JPS61100175U - - Google Patents
Info
- Publication number
- JPS61100175U JPS61100175U JP18522484U JP18522484U JPS61100175U JP S61100175 U JPS61100175 U JP S61100175U JP 18522484 U JP18522484 U JP 18522484U JP 18522484 U JP18522484 U JP 18522484U JP S61100175 U JPS61100175 U JP S61100175U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- chip component
- conductor
- elastic member
- held
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 1
Description
第１図は、本考案に係る回路基板側面に実装用
チツプ部品の一実施例を説明するための斜視図、
第２図は、本考案に係る回路基板側面に実装用チ
ツプ部品の実装例を説明するための斜視図である
。
図中、１はチツプ部品、２は弾性体部材、３は
基板、４は表面パターン、５は裏面パターン、６
は実装部品、２１は折り曲げ部、をそれぞれ示す
。
FIG. 1 is a perspective view for explaining an embodiment of a chip component for mounting on the side surface of a circuit board according to the present invention;
FIG. 2 is a perspective view for explaining an example of mounting chip components on the side surface of a circuit board according to the present invention. In the figure, 1 is a chip component, 2 is an elastic member, 3 is a substrate, 4 is a front pattern, 5 is a back pattern, 6
21 indicates a mounted component, and 21 indicates a bent portion.
Claims (1)
するチツプ部品を、該チツプ部品の両端に導電体
からなる弾性体部材を付設し、該弾性体部材で前
記回路基板に形成した表裏パターンを挟持するよ
うにしたことを特徴とする回路基板側面実装用チ
ツプ部品。 A chip component to be mounted on the side surface of a circuit board on which components are mounted on both the front and back sides is provided with an elastic member made of a conductor at both ends of the chip component, and the front and back patterns formed on the circuit board are held between the elastic members. A chip component for side mounting on a circuit board, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18522484U JPS61100175U (en) | 1984-12-05 | 1984-12-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18522484U JPS61100175U (en) | 1984-12-05 | 1984-12-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61100175U true JPS61100175U (en) | 1986-06-26 |
Family
ID=30742702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18522484U Pending JPS61100175U (en) | 1984-12-05 | 1984-12-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61100175U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002017693A1 (en) * | 2000-08-18 | 2002-02-28 | Mitsubishi Denki Kabushiki Kaisha | Installation substrate, method of mounting installation substrate, and bulb socket using installation substrate |
-
1984
- 1984-12-05 JP JP18522484U patent/JPS61100175U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002017693A1 (en) * | 2000-08-18 | 2002-02-28 | Mitsubishi Denki Kabushiki Kaisha | Installation substrate, method of mounting installation substrate, and bulb socket using installation substrate |