JPS6336076U - - Google Patents
Info
- Publication number
- JPS6336076U JPS6336076U JP12892586U JP12892586U JPS6336076U JP S6336076 U JPS6336076 U JP S6336076U JP 12892586 U JP12892586 U JP 12892586U JP 12892586 U JP12892586 U JP 12892586U JP S6336076 U JPS6336076 U JP S6336076U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- land
- warhead shape
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
Description
第１図は本考案の一実施例を示すランド形状の
平面図、第２図は本考案のランドへの小形モール
ド電子部品の実装状態を示す平面図、第３図は従
来の小形モールド電子部品の実装状態を示す平面
図、第４図は本考案の他の実施例を示すレジスト
にて形成されるランド形状を示す平面図である。
１１……小形モールド電子部品、１２……弾頭
形ランド、１３……パターン、１４……ソルダー
レジスト。
Fig. 1 is a plan view of a land shape showing an embodiment of the present invention, Fig. 2 is a plan view showing a state in which a small molded electronic component is mounted on the land of the present invention, and Fig. 3 is a plan view of a conventional small molded electronic component. FIG. 4 is a plan view showing a mounting state of the present invention, and FIG. 4 is a plan view showing a land shape formed with a resist showing another embodiment of the present invention. 11...Small molded electronic component, 12...Warhead-shaped land, 13...Pattern, 14...Solder resist.
Claims (1)
前記電子部品のリード端子が接続される弾頭形を
有する形状のランドを形成するようにしたことを
特徴とする印刷配線板。 (2) 前記ランドはソルダーレジストを塗布し、
弾頭形を有する形状を形成するようにしたことを
特徴とする実用新案登録請求の範囲第１項記載の
印刷配線板。[Scope of claims for utility model registration] (1) In printed wiring boards on which electronic components are mounted,
A printed wiring board characterized in that a land having a warhead shape is formed to which a lead terminal of the electronic component is connected. (2) The land is coated with solder resist,
The printed wiring board according to claim 1, which is characterized in that the printed wiring board has a warhead shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12892586U JPS6336076U (en) | 1986-08-26 | 1986-08-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12892586U JPS6336076U (en) | 1986-08-26 | 1986-08-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6336076U true JPS6336076U (en) | 1988-03-08 |
Family
ID=31025038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12892586U Pending JPS6336076U (en) | 1986-08-26 | 1986-08-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6336076U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03136295A (en) * | 1989-10-21 | 1991-06-11 | Toshiba Corp | Hybrid integrated circuit |
-
1986
- 1986-08-26 JP JP12892586U patent/JPS6336076U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03136295A (en) * | 1989-10-21 | 1991-06-11 | Toshiba Corp | Hybrid integrated circuit |