 15B... Insulation pad, 16...
...L 17.1? A, 17B... (upper) protrusion, 18. 18A, 18B... (lower) protrusion, 19.20... protrusion, 21...・
Support hole.
Claims (1)
の間に介装し、中央部には前記電子部品のリードを挿通
する孔を形成する一方、外周位置には上下に突設を設け
、上側の突起は電子部品に取着した放熱器等の底面外周
近傍に当接し、下側の突起は前記プリント基板に当接し
得るよう構成したことを特徴とする絶縁パッド。It is interposed between an electronic component to be mounted on a printed circuit board and this printed circuit board, and a hole is formed in the center part through which the lead of the electronic component is inserted, while a hole is provided at the outer periphery position upward and downward, and a hole in the upper part is provided. An insulating pad characterized in that the protrusion is configured to abut near the outer periphery of a bottom surface of a heat sink or the like attached to an electronic component, and the lower protrusion is configured to abut the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1593682U JPS58120663U (en) | 1982-02-09 | 1982-02-09 | insulation pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1593682U JPS58120663U (en) | 1982-02-09 | 1982-02-09 | insulation pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58120663U true JPS58120663U (en) | 1983-08-17 |
Family
ID=30028328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1593682U Pending JPS58120663U (en) | 1982-02-09 | 1982-02-09 | insulation pad |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58120663U (en) |
-
1982
- 1982-02-09 JP JP1593682U patent/JPS58120663U/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS58120663U (en) | insulation pad | |
| JPS59145045U (en) | Transistor fixing device | |
| JPS58127780U (en) | speaker holder | |
| JPS6144871U (en) | Mounting structure of transistor on printed circuit board | |
| JPS5929048U (en) | Heatsink mounting structure for semiconductor components | |
| JPS6059553U (en) | circuit board structure | |
| JPS6039252U (en) | electronic components | |
| JPS594646U (en) | Heat sink mounting device | |
| JPS58129670U (en) | Mounting structure of chip parts | |
| JPS5958947U (en) | Semiconductor element mounting equipment | |
| JPS59177957U (en) | radiator | |
| JPS59171350U (en) | Semiconductor element mounting structure | |
| JPS58140628U (en) | Ballast mounting device | |
| JPS58131675U (en) | Electronic component storage device | |
| JPS58189593U (en) | circuit element assembly | |
| JPS5944094U (en) | Mounting structure of shield plate on printed circuit board | |
| JPS59111047U (en) | Heat sink mounting device | |
| JPS614490U (en) | Heat sink for electronic components | |
| JPS6052632U (en) | Power semiconductor devices | |
| JPS6049662U (en) | Chip component mounting structure | |
| JPS6039295U (en) | printed wiring board | |
| JPS6054366U (en) | Mounting structure of electronic components | |
| JPS5952641U (en) | Heat dissipation device for semiconductor package | |
| JPS5872844U (en) | LSI package | |
| JPS6061741U (en) | Semiconductor device with heat dissipation fins |