JPS5911452U - Electronic component equipment with heat sink - Google Patents
Electronic component equipment with heat sinkInfo
- Publication number
- JPS5911452U JPS5911452U JP10577882U JP10577882U JPS5911452U JP S5911452 U JPS5911452 U JP S5911452U JP 10577882 U JP10577882 U JP 10577882U JP 10577882 U JP10577882 U JP 10577882U JP S5911452 U JPS5911452 U JP S5911452U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- electronic component
- component equipment
- smaller
- back surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図および第2図は従来の放熱器付き電子部品装置を
示す斜視図および正面図、第3図および第4図は本考案
の放熱器付き電子部品装置の一実施例を示す斜視図およ
び正面図である。
1・・・・・・放熱器付き電子部品装置(パワーIC)
、′ 2・・・・・・電子部品本体(パワーIC本体)
、2′・・・・・・電子部品の背面、3・・・・・・放
熱器、4・・・・・・プリント配線板、6・・・・・・
リードピン、7・・−・・・挿通孔、8・・・・・・放
熱基板、9.9′・・・・・・放熱片。1 and 2 are a perspective view and a front view showing a conventional electronic component device with a heat sink, and FIGS. 3 and 4 are perspective views and front views showing an embodiment of the electronic component device with a heat sink of the present invention. It is a front view. 1...Electronic component device with heatsink (power IC)
,' 2...Electronic component body (power IC body)
, 2'... Back side of electronic components, 3... Heatsink, 4... Printed wiring board, 6...
Lead pin, 7... Insertion hole, 8... Heat dissipation board, 9.9'... Heat dissipation piece.
Claims (1)
けてなる放熱器付き電子部品装置において、前記放熱器
が、前記電子部品の背面形状とほぼ同等もしくは小さな
形状を有しかつ前記電子部品の背面の範囲内に配置され
た放熱基板に、拡開する放熱片を立設させて構成してな
ることを性徴とする放熱器付き電子部品装置。In an electronic component device with a heat sink, the heat sink has a shape substantially equal to or smaller than the back surface of the electronic component, and the heat sink has a shape substantially equal to or smaller than the back surface of the electronic component. 1. An electronic component device with a heat sink, characterized by comprising a heat sink that expands and is erected on a heat sink disposed within the range of the heat sink.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10577882U JPS5911452U (en) | 1982-07-13 | 1982-07-13 | Electronic component equipment with heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10577882U JPS5911452U (en) | 1982-07-13 | 1982-07-13 | Electronic component equipment with heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5911452U true JPS5911452U (en) | 1984-01-24 |
Family
ID=30247800
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10577882U Pending JPS5911452U (en) | 1982-07-13 | 1982-07-13 | Electronic component equipment with heat sink |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5911452U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014241410A (en) * | 2013-05-17 | 2014-12-25 | 京セラ株式会社 | Heat dissipation member, electronic equipment using the same, and picture display unit |
-
1982
- 1982-07-13 JP JP10577882U patent/JPS5911452U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014241410A (en) * | 2013-05-17 | 2014-12-25 | 京セラ株式会社 | Heat dissipation member, electronic equipment using the same, and picture display unit |
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