JPS5967247U - thermal head - Google Patents
thermal headInfo
- Publication number
- JPS5967247U JPS5967247U JP16365282U JP16365282U JPS5967247U JP S5967247 U JPS5967247 U JP S5967247U JP 16365282 U JP16365282 U JP 16365282U JP 16365282 U JP16365282 U JP 16365282U JP S5967247 U JPS5967247 U JP S5967247U
- Authority
- JP
- Japan
- Prior art keywords
- film substrate
- thermal head
- thin film
- thick film
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electronic Switches (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図面はこの考案の一実施例を示すもので、第１図は平面
図、第２図はケースを取りはずした状態の平面図、第３
図は縦断側面図である。
１・・・薄膜基板、２・・・厚膜基板、３・・・放熱板
、４・・・発熱部、６・・・ＩＣチップ、９・・・外部
電極、１０・・・ケース。The drawings show one embodiment of this invention; Fig. 1 is a plan view, Fig. 2 is a plan view with the case removed, and Fig. 3 is a plan view with the case removed.
The figure is a longitudinal side view. DESCRIPTION OF SYMBOLS 1... Thin film substrate, 2... Thick film substrate, 3... Heat sink, 4... Heat generating part, 6... IC chip, 9... External electrode, 10... Case.
Claims (1)
付けられるとともに外部電極への接続部を厚膜により形
成した厚膜基板とをたがいに電気的に接続しつつ一枚の
放熱板に固定し、前記電子部品を覆うケースを前記薄膜
基板と前記厚膜基板との両者にまたがって接着固定した
ことを特徴とするサーマル′ヘッド。A thin film substrate, on which the heat generating part is formed of a thin film, and a thick film substrate, on which electronic components are attached and a connection part to an external electrode is formed of a thick film, are electrically connected to each other and fixed to a single heat sink. . A thermal head, characterized in that a case covering the electronic component is adhesively fixed across both the thin film substrate and the thick film substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16365282U JPS5967247U (en) | 1982-10-28 | 1982-10-28 | thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16365282U JPS5967247U (en) | 1982-10-28 | 1982-10-28 | thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5967247U true JPS5967247U (en) | 1984-05-07 |
Family
ID=30359021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16365282U Pending JPS5967247U (en) | 1982-10-28 | 1982-10-28 | thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5967247U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5417853A (en) * | 1977-07-11 | 1979-02-09 | Nec Corp | Manufacture of integrated thermal heads |
| JPS57116664A (en) * | 1981-01-14 | 1982-07-20 | Ricoh Co Ltd | Thermal head device |
-
1982
- 1982-10-28 JP JP16365282U patent/JPS5967247U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5417853A (en) * | 1977-07-11 | 1979-02-09 | Nec Corp | Manufacture of integrated thermal heads |
| JPS57116664A (en) * | 1981-01-14 | 1982-07-20 | Ricoh Co Ltd | Thermal head device |
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