JPS60109386U - Heat dissipation structure - Google Patents

Heat dissipation structure

Info

Publication number
JPS60109386U
JPS60109386U JP19876783U JP19876783U JPS60109386U JP S60109386 U JPS60109386 U JP S60109386U JP 19876783 U JP19876783 U JP 19876783U JP 19876783 U JP19876783 U JP 19876783U JP S60109386 U JPS60109386 U JP S60109386U
Authority
JP
Japan
Prior art keywords
heat dissipation
dissipation structure
metal piece
heating element
thermal conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19876783U
Other languages
Japanese (ja)
Inventor
誠一 古屋
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP19876783U priority Critical patent/JPS60109386U/en
Publication of JPS60109386U publication Critical patent/JPS60109386U/en
Pending legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の放熱構造の斜視図、第2図は第1図のA
−A’切欠断面図、第3図は本考案の実施例である放熱
構造の断面図、第4図は本考案の金属片の斜視図。 1・・・電子部品、2・・・金属、3・・・スペーサ、
4・・・プリント基板、5・・・金属片。
Figure 1 is a perspective view of a conventional heat dissipation structure, and Figure 2 is A of Figure 1.
-A' cutaway sectional view, FIG. 3 is a sectional view of a heat dissipation structure according to an embodiment of the present invention, and FIG. 4 is a perspective view of a metal piece of the present invention. 1...Electronic component, 2...Metal, 3...Spacer,
4... Printed circuit board, 5... Metal piece.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 発熱素子の下面に薄板め熱伝導体を接着させる放熱構造
において、前記発熱素子と前記熱伝導体の間の接着剤の
層に挿入される薄板状で端部に取り外しのための露出部
を有した熱伝導性のある金属片を設け、前記金属片の露
出部を引き取ることにより前記発熱素子の取り外しを容
易にしたことを特徴とする放熱構造。        
In a heat dissipation structure in which a thin thermal conductor is bonded to the lower surface of a heating element, the thin plate is inserted into a layer of adhesive between the heating element and the thermal conductor, and has an exposed part at an end for removal. 1. A heat dissipation structure characterized in that a thermally conductive metal piece is provided, and the heat generating element can be easily removed by removing an exposed portion of the metal piece.
JP19876783U 1983-12-27 1983-12-27 Heat dissipation structure Pending JPS60109386U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19876783U JPS60109386U (en) 1983-12-27 1983-12-27 Heat dissipation structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19876783U JPS60109386U (en) 1983-12-27 1983-12-27 Heat dissipation structure

Publications (1)

Publication Number Publication Date
JPS60109386U true JPS60109386U (en) 1985-07-25

Family

ID=30758064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19876783U Pending JPS60109386U (en) 1983-12-27 1983-12-27 Heat dissipation structure

Country Status (1)

Country Link
JP (1) JPS60109386U (en)

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