JPH0350370U - - Google Patents
Info
- Publication number
- JPH0350370U JPH0350370U JP11078389U JP11078389U JPH0350370U JP H0350370 U JPH0350370 U JP H0350370U JP 11078389 U JP11078389 U JP 11078389U JP 11078389 U JP11078389 U JP 11078389U JP H0350370 U JPH0350370 U JP H0350370U
- Authority
- JP
- Japan
- Prior art keywords
- reflow soldering
- wiring board
- printed wiring
- wiring patterns
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 2
- 239000006071 cream Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例の平面図、第２図は
第１図の部分断面図、第３図および第４図は従来
例を示す図である。
主要部分の符号の説明、１……延伸部、２……
配線パターン、３……クリーム半田、４……電子
部品、５……端子。
FIG. 1 is a plan view of an embodiment of the present invention, FIG. 2 is a partial sectional view of FIG. 1, and FIGS. 3 and 4 are views showing a conventional example. Explanation of symbols of main parts, 1...extension part, 2...
Wiring pattern, 3...Cream solder, 4...Electronic components, 5...Terminal.
Claims (1)
けにより配線パターンに接続される印刷配線板で
あつて、前記配線パターン各々の一端に前記リフ
ロー半田付けの余剰半田を吸収すべく、各配線パ
ターンから伸びた延伸部材を設けたことを特徴と
する印刷配線板。 A printed wiring board in which terminals of electronic components for surface mounting are connected to wiring patterns by reflow soldering, and one end of each of the wiring patterns has a portion extending from each wiring pattern in order to absorb surplus solder from the reflow soldering. A printed wiring board characterized by being provided with a stretched member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11078389U JPH0350370U (en) | 1989-09-21 | 1989-09-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11078389U JPH0350370U (en) | 1989-09-21 | 1989-09-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0350370U true JPH0350370U (en) | 1991-05-16 |
Family
ID=31659301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11078389U Pending JPH0350370U (en) | 1989-09-21 | 1989-09-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0350370U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002128934A (en) * | 2000-10-31 | 2002-05-09 | Kanegafuchi Chem Ind Co Ltd | Manufacturing method of polypropylenic resin foamed sheet |
-
1989
- 1989-09-21 JP JP11078389U patent/JPH0350370U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002128934A (en) * | 2000-10-31 | 2002-05-09 | Kanegafuchi Chem Ind Co Ltd | Manufacturing method of polypropylenic resin foamed sheet |