JPS6052629U - Hybrid integrated circuit device - Google Patents

Hybrid integrated circuit device

Info

Publication number
JPS6052629U
JPS6052629U JP1983143939U JP14393983U JPS6052629U JP S6052629 U JPS6052629 U JP S6052629U JP 1983143939 U JP1983143939 U JP 1983143939U JP 14393983 U JP14393983 U JP 14393983U JP S6052629 U JPS6052629 U JP S6052629U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
hybrid integrated
heat dissipation
metal case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983143939U
Other languages
Japanese (ja)
Inventor
冨居　壱城
田島　恒宗
Original Assignee
ソニー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ソニー株式会社 filed Critical ソニー株式会社
Priority to JP1983143939U priority Critical patent/JPS6052629U/en
Publication of JPS6052629U publication Critical patent/JPS6052629U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の混成集積回路装置の断面図、第２図は本
考案において使用する出力用半導体装置の正面図、第３
図はその側面図、第４図は本考案の１実施例を示す断面
図、第５図は出力用半導体装置の取付は金具を示す斜視
図、第６図は取付は金具を使用して出力用半導体装置を
固定した状態を示す断面図、第７図〜第９図は本考案の
他の実施例を示す断面図である。 ５は電子部品、１１は混成集積回路装置、１２は小型半
導体装置、１３は出力用半導体装置、１４は放熱体、１
５は金属製ケース、１６は印刷配線基板、１７は放熱面
である。 第６図 第７図Figure 1 is a sectional view of a conventional hybrid integrated circuit device, Figure 2 is a front view of an output semiconductor device used in the present invention, and Figure 3 is a front view of an output semiconductor device used in the present invention.
The figure is a side view, FIG. 4 is a sectional view showing one embodiment of the present invention, FIG. 5 is a perspective view showing a metal fitting for mounting the output semiconductor device, and FIG. FIGS. 7 to 9 are cross-sectional views showing other embodiments of the present invention. 5 is an electronic component, 11 is a hybrid integrated circuit device, 12 is a small semiconductor device, 13 is an output semiconductor device, 14 is a heat sink, 1
5 is a metal case, 16 is a printed wiring board, and 17 is a heat radiation surface. Figure 6 Figure 7

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 印刷配線基板と、放熱体を有して樹脂モールドされた半
導体装置と、その他の電子部品と、保護ケースとからな
る混成集積回路装置において、上記保護ケースを金属製
ケースとなし、上記金属製ケースに上記放熱体の放熱面
を密着させるようにしたことを特徴とする混成集積回路
装置。In a hybrid integrated circuit device comprising a printed wiring board, a resin-molded semiconductor device having a heat sink, other electronic components, and a protective case, the protective case is a metal case, and the metal case is A hybrid integrated circuit device characterized in that a heat dissipation surface of the heat dissipation body is brought into close contact with the heat dissipation surface of the heat dissipation body.
JP1983143939U 1983-09-16 1983-09-16 Hybrid integrated circuit device Pending JPS6052629U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983143939U JPS6052629U (en) 1983-09-16 1983-09-16 Hybrid integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983143939U JPS6052629U (en) 1983-09-16 1983-09-16 Hybrid integrated circuit device

Publications (1)

Publication Number Publication Date
JPS6052629U true JPS6052629U (en) 1985-04-13

Family

ID=30321143

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983143939U Pending JPS6052629U (en) 1983-09-16 1983-09-16 Hybrid integrated circuit device

Country Status (1)

Country Link
JP (1) JPS6052629U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003283161A (en) * 2002-03-27 2003-10-03 Oriental Motor Co Ltd Structure of driving unit or control unit of motor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003283161A (en) * 2002-03-27 2003-10-03 Oriental Motor Co Ltd Structure of driving unit or control unit of motor

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