JPS5996841U - Heat dissipation structure of hybrid integrated circuit - Google Patents

Heat dissipation structure of hybrid integrated circuit

Info

Publication number
JPS5996841U
JPS5996841U JP19333482U JP19333482U JPS5996841U JP S5996841 U JPS5996841 U JP S5996841U JP 19333482 U JP19333482 U JP 19333482U JP 19333482 U JP19333482 U JP 19333482U JP S5996841 U JPS5996841 U JP S5996841U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
heat dissipation
dissipation structure
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19333482U
Other languages
Japanese (ja)
Other versions
JPS635242Y2 (en
Inventor
佐藤　喜久男
Original Assignee
三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP19333482U priority Critical patent/JPS5996841U/en
Publication of JPS5996841U publication Critical patent/JPS5996841U/en
Application granted granted Critical
Publication of JPS635242Y2 publication Critical patent/JPS635242Y2/ja
Granted legal-status Critical Current

Links

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の混成集積回路基板への発熱電子部品の取
り付けを示す斜視図、第２図は従来の混　−成年積回路
の放熱構造を示す側面図、第３図は本考案の放熱構造を
持った混成集積回路基板への発熱電子部品の取り付けを
示す斜視図、第４図は本　　　−考案の放熱構造を示す
側面図である。 ｊ・・・発熱電子部品、３・・・混成集積回路基板、６
・・・エポキシ系樹脂層、７・・・シリコン樹脂層。Figure 1 is a perspective view showing the attachment of heat generating electronic components to a conventional hybrid integrated circuit board, Figure 2 is a side view showing the heat dissipation structure of a conventional hybrid integrated circuit, and Figure 3 is the heat dissipation structure of the present invention. FIG. 4 is a perspective view showing the attachment of heat-generating electronic components to a hybrid integrated circuit board having an integrated circuit board, and FIG. 4 is a side view showing the heat dissipation structure of the present invention. j... Heat generating electronic component, 3... Hybrid integrated circuit board, 6
... Epoxy resin layer, 7... Silicone resin layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 発熱電子部品が塔載される混成集積回路用の熱伝導性の
良い基板と前記発熱電子部品との間に熱伝導性の良い絶
縁樹脂を印刷硬化させて形成した事を特徴とする混成集
積回路の放熱構造。A hybrid integrated circuit, characterized in that it is formed by printing and curing an insulating resin with good thermal conductivity between a substrate with good thermal conductivity for a hybrid integrated circuit on which heat-generating electronic components are mounted, and the heat-generating electronic components. heat dissipation structure.
JP19333482U 1982-12-20 1982-12-20 Heat dissipation structure of hybrid integrated circuit Granted JPS5996841U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19333482U JPS5996841U (en) 1982-12-20 1982-12-20 Heat dissipation structure of hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19333482U JPS5996841U (en) 1982-12-20 1982-12-20 Heat dissipation structure of hybrid integrated circuit

Publications (2)

Publication Number Publication Date
JPS5996841U true JPS5996841U (en) 1984-06-30
JPS635242Y2 JPS635242Y2 (en) 1988-02-12

Family

ID=30415848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19333482U Granted JPS5996841U (en) 1982-12-20 1982-12-20 Heat dissipation structure of hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS5996841U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5040164U (en) * 1973-08-09 1975-04-24

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5040164U (en) * 1973-08-09 1975-04-24

Also Published As

Publication number Publication date
JPS635242Y2 (en) 1988-02-12

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