JPS6190272U - - Google Patents
Info
- Publication number
- JPS6190272U JPS6190272U JP17555784U JP17555784U JPS6190272U JP S6190272 U JPS6190272 U JP S6190272U JP 17555784 U JP17555784 U JP 17555784U JP 17555784 U JP17555784 U JP 17555784U JP S6190272 U JPS6190272 U JP S6190272U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- circuit board
- printed circuit
- hole
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
Description
第１図ないし第６図は本考案の一実施例を示す
図であり、第１図はプリント基板およびチツプ部
品を示す要部の斜視図、第２図ないし第６図は第
１図の各断面におけるプリント基板とチツプ部品
との関係を示す要部断面図、第７図および第８図
は従来例を示す断面図である。
１…チツプ部品、３…プリント基板、４…配線
パターン、５…絶縁板、６…第１の透孔、７…第
２の透孔。
1 to 6 are views showing one embodiment of the present invention, in which FIG. 1 is a perspective view of the main parts showing a printed circuit board and chip parts, and FIGS. 2 to 6 are views showing each of the parts shown in FIG. FIGS. 7 and 8 are cross-sectional views of main parts showing the relationship between the printed circuit board and chip components in cross-section, and are cross-sectional views showing conventional examples. DESCRIPTION OF SYMBOLS 1... Chip component, 3... Printed circuit board, 4... Wiring pattern, 5... Insulating board, 6... First through hole, 7... Second through hole.
Claims (1)
付けるプリント基板において、取付けるべきチツ
プ部品の搭載状態における位置決めを可能とする
平面輪郭に合わせた第１の透孔と、前記配線パタ
ーンとの半田付け部を形成するための第２の透孔
とを設けた絶縁板を前記プリント基板のチツプ部
品搭載面に設けたことを特徴とするプリント基板
。 In a printed circuit board on which a chip component is to be mounted at a position corresponding to a wiring pattern, a first through hole is formed in accordance with a planar contour to enable positioning of a chip component to be mounted in a mounted state, and a soldering portion with the wiring pattern is formed. 1. A printed circuit board characterized in that an insulating plate provided with a second through hole for the purpose of providing a chip component is provided on the chip component mounting surface of the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17555784U JPS6190272U (en) | 1984-11-19 | 1984-11-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17555784U JPS6190272U (en) | 1984-11-19 | 1984-11-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6190272U true JPS6190272U (en) | 1986-06-12 |
Family
ID=30733158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17555784U Pending JPS6190272U (en) | 1984-11-19 | 1984-11-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6190272U (en) |
-
1984
- 1984-11-19 JP JP17555784U patent/JPS6190272U/ja active Pending