JPH0217891U - - Google Patents
Info
- Publication number
- JPH0217891U JPH0217891U JP9572988U JP9572988U JPH0217891U JP H0217891 U JPH0217891 U JP H0217891U JP 9572988 U JP9572988 U JP 9572988U JP 9572988 U JP9572988 U JP 9572988U JP H0217891 U JPH0217891 U JP H0217891U
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- heat generating
- motherboard
- copper foil
- dissipation structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims 2
- 239000011888 foil Substances 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の実施例を示す平面図、第２図
は本考案の実施例を示す正面図、第３図は従来例
を示す平面図、第４図は従来例を示す正面図であ
る。
１…基板、２…クリツプ端子、３…ダイオード
、４…トランジスタ、５，６…銅箔。
Fig. 1 is a plan view showing an embodiment of the present invention, Fig. 2 is a front view showing an embodiment of the invention, Fig. 3 is a plan view showing a conventional example, and Fig. 4 is a front view showing a conventional example. be. 1... Board, 2... Clip terminal, 3... Diode, 4... Transistor, 5, 6... Copper foil.
Claims (1)
装をする発熱部品の放熱構造において、 前記発熱部品の取付パツト周囲に該取付パツト
とつながる所定面積の銅箔を残し、前記銅箔にマ
ザーボード取付用クリツプ端子を接続したことを
特徴とする発熱部品の放熱構造。[Scope of Claim for Utility Model Registration] In a heat dissipation structure for a heat generating component that is surface mounted on a small printed circuit board for mounting on a motherboard, a copper foil of a predetermined area is left around a mounting part of the heat generating component connected to the mounting part, and the copper foil is A heat dissipation structure for heat generating components characterized by connecting clip terminals for motherboard mounting to foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9572988U JPH0217891U (en) | 1988-07-21 | 1988-07-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9572988U JPH0217891U (en) | 1988-07-21 | 1988-07-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0217891U true JPH0217891U (en) | 1990-02-06 |
Family
ID=31320438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9572988U Pending JPH0217891U (en) | 1988-07-21 | 1988-07-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0217891U (en) |
-
1988
- 1988-07-21 JP JP9572988U patent/JPH0217891U/ja active Pending