JPH0193768U - - Google Patents
Info
- Publication number
- JPH0193768U JPH0193768U JP18881187U JP18881187U JPH0193768U JP H0193768 U JPH0193768 U JP H0193768U JP 18881187 U JP18881187 U JP 18881187U JP 18881187 U JP18881187 U JP 18881187U JP H0193768 U JPH0193768 U JP H0193768U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- pattern
- circuit board
- printed circuit
- solder land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 2
Description
第１図及び第２図は本考案の実施例の説明図で
、第１図は電子部品をプリント基板に取付けた状
態の平面図、第２図は第１図のＢ―Ｂ線の断面図
、第３図及び第４図は従来例の説明図で、第３図
は電子部品をプリント基板に取付けた状態の平面
図、第４図は第３図のＡ―Ａ線の断面図である。
１…コネクタ（電子部品）、２…端子、３…プ
リント基板、４…パターン、４ａ′，４ａ…半田
ランド、６…レジスト、７…取付孔、８…半田、
１０…膨出部、１１…レジスタの領域。
Figures 1 and 2 are explanatory diagrams of an embodiment of the present invention. Figure 1 is a plan view of electronic components mounted on a printed circuit board, and Figure 2 is a cross-sectional view taken along line BB in Figure 1. , FIG. 3 and FIG. 4 are explanatory diagrams of a conventional example, FIG. 3 is a plan view of electronic components mounted on a printed circuit board, and FIG. 4 is a cross-sectional view taken along line A-A in FIG. 3. . 1... Connector (electronic component), 2... Terminal, 3... Printed circuit board, 4... Pattern, 4a', 4a... Solder land, 6... Resist, 7... Mounting hole, 8... Solder,
10...bulge, 11... register area.
Claims (1)
ンの取付孔に挿入後、パターンに半田付けして成
る電子部品の取付構造において、前記プリント基
板のパターンに半田ランドを残してレジストを塗
布すると共に、前記半田ランドを端子取付孔を基
準にして電子部品と反対側に膨出せしめ、前記レ
ジストの塗布される範囲は、前記電子部品の前記
半田ランド側端部の略直下から前記半田ランドに
至る間の領域を含むことを特徴とする電子部品の
取付構造。 In an electronic component mounting structure in which a terminal of an electronic component is inserted into a mounting hole of a pattern provided on a printed circuit board and then soldered to the pattern, a resist is applied leaving a solder land on the pattern of the printed circuit board, and a resist is applied to the pattern of the printed circuit board. The solder land is made to bulge out to the opposite side of the electronic component with respect to the terminal mounting hole, and the resist is applied to the area from approximately directly below the end of the solder land of the electronic component to the solder land. An electronic component mounting structure characterized by including a region.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18881187U JPH0193768U (en) | 1987-12-14 | 1987-12-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18881187U JPH0193768U (en) | 1987-12-14 | 1987-12-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0193768U true JPH0193768U (en) | 1989-06-20 |
Family
ID=31479880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18881187U Pending JPH0193768U (en) | 1987-12-14 | 1987-12-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0193768U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57106094A (en) * | 1980-12-23 | 1982-07-01 | Sony Corp | Circuit device using printed circuit board |
-
1987
- 1987-12-14 JP JP18881187U patent/JPH0193768U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57106094A (en) * | 1980-12-23 | 1982-07-01 | Sony Corp | Circuit device using printed circuit board |