JPH0444175U - - Google Patents
Info
- Publication number
- JPH0444175U JPH0444175U JP8621390U JP8621390U JPH0444175U JP H0444175 U JPH0444175 U JP H0444175U JP 8621390 U JP8621390 U JP 8621390U JP 8621390 U JP8621390 U JP 8621390U JP H0444175 U JPH0444175 U JP H0444175U
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- wiring board
- large number
- printed wiring
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図ａ及びｂは本考案の半田付用治具の一実
施例を示す平面図及び要部断面を含む側面図、第
２図は第１図ａのＢ部を拡大して示す平面図、第
３図は第１図ａにおけるＣ−Ｃ′線の拡大断面図
、第４図は従来の半田付けの一例を示す斜視図で
ある。
１……電子部品（ＱＦＰ）、２……ガイドプレ
ート、３……部品搭載用基板、４ａ，４ｂ……位
置決めピン、５……電子部品、６……チツプ部品
、７……電極、８……端子、９……端子ガイド部
、１０……半田、１１……電極。
Figures 1a and b are a plan view and a side view including a cross section of essential parts showing an embodiment of the soldering jig of the present invention, and Figure 2 is an enlarged plan view of section B in Figure 1a. , FIG. 3 is an enlarged sectional view taken along the line CC' in FIG. 1a, and FIG. 4 is a perspective view showing an example of conventional soldering. DESCRIPTION OF SYMBOLS 1... Electronic component (QFP), 2... Guide plate, 3... Component mounting board, 4a, 4b... Positioning pin, 5... Electronic component, 6... Chip component, 7... Electrode, 8... ...Terminal, 9...Terminal guide section, 10...Solder, 11...Electrode.
Claims (1)
構造を有する電子部品をプリント配線基板上に表
面実装する電子回路の半田付けにおいて、表面実
装する前記電子部品の外形形状及び前記端子の形
状に合わせて多数個の突出部を設けた端子ガイド
部付きのプレートと、該プレートに設けられ前記
プリント配線基板との相対位置を決める位置決め
用ピンとを備えることを特徴とする表面実装用電
子部品の半田付治具。 In soldering an electronic circuit in which an electronic component having a structure with a large number of terminals protruding in two or four directions is surface mounted on a printed wiring board, Soldering of electronic components for surface mounting, characterized in that the plate includes a terminal guide portion provided with a large number of protrusions, and a positioning pin provided on the plate to determine the relative position with respect to the printed wiring board. jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8621390U JPH0444175U (en) | 1990-08-16 | 1990-08-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8621390U JPH0444175U (en) | 1990-08-16 | 1990-08-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0444175U true JPH0444175U (en) | 1992-04-15 |
Family
ID=31817766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8621390U Pending JPH0444175U (en) | 1990-08-16 | 1990-08-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0444175U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012508374A (en) * | 2008-11-10 | 2012-04-05 | イートン コーポレーション | Pressure sensing module with integrated seal plate and method of assembling a pressure sensing module |
-
1990
- 1990-08-16 JP JP8621390U patent/JPH0444175U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012508374A (en) * | 2008-11-10 | 2012-04-05 | イートン コーポレーション | Pressure sensing module with integrated seal plate and method of assembling a pressure sensing module |