JPS5899888U - Electronic circuit unit structure - Google Patents
Electronic circuit unit structureInfo
- Publication number
- JPS5899888U JPS5899888U JP19329781U JP19329781U JPS5899888U JP S5899888 U JPS5899888 U JP S5899888U JP 19329781 U JP19329781 U JP 19329781U JP 19329781 U JP19329781 U JP 19329781U JP S5899888 U JPS5899888 U JP S5899888U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- electronic circuit
- circuit unit
- unit structure
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
Landscapes
- Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来例の平面図、第２図は本考案に係る電子回
路ユニット構造の平面説明図、第３図は第２図の部分拡
大断面図である。
６・・・プリント板、７・・・発熱部品、８・・・熱伝
導板、９・・・ヒートパイプ、１１・・・熱接続コネク
タ、１５・・・バックボード、１６・・・電気接続コネ
クタ、１−８・・・共通放熱板。FIG. 1 is a plan view of a conventional example, FIG. 2 is an explanatory plan view of an electronic circuit unit structure according to the present invention, and FIG. 3 is a partially enlarged sectional view of FIG. 2. 6... Printed board, 7... Heat generating component, 8... Heat conduction plate, 9... Heat pipe, 11... Thermal connection connector, 15... Back board, 16... Electrical connection Connector, 1-8... common heat sink.
Claims (1)
コネクタを介して発熱部品を取付けたプリント板を複数
枚平行に接続した電子回路ユニット構造に於そ、ヒート
パイプを組込んだ熱伝導板を介在させて発熱部品を取付
けたプリント板と、該プリント板の実装間隙に対応して
該プリント板と電気接続する電気接続コネクタと上記ヒ
ートパイプと熱接続する熱接続コネクタとを一面側に着
脱可能に設けると共に他面側に該熱接続コネクタを介し
て取付けられる共通放熱板を設けたバックボードとから
なることを特徴とする電子回路ユニット構造。In the electronic circuit unit structure, a plurality of printed circuit boards with heat-generating components attached are connected in parallel to a backboard provided with an electrical connector via the electrical connector, and a heat conductive plate incorporating a heat pipe is interposed. A printed board on which a heat-generating component is mounted, an electrical connection connector for electrical connection with the printed board and a thermal connection connector for thermal connection with the heat pipe corresponding to the mounting gap of the printed board can be attached and detached on one side. 1. An electronic circuit unit structure comprising: a backboard provided with a common heat dissipation plate attached to the other side via the thermal connection connector;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19329781U JPS5899888U (en) | 1981-12-28 | 1981-12-28 | Electronic circuit unit structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19329781U JPS5899888U (en) | 1981-12-28 | 1981-12-28 | Electronic circuit unit structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5899888U true JPS5899888U (en) | 1983-07-07 |
Family
ID=30106661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19329781U Pending JPS5899888U (en) | 1981-12-28 | 1981-12-28 | Electronic circuit unit structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5899888U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005013657A1 (en) * | 2003-08-01 | 2005-02-10 | Fujitsu Limited | Electronic device cooler |
| JP2007088282A (en) * | 2005-09-22 | 2007-04-05 | Mitsubishi Electric Corp | Peripheral equipment and electronic equipment |
| WO2008114444A1 (en) * | 2007-03-20 | 2008-09-25 | Fujitsu Limited | Radiation structure for electronic device, circuit substrate unit, and casing |
| JP2010080506A (en) * | 2008-09-24 | 2010-04-08 | Hitachi Ltd | Electronic device and thermal connector used for the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5148213U (en) * | 1974-10-08 | 1976-04-10 | ||
| JPS5311502A (en) * | 1976-07-20 | 1978-02-02 | Oki Electric Ind Co Ltd | Radiation structur of electronic apparatus |
| JPS5414914U (en) * | 1977-07-02 | 1979-01-31 |
-
1981
- 1981-12-28 JP JP19329781U patent/JPS5899888U/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5148213U (en) * | 1974-10-08 | 1976-04-10 | ||
| JPS5311502A (en) * | 1976-07-20 | 1978-02-02 | Oki Electric Ind Co Ltd | Radiation structur of electronic apparatus |
| JPS5414914U (en) * | 1977-07-02 | 1979-01-31 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005013657A1 (en) * | 2003-08-01 | 2005-02-10 | Fujitsu Limited | Electronic device cooler |
| JP2007088282A (en) * | 2005-09-22 | 2007-04-05 | Mitsubishi Electric Corp | Peripheral equipment and electronic equipment |
| WO2008114444A1 (en) * | 2007-03-20 | 2008-09-25 | Fujitsu Limited | Radiation structure for electronic device, circuit substrate unit, and casing |
| JP2010080506A (en) * | 2008-09-24 | 2010-04-08 | Hitachi Ltd | Electronic device and thermal connector used for the same |
| JP4567777B2 (en) * | 2008-09-24 | 2010-10-20 | 株式会社日立製作所 | Electronic device and thermal connector used for it |
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