JPS631377U - - Google Patents
Info
- Publication number
- JPS631377U JPS631377U JP9364986U JP9364986U JPS631377U JP S631377 U JPS631377 U JP S631377U JP 9364986 U JP9364986 U JP 9364986U JP 9364986 U JP9364986 U JP 9364986U JP S631377 U JPS631377 U JP S631377U
- Authority
- JP
- Japan
- Prior art keywords
- component body
- circuit board
- printed circuit
- insertion hole
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000037431 insertion Effects 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000009434 installation Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
図面は本考案をＩＣの取付装置に適用した実施
例を示すものであつて、第１図は取付前のプリン
ト基板と電子部品との分解斜視図、第２図は取付
後の平面図、第３図は第２図―線断面図、第
４図は第２図―線断面図、第５図及び第６図
はそれぞれ変形例における係止部の拡大平面図、
第７図は応用例における取付後の平面図である。
なお図面に用いた符号において、１，２４……
ＩＣ（電子部品）、２，２５……部品本体、２，
２３……リード線、７……プリント基板、８，２
６……挿入孔、８ａ，２６ａ……内周縁、９，１
８，２０，２７……係止部、１０……導電パター
ン、である。
The drawings show an embodiment in which the present invention is applied to an IC mounting device, in which FIG. 1 is an exploded perspective view of a printed circuit board and electronic components before mounting, FIG. 2 is a plan view after mounting, and FIG. 3 is a sectional view taken along the line of FIG. 2, FIG. 4 is a sectional view taken along the line of FIG.
FIG. 7 is a plan view after installation in an applied example. In addition, in the symbols used in the drawings, 1, 24...
IC (electronic component), 2, 25... Part body, 2,
23...Lead wire, 7...Printed circuit board, 8,2
6...Insertion hole, 8a, 26a...Inner peripheral edge, 9, 1
8, 20, 27...locking portion, 10...conductive pattern.
Claims (1)
し、その部品本体のリード線をプリント基板の導
電パターンに半田付けするようにした電子部品の
取付装置において、 前記挿入孔の内周縁に少なくとも一対の互いに
対向する係止部を内方へ突出させて設け、これら
一対の係止部間に前記部品本体を嵌め込むことに
よつてその部品本体を前記挿入孔内にて保持させ
るように構成したことを特徴とする電子部品の取
付装置。[Scope of Claim for Utility Model Registration] An electronic component mounting device in which a component body is inserted into an insertion hole provided in a printed circuit board, and a lead wire of the component body is soldered to a conductive pattern on the printed circuit board, comprising: At least a pair of locking portions facing each other are provided on the inner peripheral edge of the hole to protrude inward, and the component body is inserted into the insertion hole by fitting the component body between the pair of locking portions. 1. A mounting device for electronic components, characterized in that the device is configured to hold the electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986093649U JPH0432779Y2 (en) | 1986-06-19 | 1986-06-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986093649U JPH0432779Y2 (en) | 1986-06-19 | 1986-06-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS631377U true JPS631377U (en) | 1988-01-07 |
| JPH0432779Y2 JPH0432779Y2 (en) | 1992-08-06 |
Family
ID=30956403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986093649U Expired JPH0432779Y2 (en) | 1986-06-19 | 1986-06-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0432779Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2012096152A1 (en) * | 2011-01-13 | 2014-06-09 | パナソニック株式会社 | Circuit component mounting structure and circuit component mounting method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4527982Y1 (en) * | 1967-07-17 | 1970-10-28 | ||
| JPS57121167U (en) * | 1981-01-21 | 1982-07-28 | ||
| JPS6239089A (en) * | 1985-08-14 | 1987-02-20 | 株式会社日立製作所 | Circuit board |
-
1986
- 1986-06-19 JP JP1986093649U patent/JPH0432779Y2/ja not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4527982Y1 (en) * | 1967-07-17 | 1970-10-28 | ||
| JPS57121167U (en) * | 1981-01-21 | 1982-07-28 | ||
| JPS6239089A (en) * | 1985-08-14 | 1987-02-20 | 株式会社日立製作所 | Circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2012096152A1 (en) * | 2011-01-13 | 2014-06-09 | パナソニック株式会社 | Circuit component mounting structure and circuit component mounting method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0432779Y2 (en) | 1992-08-06 |