JPS6183098U - - Google Patents
Info
- Publication number
- JPS6183098U JPS6183098U JP16904584U JP16904584U JPS6183098U JP S6183098 U JPS6183098 U JP S6183098U JP 16904584 U JP16904584 U JP 16904584U JP 16904584 U JP16904584 U JP 16904584U JP S6183098 U JPS6183098 U JP S6183098U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- heat dissipation
- electronic component
- circuit board
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 11
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
Description
第１図は本考案の一実施例の斜視図、第２図Ａ
は他の実施例の分解斜視図、第２図ＢはそのＡ−
Ａ断面図、第３図は第３の実施例の斜視図、第４
図は第４の実施例の斜視図、第５図は第５の実施
例の斜視図、第６図Ａは第６の実施例の斜視図、
第６図Ｂは同実施例の展開図、第７図は第７の実
施例の斜視図、第８図は第８の実施例の斜視図で
、第９図は従来例の斜視図である。
１…プリント基板、２…電子部品、４…放熱用
パターン。
Figure 1 is a perspective view of an embodiment of the present invention, Figure 2A
is an exploded perspective view of another embodiment, and FIG. 2B is its A-
A sectional view, Figure 3 is a perspective view of the third embodiment, and Figure 4 is a perspective view of the third embodiment.
The figure is a perspective view of the fourth embodiment, FIG. 5 is a perspective view of the fifth embodiment, FIG. 6A is a perspective view of the sixth embodiment,
Fig. 6B is a developed view of the same embodiment, Fig. 7 is a perspective view of the seventh embodiment, Fig. 8 is a perspective view of the eighth embodiment, and Fig. 9 is a perspective view of the conventional example. . 1... Printed circuit board, 2... Electronic components, 4... Heat dissipation pattern.
Claims (1)
に放熱用パターンを形成し、放熱を要する電子部
品と上記放熱用パターンを伝熱部材で接続したプ
リント回路の放熱装置。 (2) プリント基板の電子部品実装面とは異る面
が同じプリント基板の裏面である実用新案登録請
求の範囲第１項記載のプリント回路の放熱装置。 (3) プリント基板の電子部品実装面とは異る面
が、同じプリント基板の裏面に接する他のプリン
チ基板の表面である実用新案登録請求の範囲第１
項記載のプリント回路の放熱装置。 (4) 電子部品と放熱用パターンとを接続する伝
熱部材が電子部品に接続されている回路パターン
の延長である実用新案登録請求の範囲第１項記載
のプリント回路の放熱装置。 (5) 電子部品と放熱用パターンとを接続する伝
熱部材がリード線である実用新案登録請求の範囲
第１項記載のプリント回路の放熱装置。[Claims for Utility Model Registration] (1) A printed circuit in which a heat dissipation pattern is formed on a surface different from the electronic component mounting surface of a printed circuit board, and the electronic component that requires heat dissipation and the heat dissipation pattern are connected by a heat transfer member. heat dissipation device. (2) The heat dissipation device for a printed circuit according to claim 1, wherein the surface of the printed circuit board that is different from the electronic component mounting surface is the back surface of the same printed circuit board. (3) Utility model registration claim 1 where the surface of the printed circuit board that is different from the electronic component mounting surface is the surface of another printed circuit board that is in contact with the back surface of the same printed circuit board.
Heat dissipation device for printed circuits as described in Section 2. (4) The printed circuit heat dissipation device according to claim 1, wherein the heat transfer member connecting the electronic component and the heat dissipation pattern is an extension of the circuit pattern connected to the electronic component. (5) The heat dissipation device for a printed circuit according to claim 1, wherein the heat transfer member connecting the electronic component and the heat dissipation pattern is a lead wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16904584U JPS6183098U (en) | 1984-11-06 | 1984-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16904584U JPS6183098U (en) | 1984-11-06 | 1984-11-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6183098U true JPS6183098U (en) | 1986-06-02 |
Family
ID=30726797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16904584U Pending JPS6183098U (en) | 1984-11-06 | 1984-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6183098U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01130591U (en) * | 1988-02-29 | 1989-09-05 | ||
| WO2021186797A1 (en) * | 2020-03-18 | 2021-09-23 | 株式会社村田製作所 | Circuit board module |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5847718U (en) * | 1981-09-26 | 1983-03-31 | 株式会社島津製作所 | electromagnetic flow meter |
-
1984
- 1984-11-06 JP JP16904584U patent/JPS6183098U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5847718U (en) * | 1981-09-26 | 1983-03-31 | 株式会社島津製作所 | electromagnetic flow meter |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01130591U (en) * | 1988-02-29 | 1989-09-05 | ||
| WO2021186797A1 (en) * | 2020-03-18 | 2021-09-23 | 株式会社村田製作所 | Circuit board module |
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