JPS6052629U - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JPS6052629U JPS6052629U JP1983143939U JP14393983U JPS6052629U JP S6052629 U JPS6052629 U JP S6052629U JP 1983143939 U JP1983143939 U JP 1983143939U JP 14393983 U JP14393983 U JP 14393983U JP S6052629 U JPS6052629 U JP S6052629U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- hybrid integrated
- heat dissipation
- metal case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の混成集積回路装置の断面図、第2図は本
考案において使用する出力用半導体装置の正面図、第3
図はその側面図、第4図は本考案の1実施例を示す断面
図、第5図は出力用半導体装置の取付は金具を示す斜視
図、第6図は取付は金具を使用して出力用半導体装置を
固定した状態を示す断面図、第7図〜第9図は本考案の
他の実施例を示す断面図である。
5は電子部品、11は混成集積回路装置、12は小型半
導体装置、13は出力用半導体装置、14は放熱体、1
5は金属製ケース、16は印刷配線基板、17は放熱面
である。
第6図
第7図Figure 1 is a sectional view of a conventional hybrid integrated circuit device, Figure 2 is a front view of an output semiconductor device used in the present invention, and Figure 3 is a front view of an output semiconductor device used in the present invention.
The figure is a side view, FIG. 4 is a sectional view showing one embodiment of the present invention, FIG. 5 is a perspective view showing a metal fitting for mounting the output semiconductor device, and FIG. FIGS. 7 to 9 are cross-sectional views showing other embodiments of the present invention. 5 is an electronic component, 11 is a hybrid integrated circuit device, 12 is a small semiconductor device, 13 is an output semiconductor device, 14 is a heat sink, 1
5 is a metal case, 16 is a printed wiring board, and 17 is a heat radiation surface. Figure 6 Figure 7
Claims (1)
導体装置と、その他の電子部品と、保護ケースとからな
る混成集積回路装置において、上記保護ケースを金属製
ケースとなし、上記金属製ケースに上記放熱体の放熱面
を密着させるようにしたことを特徴とする混成集積回路
装置。In a hybrid integrated circuit device comprising a printed wiring board, a resin-molded semiconductor device having a heat sink, other electronic components, and a protective case, the protective case is a metal case, and the metal case is A hybrid integrated circuit device characterized in that a heat dissipation surface of the heat dissipation body is brought into close contact with the heat dissipation surface of the heat dissipation body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983143939U JPS6052629U (en) | 1983-09-16 | 1983-09-16 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983143939U JPS6052629U (en) | 1983-09-16 | 1983-09-16 | Hybrid integrated circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6052629U true JPS6052629U (en) | 1985-04-13 |
Family
ID=30321143
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1983143939U Pending JPS6052629U (en) | 1983-09-16 | 1983-09-16 | Hybrid integrated circuit device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6052629U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003283161A (en) * | 2002-03-27 | 2003-10-03 | Oriental Motor Co Ltd | Structure of driving unit or control unit of motor |
-
1983
- 1983-09-16 JP JP1983143939U patent/JPS6052629U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003283161A (en) * | 2002-03-27 | 2003-10-03 | Oriental Motor Co Ltd | Structure of driving unit or control unit of motor |
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