JPS57116664A - Thermal head device - Google Patents
Thermal head deviceInfo
- Publication number
- JPS57116664A JPS57116664A JP56004046A JP404681A JPS57116664A JP S57116664 A JPS57116664 A JP S57116664A JP 56004046 A JP56004046 A JP 56004046A JP 404681 A JP404681 A JP 404681A JP S57116664 A JPS57116664 A JP S57116664A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- tape carrier
- substrate
- bonded
- thermal head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Electronic Switches (AREA)
Abstract
PURPOSE:To prevent attachment of metal powder and dust and to prevent damages and the like due to the collision against other bodies by coating the bonding part between the IC chip and tape carrier on the thermal head device and the IC chip by a flexible resin, and further providing a protective cover. CONSTITUTION:On the thermal head device, heating resistors 4 on a ceramic substrate 2 and conducting wires 7 on the driving side on a glass epoxy substrate 3 are connected by tape carriers 8, and an IC chip 20 on which a driving transistor array and a shift register are incorporated are mounted on each tape carrier 8. Said tape carrier 8 is cut by a wire 15 which passes openings 10 and 12. A terminal part 13a is bonded to an electrode 5 on the substrate 2. Meanwhile a terminal part 14b is bonded to the conducting wires 7 on the substrate 3. Lead terminals 21 of the IC chip 20 are bonded to terminal parts 13b and 14a of the conducting wires 13 and 14 by the bonding parts 22. The IC chips 20 and the bonding parts 22 are coated by the flexible resin. A protecting cover 25 which covers the tape carrier 8 is further attached.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56004046A JPS57116664A (en) | 1981-01-14 | 1981-01-14 | Thermal head device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56004046A JPS57116664A (en) | 1981-01-14 | 1981-01-14 | Thermal head device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57116664A true JPS57116664A (en) | 1982-07-20 |
Family
ID=11573972
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56004046A Pending JPS57116664A (en) | 1981-01-14 | 1981-01-14 | Thermal head device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57116664A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5967247U (en) * | 1982-10-28 | 1984-05-07 | 東芝テック株式会社 | thermal head |
EP1077135A1 (en) * | 1998-05-08 | 2001-02-21 | Shinko Electric Co. Ltd. | Thermal head and thermal printer |
-
1981
- 1981-01-14 JP JP56004046A patent/JPS57116664A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5967247U (en) * | 1982-10-28 | 1984-05-07 | 東芝テック株式会社 | thermal head |
EP1077135A1 (en) * | 1998-05-08 | 2001-02-21 | Shinko Electric Co. Ltd. | Thermal head and thermal printer |
EP1077135A4 (en) * | 1998-05-08 | 2001-10-31 | Shinko Electric Co Ltd | Thermal head and thermal printer |
US6339444B1 (en) | 1998-05-08 | 2002-01-15 | Shinko Electric Co., Ltd. | Thermal heat and thermal printer |
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