JPH0339869U - - Google Patents
Info
- Publication number
- JPH0339869U JPH0339869U JP10013789U JP10013789U JPH0339869U JP H0339869 U JPH0339869 U JP H0339869U JP 10013789 U JP10013789 U JP 10013789U JP 10013789 U JP10013789 U JP 10013789U JP H0339869 U JPH0339869 U JP H0339869U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- wiring board
- printed wiring
- electrical component
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 3
- 230000000149 penetrating effect Effects 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の一実施例のプリント配線板を
示す側面図、第２図は第１図の実施例の平面図、
第３図は第１図のプリント配線板の半田付状態を
示す側面図、第４図は従来のプリント配線板を示
す平面図、第５図は第４図のプリント配線板を示
す平面図、第６図は第４図のプリント配線板の半
田付状態を示す側面図である。
１……基板、２……ランド、３……半田、４…
…電気部品、５……貫通孔。
FIG. 1 is a side view showing a printed wiring board of an embodiment of the present invention, FIG. 2 is a plan view of the embodiment of FIG. 1,
3 is a side view showing the soldered state of the printed wiring board shown in FIG. 1, FIG. 4 is a plan view showing a conventional printed wiring board, and FIG. 5 is a plan view showing the printed wiring board shown in FIG. FIG. 6 is a side view showing the printed wiring board of FIG. 4 in a soldered state. 1... Board, 2... Land, 3... Solder, 4...
...Electrical component, 5...Through hole.
Claims (1)
るランドを基板表面に形成してなるプリント配線
板において、前記電気部品の前記基板への投影領
域を含む領域に、前記基板を貫通する孔が設けて
あることを特徴とするプリント配線板。 In a printed wiring board in which a land is formed on the surface of the substrate to which a lead of an electrical component for surface mounting is fixed with solder, a hole penetrating the substrate is provided in an area including a projection area of the electrical component onto the substrate. A printed wiring board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10013789U JPH0339869U (en) | 1989-08-28 | 1989-08-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10013789U JPH0339869U (en) | 1989-08-28 | 1989-08-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0339869U true JPH0339869U (en) | 1991-04-17 |
Family
ID=31649157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10013789U Pending JPH0339869U (en) | 1989-08-28 | 1989-08-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0339869U (en) |
-
1989
- 1989-08-28 JP JP10013789U patent/JPH0339869U/ja active Pending