JPS58175643U - Heat dissipation structure for printed wiring board components - Google Patents
Heat dissipation structure for printed wiring board componentsInfo
- Publication number
- JPS58175643U JPS58175643U JP7328882U JP7328882U JPS58175643U JP S58175643 U JPS58175643 U JP S58175643U JP 7328882 U JP7328882 U JP 7328882U JP 7328882 U JP7328882 U JP 7328882U JP S58175643 U JPS58175643 U JP S58175643U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- heat dissipation
- dissipation structure
- board components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図は何れも本考案にかかる一実施例で第1図は発熱部品
の搭載される印刷配線板の上面、第2図は第1図の裏面
、第3図は第1図のA−A’閉断面図中の符号1は印刷
配線板、2,3は回路パターン、5は導体面、6.7は
スルーホール、8は導体面、9は部品、13は放熱器を
示す。The figures are all one embodiment of the present invention, and Fig. 1 is the top surface of a printed wiring board on which heat-generating components are mounted, Fig. 2 is the back side of Fig. 1, and Fig. 3 is A-A' in Fig. 1. In the closed sectional view, reference numeral 1 indicates a printed wiring board, 2 and 3 a circuit pattern, 5 a conductor surface, 6.7 a through hole, 8 a conductor surface, 9 a component, and 13 a heat sink.
Claims (1)
ールめっきされたスルーホールと接続される導体面を形
成し、一方の面の該導体面上に搭載される発熱部品の発
生熱を該スルーホールを介して他方の面の該導体面に搭
載される放熱器に伝熱せしめ放熱させるようにしたこと
を特徴とする印刷配線板搭載部品の放熱構造。Through-holes that pass through both sides of the printed wiring board and the printed wiring board form a conductive surface that is connected to the plated through-holes, and conduct the heat generated by the heat-generating components mounted on the conductive surface of one side. 1. A heat dissipation structure for a component mounted on a printed wiring board, characterized in that heat is transferred to and radiated from a radiator mounted on the other conductor surface via a through hole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7328882U JPS58175643U (en) | 1982-05-19 | 1982-05-19 | Heat dissipation structure for printed wiring board components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7328882U JPS58175643U (en) | 1982-05-19 | 1982-05-19 | Heat dissipation structure for printed wiring board components |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58175643U true JPS58175643U (en) | 1983-11-24 |
Family
ID=30082801
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7328882U Pending JPS58175643U (en) | 1982-05-19 | 1982-05-19 | Heat dissipation structure for printed wiring board components |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58175643U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016502280A (en) * | 2012-12-19 | 2016-01-21 | ヴァレオ システム テルミク | Printed circuit board cooling device |
-
1982
- 1982-05-19 JP JP7328882U patent/JPS58175643U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016502280A (en) * | 2012-12-19 | 2016-01-21 | ヴァレオ システム テルミク | Printed circuit board cooling device |
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