JPS61177475U - - Google Patents
Info
- Publication number
- JPS61177475U JPS61177475U JP6108785U JP6108785U JPS61177475U JP S61177475 U JPS61177475 U JP S61177475U JP 6108785 U JP6108785 U JP 6108785U JP 6108785 U JP6108785 U JP 6108785U JP S61177475 U JPS61177475 U JP S61177475U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- lead insertion
- leads
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000037431 insertion Effects 0.000 claims description 6
- 238000003780 insertion Methods 0.000 claims description 6
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
Description
図は本考案の一実施例を示し、第1図はフレキ
シブル印刷配線板の平面図、第2図は同実施例の
分解斜視図、第3図は同実施例の側面図である。
1……フレキシブル印刷配線板、2……チツプ
部品塔載用配線パターン、3……ICリード半田
付け用パターン、4……ICリード差し込み用孔
、5……チツプ部品(電気部品)、6……第1の
印刷配線板、7……ICリード、8……IC、9
……ICリード差し込み用孔。
The drawings show an embodiment of the present invention; FIG. 1 is a plan view of a flexible printed wiring board, FIG. 2 is an exploded perspective view of the same embodiment, and FIG. 3 is a side view of the same embodiment. DESCRIPTION OF SYMBOLS 1... Flexible printed wiring board, 2... Wiring pattern for mounting chip components, 3... IC lead soldering pattern, 4... Hole for IC lead insertion, 5... Chip parts (electrical components), 6... ...First printed wiring board, 7...IC lead, 8...IC, 9
...IC lead insertion hole.
Claims (1)
の前記リードを、第1の印刷配線板のリード差し
込み用孔にそれぞれ差し込んで半田付けして、前
記第1の印刷配線板の裏側に前記集積回路のリー
ドを突出させ、また前記リード差し込み用孔に対
応するリード差し込み用孔を有する第2の印刷配
線板を設け、この第2の印刷配線板上に電気部品
を実装し、前記第2の印刷配線板のリード差し込
み用孔に、前記第1の印刷配線板の裏側に突出し
た集積回路のリードを差し込んで半田付けするこ
とにより、前記第2の印刷配線板を前記第1の印
刷配線板の裏側に取り付けたことを特徴とする印
刷配線板装置。 (2) 前記第2の印刷配線板はフレキシブルであ
ることを特徴とする特許請求の範囲第1項に記載
の印刷配線板装置。[Claims for Utility Model Registration] (1) The leads of an integrated circuit having a large number of external leads are inserted into lead insertion holes of a first printed wiring board and soldered to the first printed wiring board. A second printed wiring board is provided on the back side of the printed wiring board in which the leads of the integrated circuit protrude and have a lead insertion hole corresponding to the lead insertion hole, and electrical components are mounted on the second printed wiring board. The integrated circuit leads protruding from the back side of the first printed wiring board are inserted into the lead insertion holes of the second printed wiring board and soldered to the second printed wiring board. A printed wiring board device, characterized in that: is attached to the back side of the first printed wiring board. (2) The printed wiring board device according to claim 1, wherein the second printed wiring board is flexible.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6108785U JPS61177475U (en) | 1985-04-25 | 1985-04-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6108785U JPS61177475U (en) | 1985-04-25 | 1985-04-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61177475U true JPS61177475U (en) | 1986-11-05 |
Family
ID=30589038
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6108785U Pending JPS61177475U (en) | 1985-04-25 | 1985-04-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61177475U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006228915A (en) * | 2005-02-17 | 2006-08-31 | Meidensha Corp | Connection structure of printed board |
JP2019040936A (en) * | 2017-08-23 | 2019-03-14 | 田淵電機株式会社 | Substrate assembly |
-
1985
- 1985-04-25 JP JP6108785U patent/JPS61177475U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006228915A (en) * | 2005-02-17 | 2006-08-31 | Meidensha Corp | Connection structure of printed board |
JP2019040936A (en) * | 2017-08-23 | 2019-03-14 | 田淵電機株式会社 | Substrate assembly |
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