JPS58175643U - Heat dissipation structure for printed wiring board components - Google Patents

Heat dissipation structure for printed wiring board components

Info

Publication number
JPS58175643U
JPS58175643U JP7328882U JP7328882U JPS58175643U JP S58175643 U JPS58175643 U JP S58175643U JP 7328882 U JP7328882 U JP 7328882U JP 7328882 U JP7328882 U JP 7328882U JP S58175643 U JPS58175643 U JP S58175643U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
heat dissipation
dissipation structure
board components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7328882U
Other languages
Japanese (ja)
Inventor
徹 横山
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP7328882U priority Critical patent/JPS58175643U/en
Publication of JPS58175643U publication Critical patent/JPS58175643U/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図は何れも本考案にかかる一実施例で第１図は発熱部品
の搭載される印刷配線板の上面、第２図は第１図の裏面
、第３図は第１図のＡ−Ａ’閉断面図中の符号１は印刷
配線板、２，３は回路パターン、５は導体面、６．７は
スルーホール、８は導体面、９は部品、１３は放熱器を
示す。The figures are all one embodiment of the present invention, and Fig. 1 is the top surface of a printed wiring board on which heat-generating components are mounted, Fig. 2 is the back side of Fig. 1, and Fig. 3 is A-A' in Fig. 1. In the closed sectional view, reference numeral 1 indicates a printed wiring board, 2 and 3 a circuit pattern, 5 a conductor surface, 6.7 a through hole, 8 a conductor surface, 9 a component, and 13 a heat sink.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 印刷配線板の両面＆千該印刷配線板を貫通するスルーホ
ールめっきされたスルーホールと接続される導体面を形
成し、一方の面の該導体面上に搭載される発熱部品の発
生熱を該スルーホールを介して他方の面の該導体面に搭
載される放熱器に伝熱せしめ放熱させるようにしたこと
を特徴とする印刷配線板搭載部品の放熱構造。Through-holes that pass through both sides of the printed wiring board and the printed wiring board form a conductive surface that is connected to the plated through-holes, and conduct the heat generated by the heat-generating components mounted on the conductive surface of one side. 1. A heat dissipation structure for a component mounted on a printed wiring board, characterized in that heat is transferred to and radiated from a radiator mounted on the other conductor surface via a through hole.
JP7328882U 1982-05-19 1982-05-19 Heat dissipation structure for printed wiring board components Pending JPS58175643U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7328882U JPS58175643U (en) 1982-05-19 1982-05-19 Heat dissipation structure for printed wiring board components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7328882U JPS58175643U (en) 1982-05-19 1982-05-19 Heat dissipation structure for printed wiring board components

Publications (1)

Publication Number Publication Date
JPS58175643U true JPS58175643U (en) 1983-11-24

Family

ID=30082801

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7328882U Pending JPS58175643U (en) 1982-05-19 1982-05-19 Heat dissipation structure for printed wiring board components

Country Status (1)

Country Link
JP (1) JPS58175643U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016502280A (en) * 2012-12-19 2016-01-21 ヴァレオ システム テルミク Printed circuit board cooling device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016502280A (en) * 2012-12-19 2016-01-21 ヴァレオ システム テルミク Printed circuit board cooling device

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