JPS60118247U - Heat dissipation device for electronic equipment - Google Patents

Heat dissipation device for electronic equipment

Info

Publication number
JPS60118247U
JPS60118247U JP478784U JP478784U JPS60118247U JP S60118247 U JPS60118247 U JP S60118247U JP 478784 U JP478784 U JP 478784U JP 478784 U JP478784 U JP 478784U JP S60118247 U JPS60118247 U JP S60118247U
Authority
JP
Japan
Prior art keywords
heat dissipation
dissipation device
electronic equipment
heat
abstract
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP478784U
Other languages
Japanese (ja)
Inventor
高村 桂伸
Original Assignee
パイオニア株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パイオニア株式会社 filed Critical パイオニア株式会社
Priority to JP478784U priority Critical patent/JPS60118247U/en
Publication of JPS60118247U publication Critical patent/JPS60118247U/en
Pending legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来知られている内部放熱形式の電子機器用放
熱装置を示す説明斜面図、第2図は同じく外部放熱形式
の電子機器用放熱装置を示す説明斜面図、第3図はこの
考案による電子機器用放熱装置の側断面図、第4図は同
一部の拡大断面図、第5図ないし、第8図は回能の実施
例を示す側断面図である二 11・・・ケーシング、12・・・シャーシ、13,1
5・・七ス、14・・・プリント配線基板、16・・・
発熱素子、17・・・フィン、20・・・ヒートシンク
、21・・・ビス、22.23・・・平坦面、24・・
・挟持片。
Fig. 1 is an explanatory perspective view showing a conventionally known internal heat radiation type heat dissipation device for electronic devices, Fig. 2 is an explanatory perspective view showing an external heat dissipation type heat dissipation device for electronic devices, and Fig. 3 is an explanatory perspective view showing this invention. FIG. 4 is an enlarged sectional view of the same part, and FIGS. 5 to 8 are side sectional views showing embodiments of the heat dissipation device for electronic equipment. 12...Chassis, 13,1
5... Seventh, 14... Printed wiring board, 16...
Heat generating element, 17... Fin, 20... Heat sink, 21... Screw, 22. 23... Flat surface, 24...
・Pinch piece.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ヒートシンクを備える電子機器用放熱装置において、ヒ
ートシンクと、外部ケーシングとの間を熱伝導手段で連
結したことを特徴とする電子機器用放熱装置。
1. A heat dissipation device for electronic devices including a heat sink, characterized in that the heat sink and an external casing are connected by a heat conduction means.
JP478784U 1984-01-18 1984-01-18 Heat dissipation device for electronic equipment Pending JPS60118247U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP478784U JPS60118247U (en) 1984-01-18 1984-01-18 Heat dissipation device for electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP478784U JPS60118247U (en) 1984-01-18 1984-01-18 Heat dissipation device for electronic equipment

Publications (1)

Publication Number Publication Date
JPS60118247U true JPS60118247U (en) 1985-08-09

Family

ID=30480693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP478784U Pending JPS60118247U (en) 1984-01-18 1984-01-18 Heat dissipation device for electronic equipment

Country Status (1)

Country Link
JP (1) JPS60118247U (en)

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