JPS58196853U - Thermal conduction cooling chip module - Google Patents
Thermal conduction cooling chip moduleInfo
- Publication number
- JPS58196853U JPS58196853U JP9306582U JP9306582U JPS58196853U JP S58196853 U JPS58196853 U JP S58196853U JP 9306582 U JP9306582 U JP 9306582U JP 9306582 U JP9306582 U JP 9306582U JP S58196853 U JPS58196853 U JP S58196853U
- Authority
- JP
- Japan
- Prior art keywords
- thermal conduction
- chip module
- conduction cooling
- cooling chip
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の熱伝導冷却チップモジュール例の断面図
、第２図は本考案の部品断面図、第３゜４図は第２図の
部品を組込んだ熱伝導冷却チップモジュール例の断面図
である。
５・・・・・・ゴム状耐熱容器。Figure 1 is a cross-sectional view of an example of a conventional thermal conduction cooling chip module, Figure 2 is a cross-sectional view of a component of the present invention, and Figures 3-4 are a cross-section of an example of a thermal conduction cooling chip module incorporating the components shown in Figure 2. It is a diagram. 5...Rubber-like heat-resistant container.
Claims (1)
ップを冷却する構造において、熱媒体を封入したゴム状
の耐熱容器をヒートシンクに取付けて、チップ背面に接
触して当てかうことを特徴とする熱伝導冷却チップモジ
ュール。In a structure for cooling a chip CCB-bonded on a circuit board having high-density connections, a rubber-like heat-resistant container containing a heat medium is attached to a heat sink and is brought into contact with the back surface of the chip. Thermal conduction cooling chip module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9306582U JPS58196853U (en) | 1982-06-23 | 1982-06-23 | Thermal conduction cooling chip module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9306582U JPS58196853U (en) | 1982-06-23 | 1982-06-23 | Thermal conduction cooling chip module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58196853U true JPS58196853U (en) | 1983-12-27 |
Family
ID=30223649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9306582U Pending JPS58196853U (en) | 1982-06-23 | 1982-06-23 | Thermal conduction cooling chip module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58196853U (en) |
-
1982
- 1982-06-23 JP JP9306582U patent/JPS58196853U/en active Pending
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