JPS641262A - Electronic device and manufacture thereof - Google Patents

Electronic device and manufacture thereof

Info

Publication number
JPS641262A
JPS641262A JP62155482A JP15548287A JPS641262A JP S641262 A JPS641262 A JP S641262A JP 62155482 A JP62155482 A JP 62155482A JP 15548287 A JP15548287 A JP 15548287A JP S641262 A JPS641262 A JP S641262A
Authority
JP
Japan
Prior art keywords
film
base
pellet
lead
gang
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62155482A
Other languages
Japanese (ja)
Other versions
JPH011262A (en
JP2516770B2 (en
Inventor
Hidekazu Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Microcomputer System Ltd
Hitachi Ltd
Original Assignee
Hitachi Ltd
Hitachi Microcomputer Engineering Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Microcomputer Engineering Ltd filed Critical Hitachi Ltd
Priority to JP62155482A priority Critical patent/JP2516770B2/en
Publication of JPS641262A publication Critical patent/JPS641262A/en
Publication of JPH011262A publication Critical patent/JPH011262A/en
Application granted granted Critical
Publication of JP2516770B2 publication Critical patent/JP2516770B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To follow to a flexible substrate and to omit the step of forming a resin-sealed package by interposing and sealing a pellet gang bonded to electrically connect electrode pad group to a plurality of leads between a base and a film having flexibility.
CONSTITUTION: A pellet 8 secured to a reinforcing piece 10 is gang bonded by a bonding device 11 to lead group 6 of a lead film 4. Here, a base 2 and a film 5 of the lead film 4 are so shaped as to perform flexibility with a material having insulation. Then, the gang-bonded film 4 is so coating in a hermetical seal as to hole the lead group 6 and the pellet 8 on the base 2. The step of molding resin of a package can be omitted, and since the package 16 made of the film 4 and the base 2 can perform flexibility in its mounting state, it can sufficiently follow up to bend to be deformed.
COPYRIGHT: (C)1989,JPO&Japio
JP62155482A 1987-06-24 1987-06-24 Electronic device and manufacturing method thereof Expired - Fee Related JP2516770B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62155482A JP2516770B2 (en) 1987-06-24 1987-06-24 Electronic device and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62155482A JP2516770B2 (en) 1987-06-24 1987-06-24 Electronic device and manufacturing method thereof

Publications (3)

Publication Number Publication Date
JPS641262A true JPS641262A (en) 1989-01-05
JPH011262A JPH011262A (en) 1989-01-05
JP2516770B2 JP2516770B2 (en) 1996-07-24

Family

ID=15607010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62155482A Expired - Fee Related JP2516770B2 (en) 1987-06-24 1987-06-24 Electronic device and manufacturing method thereof

Country Status (1)

Country Link
JP (1) JP2516770B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5165165A (en) * 1989-06-02 1992-11-24 Canon Kabushiki Kaisha Part inserting apparatus and method for use
WO1996024162A1 (en) * 1995-02-02 1996-08-08 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Chip housing and process for producing it
JP2021158152A (en) * 2020-03-25 2021-10-07 株式会社村田製作所 Elastic electronic component and elastic electronic component mounting board

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52159163U (en) * 1976-05-27 1977-12-02
JPS5543871A (en) * 1978-09-22 1980-03-27 Casio Comput Co Ltd Packaging of semiconductor device
JPS6172856U (en) * 1984-10-08 1986-05-17

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52159163U (en) * 1976-05-27 1977-12-02
JPS5543871A (en) * 1978-09-22 1980-03-27 Casio Comput Co Ltd Packaging of semiconductor device
JPS6172856U (en) * 1984-10-08 1986-05-17

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5165165A (en) * 1989-06-02 1992-11-24 Canon Kabushiki Kaisha Part inserting apparatus and method for use
WO1996024162A1 (en) * 1995-02-02 1996-08-08 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Chip housing and process for producing it
JP2021158152A (en) * 2020-03-25 2021-10-07 株式会社村田製作所 Elastic electronic component and elastic electronic component mounting board

Also Published As

Publication number Publication date
JP2516770B2 (en) 1996-07-24

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