JPS6217172U - - Google Patents
Info
- Publication number
- JPS6217172U JPS6217172U JP10834885U JP10834885U JPS6217172U JP S6217172 U JPS6217172 U JP S6217172U JP 10834885 U JP10834885 U JP 10834885U JP 10834885 U JP10834885 U JP 10834885U JP S6217172 U JPS6217172 U JP S6217172U
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- hole
- wiring board
- cutout
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の一実施例を表わす平面図、第
２図は第１図のＣ―Ｄ線断面図、第３図は第１図
の右側面図、第４図は同実施例で使用されるプリ
ント配線基板を表わす平面図、第５図は同実施例
で使用される電子装置を表わす正面図、第６図は
第５図の右側面図である。第７図及び第８図はそ
れぞれ他の実施例を表わす平面図、第９図はさら
に他の実施例を表わす側面図である。第１０図は
従来例を表わす平面図、第１１図は第１０図のＡ
―Ｂ線断面図、第１２図は第１０図の右側面図で
ある。
４……小基板、６ａ，６ｂ，６ｃ……電子部品
、１０……端子、１４……配線パターン、１６…
…半田付け、２０……電源装置、２２……プリン
ト配線基板、２４……穴、２６，２８……切欠き
。
Fig. 1 is a plan view showing one embodiment of the present invention, Fig. 2 is a sectional view taken along line CD in Fig. 1, Fig. 3 is a right side view of Fig. 1, and Fig. 4 is a plan view of the same embodiment. FIG. 5 is a plan view showing the printed wiring board used, FIG. 5 is a front view showing the electronic device used in the same embodiment, and FIG. 6 is a right side view of FIG. 5. 7 and 8 are plan views showing other embodiments, respectively, and FIG. 9 is a side view showing still another embodiment. Fig. 10 is a plan view showing the conventional example, and Fig. 11 is A of Fig. 10.
12 is a right side view of FIG. 10. 4...Small board, 6a, 6b, 6c...Electronic component, 10...Terminal, 14...Wiring pattern, 16...
...Soldering, 20...Power supply device, 22...Printed wiring board, 24...Hole, 26, 28...Notch.
Claims (1)
装置が形成されているとともに、この電子装置で
は端子が側面に垂直な方向に延びるように設けら
れており、 配線パターンをもつプリント配線基板に前記電
子装置が入る大きさの穴又は切欠きが設けられて
おり、このプリント配線基板の穴又は切欠きに前
記電子装置が嵌め込まれ、その電子装置の端子が
このプリント配線基板の配線パターンに半田付け
されていることを特徴とする電子部品取付け装置
。[Claims for Utility Model Registration] Electronic components are arranged and sealed on a small substrate to form an electronic device, and in this electronic device, terminals are provided so as to extend in a direction perpendicular to the side surface, A hole or cutout large enough to accommodate the electronic device is provided in a printed wiring board having a wiring pattern, and the electronic device is fitted into the hole or cutout of the printed wiring board, and the terminals of the electronic device are connected to the hole or cutout. An electronic component mounting device characterized by soldering to a wiring pattern of a printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10834885U JPS6217172U (en) | 1985-07-15 | 1985-07-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10834885U JPS6217172U (en) | 1985-07-15 | 1985-07-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6217172U true JPS6217172U (en) | 1987-02-02 |
Family
ID=30985461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10834885U Pending JPS6217172U (en) | 1985-07-15 | 1985-07-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6217172U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006253506A (en) * | 2005-03-11 | 2006-09-21 | Tdk Corp | Device with compound substrate and its production process |
-
1985
- 1985-07-15 JP JP10834885U patent/JPS6217172U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006253506A (en) * | 2005-03-11 | 2006-09-21 | Tdk Corp | Device with compound substrate and its production process |
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