JPH0316289Y2 - - Google Patents
Info
- Publication number
- JPH0316289Y2 JPH0316289Y2 JP4963785U JP4963785U JPH0316289Y2 JP H0316289 Y2 JPH0316289 Y2 JP H0316289Y2 JP 4963785 U JP4963785 U JP 4963785U JP 4963785 U JP4963785 U JP 4963785U JP H0316289 Y2 JPH0316289 Y2 JP H0316289Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- printed circuit
- circuit board
- pattern
- dissipation structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000017525 heat dissipation Effects 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 2
- 230000007261 regionalization Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【考案の詳細な説明】
〔概要〕
トランジスタの放熱構造であつて、トランジス
タ（基板密着形トランジスタで以下TRという。）
とこのTRから発生する熱を発散する放熱器とを
プリント基板の両面に分割してパターン形成の拘
束を緩和する。[Detailed explanation of the invention] [Summary] A heat dissipation structure for transistors (substrate contact type transistors, hereinafter referred to as TR).
A heat sink that dissipates the heat generated from this TR is divided into both sides of the printed circuit board to relieve restrictions on pattern formation.
本考案は、プリント基板に実装するトランジス
タの放熱構造に係り、とくにTRと放熱板をプリ
ント基板の表裏に分割して実装し、スルーホール
用孔を介して半田接合するトランジスタの放熱構
造に関する。
The present invention relates to a heat dissipation structure for a transistor mounted on a printed circuit board, and in particular to a heat dissipation structure for a transistor in which a TR and a heat dissipation plate are mounted separately on the front and back sides of a printed circuit board, and are soldered together via through-holes.
昨今、電子装置全般に小形、軽量化の要求が強
く、これに伴なつてユニツト化されたプリント基
板に実装される電子部品の高密度実装を余儀され
ており、従つて高密度実装を行なうと部品の小形
化が要求される。TR等もその例外でなく、した
がつて小形TRの放熱構造の改善が強く要求され
ている。 In recent years, there has been a strong demand for smaller and lighter electronic devices in general, and this has forced high-density mounting of electronic components on unitized printed circuit boards. Miniaturization of parts is required. TRs and the like are no exception, and therefore there is a strong demand for improvements in the heat dissipation structure of small TRs.
第２図は、従来のトランジスタの放熱構造を説
明するための要部断面図である。
FIG. 2 is a sectional view of a main part for explaining the heat dissipation structure of a conventional transistor.
プリント基板２のパターン形成側２２に所定の
パターン２４を形成し、部品放熱側２１にTR用
パターン２３を形成たるのち、部品実装側２１に
電子部品４及びTR３を実装したプリント基板２
を筐体１に取着する構造となつている。 A predetermined pattern 24 is formed on the pattern forming side 22 of the printed circuit board 2, a TR pattern 23 is formed on the component heat radiation side 21, and then the electronic components 4 and TR 3 are mounted on the component mounting side 21.
It has a structure in which it is attached to the housing 1.
上記従来のトランジスタの放熱構造にあつて
は、部品実装側２１に電子部品４と同様TR３を
パターン形成上に直接半田接合により実装してい
るので、放熱部品実装側２１での制約が生じ、ま
たパターン形成が拘束され、小形化、高密度実装
を阻害するという問題点があつた。
In the above conventional transistor heat dissipation structure, the TR 3 is mounted on the component mounting side 21 by soldering directly on the pattern formation, similar to the electronic component 4, so there are restrictions on the heat dissipation component mounting side 21, and There was a problem in that pattern formation was restricted and miniaturization and high-density packaging were hindered.
本考案は、上記の問題点を解決したトランジス
タの放熱構造を提供するもので、プリント基板２
に実装するTR３の放熱構造を、前記TR３を前
記プリント基板２のパターン側２２に実装し、前
記TR３の実装器６を部品実装側２１に付設し
て、半田流入孔６１を穿設した放熱器６とTR３
を複数のスルーホール用孔２５を介して一体的に
半田接合して構成される。
The present invention provides a heat dissipation structure for transistors that solves the above problems.
The heat dissipation structure of the TR3 is mounted on the pattern side 22 of the printed circuit board 2, the mounter 6 of the TR3 is attached to the component mounting side 21, and a solder inlet hole 61 is bored. 6 and TR3
are integrally soldered together via a plurality of through holes 25.
放熱器を設けることによりTR３の放熱効率が
向上しするとともに、TR用パターン２４をプリ
ント基板２の部品実装側２１に形成していたが、
このTR用パターン２４をパターン形成側２２に
設けたため、プリント基板２の部品実装側２１に
おける部品のパターン配置の自由度が増大する。
Although the heat dissipation efficiency of the TR 3 is improved by providing a heat sink, and the TR pattern 24 is formed on the component mounting side 21 of the printed circuit board 2,
Since this TR pattern 24 is provided on the pattern forming side 22, the degree of freedom in pattern arrangement of components on the component mounting side 21 of the printed circuit board 2 is increased.
第１図は本考案の実施例でａは要部断面図、ｂ
は要部平面図で、第２図と同等の部分とについて
は同一符号を付している。
Figure 1 is an embodiment of the present invention, a is a sectional view of the main part, b
2 is a plan view of the main parts, and parts equivalent to those in FIG. 2 are given the same reference numerals.
第１図において、TR用パターン２４をプリン
ト基板２のパターン形成側２２に形成するととも
に、TR３の裏面位置に複数のスルーホール用孔
２５を設け、このスルーホール用孔２５を設けた
プリント基板２の部品実装側２１に、放熱器６の
半田流入孔６１と、複数のスルーホール用孔２５
が対応するよう配置して、半田流入孔６１から溶
融した半田７を流し込めば、半田７がスルーホー
ル用孔２５を通つてTR３と放熱器６が一体的に
半田接合される。そしてTR３で発生した熱は半
田７を介して放熱器６から放熱される。 In FIG. 1, a TR pattern 24 is formed on the pattern forming side 22 of the printed circuit board 2, and a plurality of through-hole holes 25 are provided on the back side of the TR 3, and the printed circuit board 2 is provided with the through-hole holes 25. A solder inflow hole 61 of the heatsink 6 and a plurality of through-hole holes 25 are provided on the component mounting side 21 of the radiator 6.
If they are arranged so that they correspond to each other and molten solder 7 is poured from the solder inflow hole 61, the solder 7 passes through the through-hole hole 25, and the TR 3 and the heat sink 6 are integrally soldered together. The heat generated by the TR 3 is then radiated from the heat radiator 6 via the solder 7.
以上述べたように、本考案によれば、トランジ
スタの放熱の制約が改善されるとともに、プリン
ト基板の部品実装側、パターン形成側でのパター
ン形成の拘束が緩和されくので、小形化、高密度
実装が図れる利点がある。
As described above, according to the present invention, constraints on heat dissipation of transistors are improved, and constraints on pattern formation on the component mounting side and pattern formation side of the printed circuit board are relaxed, resulting in miniaturization and high density. It has the advantage of being easy to implement.
第１図は、本考案の実施例を説明するためのａ
は要部断面図、ｂは要部平面図、第２図は、従来
のトランジスタの放熱構造を説明するための要部
断面図である。
図中、１は筐体、、２はプリント基板、３は
TR、４は電子部品、６は放熱器、７は半田、２
２はパターン形成側、２１は部品実装側、２３は
パターン、２４はTR用パターン、２５はスルー
ホール用孔、６１は半田流入孔、をそれぞれ示
す。
FIG. 1 is a diagram for explaining an embodiment of the present invention.
2 is a sectional view of the main part, b is a plan view of the main part, and FIG. 2 is a sectional view of the main part for explaining the heat dissipation structure of a conventional transistor. In the figure, 1 is a housing, 2 is a printed circuit board, and 3 is a
TR, 4 is electronic component, 6 is heatsink, 7 is solder, 2
2 is a pattern forming side, 21 is a component mounting side, 23 is a pattern, 24 is a TR pattern, 25 is a through-hole hole, and 61 is a solder inlet hole.
Claims (1)
スタ３の放熱構造を、 前記基板密着形トランジスタ３を前記プリント
基板２のパターン側２２に実装し、 前記基板密着形トランジスタ３の放熱器６を部
品実装側２１に付設して、 半田流入６１を穿設した放熱器６と基板密着形
トランジスタ３を複数のスルーホール用孔２５を
介して一体的に半田接着するようにしたことを特
徴とするトランジスタの放熱構造。[Claims for Utility Model Registration] A heat dissipation structure for a substrate-contact type transistor 3 mounted on a printed circuit board 2, wherein the substrate-contact type transistor 3 is mounted on the pattern side 22 of the printed circuit board 2; A heatsink 6 is attached to the component mounting side 21, and the heatsink 6 in which the solder inflow 61 is drilled and the substrate contact type transistor 3 are integrally soldered together via a plurality of through-hole holes 25. A transistor heat dissipation structure featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4963785U JPH0316289Y2 (en) | 1985-04-02 | 1985-04-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4963785U JPH0316289Y2 (en) | 1985-04-02 | 1985-04-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61166543U JPS61166543U (en) | 1986-10-16 |
| JPH0316289Y2 true JPH0316289Y2 (en) | 1991-04-08 |
Family
ID=30567025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4963785U Expired JPH0316289Y2 (en) | 1985-04-02 | 1985-04-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0316289Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003289191A (en) * | 2002-03-28 | 2003-10-10 | Denso Corp | Electronic control device |
-
1985
- 1985-04-02 JP JP4963785U patent/JPH0316289Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61166543U (en) | 1986-10-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0926939B1 (en) | Electronic circuit apparatus and method for assembling the same | |
| JPH09213848A (en) | Heat sink of electronic component | |
| JP4165045B2 (en) | Electronics | |
| JPH0316289Y2 (en) | ||
| JPH0155591B2 (en) | ||
| JPS62257786A (en) | Printed wiring board | |
| JP2684893B2 (en) | Hybrid integrated circuit device | |
| JP2003152365A (en) | Cooling structure of electronic circuit package and heat sink | |
| JPH06112676A (en) | Structure for attaching cooling fin | |
| JPS5910790Y2 (en) | package structure | |
| JP2796636B2 (en) | Substrate for mounting electronic components | |
| KR910004738Y1 (en) | Hiting plate possess printed circuit board | |
| JPH0352256A (en) | Heat radiating structure for integrated circuit | |
| JPH0396075U (en) | ||
| JP2888192B2 (en) | Heat dissipation structure for surface mount components | |
| JPS58116233U (en) | Heat dissipation fin structure for printed wiring boards | |
| JPH1117371A (en) | Cooling structure of printed circuit board | |
| JP2943888B2 (en) | Mounting structure of surface mount type semiconductor device | |
| JPH0231794Y2 (en) | ||
| JPS5847718Y2 (en) | heat dissipation printed circuit board | |
| JPH0573978U (en) | Heat dissipation device | |
| JPS6016582U (en) | integrated circuit mounting structure | |
| JPS58175643U (en) | Heat dissipation structure for printed wiring board components | |
| JPH1168032A (en) | Electronic component mounting board | |
| JPH01118494U (en) |