JPS61182076U - - Google Patents

Info

Publication number
JPS61182076U
JPS61182076U JP6661785U JP6661785U JPS61182076U JP S61182076 U JPS61182076 U JP S61182076U JP 6661785 U JP6661785 U JP 6661785U JP 6661785 U JP6661785 U JP 6661785U JP S61182076 U JPS61182076 U JP S61182076U
Authority
JP
Japan
Prior art keywords
electrode
electronic component
wiring board
printed wiring
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6661785U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6661785U priority Critical patent/JPS61182076U/ja
Publication of JPS61182076U publication Critical patent/JPS61182076U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案に係る印刷配線板電極の一実施
例を示す平面図、第2図は第1図の正面図、第3
図は本考案の他の実施例を示す平面図、第4図は
従来の印刷配線板電極を示す平面図、第5図は第
4図の正面図である。 1……電子部品、2……リード、3……基板、
4……電極、5……半田。
FIG. 1 is a plan view showing one embodiment of the printed wiring board electrode according to the present invention, FIG. 2 is a front view of FIG. 1, and FIG.
4 is a plan view showing another embodiment of the present invention, FIG. 4 is a plan view showing a conventional printed wiring board electrode, and FIG. 5 is a front view of FIG. 4. 1...electronic component, 2...lead, 3...board,
4...electrode, 5...solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板上に形成された電子部品をリードを介して
接着実装する印刷配線板電極において、前記電子
部品側のリードが接着される部品の電極の幅より
前記電子部品側の電極の幅を広く形成したことを
特徴とする印刷配線板電極。
In a printed wiring board electrode on which an electronic component formed on a substrate is adhesively mounted via a lead, the electrode on the electronic component side is formed to have a width wider than the width of the electrode of the component to which the lead on the electronic component side is bonded. A printed wiring board electrode characterized by:
JP6661785U 1985-05-07 1985-05-07 Pending JPS61182076U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6661785U JPS61182076U (en) 1985-05-07 1985-05-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6661785U JPS61182076U (en) 1985-05-07 1985-05-07

Publications (1)

Publication Number Publication Date
JPS61182076U true JPS61182076U (en) 1986-11-13

Family

ID=30599696

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6661785U Pending JPS61182076U (en) 1985-05-07 1985-05-07

Country Status (1)

Country Link
JP (1) JPS61182076U (en)

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