JP2021158152A - Elastic electronic component and elastic electronic component mounting board - Google Patents

Abstract

To provide an electronic component which prevents disconnection between an elastic wiring board and the electronic component when the board is stretched with the component mounted thereon.SOLUTION: An elastic electronic component comprises: an electronic component 10; a seal resin 20 which seals the electronic component 10 and comprises a mounting surface 22; and a wiring electrically connected to the electronic component 10 and extracted to the mounting surface 22. The seal resin 20 is elastic. The connection between the electronic component 10 and the wiring is achieved outside the mounting surface 22. The wiring includes a plurality of electrodes 41 and 42 for mounting at the terminal ends of the mounting surface 22. When the distance between the electrodes 41 and 42 for mounting is stretched by 3% in the mounting surface 22, the percent elongation between the plurality of electrodes 41 and 42 for mounting in the mounting surface 22 is larger than any percent elongation in the surface of the seal resin 20 measured in the same direction as a stretched direction of a distance between the plurality of electrodes 41 and 42 for mounting in the other surface parallel to the mounting surface 22.SELECTED DRAWING: Figure 3

Description

The present invention relates to a stretchable electronic component and a stretchable electronic component mounting substrate.

In recent years, the state of the human body and the like have been managed by acquiring and analyzing biological information.
As a substrate for acquiring biometric information, an elastic wiring board that is attached to a living body and used is known.
Electronic components that function to acquire biometric information are mounted on the stretchable wiring board.

Patent Document 1 describes a stretchable wiring board (stretchable circuit board) on which electronic components are mounted. The stretchable wiring board disclosed in Patent Document 1 is formed so that the connection portion for electrically connecting the electronic component and the stretchable wiring has elasticity and the Young's modulus is equal to or higher than that of the stretchable wiring. There is.

Japanese Unexamined Patent Publication No. 2016-143763

In FIG. 2 of Patent Document 1, the lower surface of the electronic component is a mounting surface, and the connection terminal of the electronic component is connected to the connection portion on the mounting surface.
When such an elastic wiring board extends in the lateral direction, a large force is applied to the boundary between the connection terminal and the connection portion on the lower surface of the electronic component. It is considered that Patent Document 1 provides a connecting portion in order to prevent disconnection due to this force.

However, the configuration of Patent Document 1 cannot completely prevent disconnection.
Even in the stretchable wiring board, since the electronic component itself is a hard material, the electronic component itself cannot expand and contract in accordance with the expansion and contraction of the elastic wiring. Therefore, it is difficult to fundamentally prevent disconnection if a force is applied to a portion where an electronic component is mounted on a substrate or the like.

The present invention has been made to solve the above problems, and is an electronic component that prevents disconnection between the substrate and the electronic component when the stretchable wiring board is mounted on the stretchable wiring board and the stretchable wiring board is expanded and contracted. The purpose is to provide.

The stretchable electronic component of the present invention seals the electronic component and the periphery of the electronic component, and is electrically connected to the sealing resin provided with a mounting surface and the electronic component. It is provided with wiring that is drawn out to the mounting surface, the sealing resin has elasticity, and the connection between the electronic component and the wiring is made at a portion other than the mounting surface, and the wiring is Has a plurality of mounting electrodes at its ends on the mounting surface, and when the distance between the plurality of mounting electrodes on the mounting surface is extended by 3%, the plurality of mountings on the mounting surface Between the surfaces of the sealing resin, the elongation between the mounting electrodes was measured in the same direction as the extending distance between the plurality of mounting electrodes on the other surface parallel to the mounting surface. It is characterized by being larger than any of the growth rates.

The stretchable electronic component mounting substrate of the present invention is characterized by comprising a substrate and the stretchable electronic component of the present invention mounted on the substrate on the mounting surface thereof.

According to the present invention, it is possible to provide an electronic component that is mounted on an elastic wiring board to prevent disconnection between the substrate and the electronic component when the elastic wiring board is expanded and contracted.

FIG. 1 is a perspective view schematically showing an elastic electronic component of the first embodiment. FIG. 2 is a cross-sectional view schematically showing a stretchable electronic component cut in a cross section parallel to the thickness direction and the length direction. FIG. 3 is a cross-sectional view schematically showing a stretchable electronic component cut in a cross section parallel to the thickness direction and the length direction. FIG. 4 is a top view schematically showing the stretchable electronic component of the first embodiment when viewed from the first main surface. FIG. 5 is a perspective view schematically showing the stretchable electronic component of the second embodiment. FIG. 6 is a top view schematically showing the stretchable electronic component of the second embodiment when viewed from the first main surface. FIG. 7 is a perspective view schematically showing the stretchable electronic component of the third embodiment. FIG. 8 is a perspective view schematically showing the stretchable electronic component of the fourth embodiment. FIG. 9 is a perspective view schematically showing the stretchable electronic component of the fifth embodiment. FIG. 10 is a cross-sectional view schematically showing the stretchable electronic component of the sixth embodiment. FIG. 11 is a cross-sectional view schematically showing the elastic electronic component mounting substrate of the first embodiment. FIG. 12 is a cross-sectional view schematically showing the elastic electronic component mounting substrate of the second embodiment.

Hereinafter, the stretchable electronic component and the stretchable electronic component mounting substrate of the present invention will be described.
However, the present invention is not limited to the following configurations, and can be appropriately modified and applied without changing the gist of the present invention. It should be noted that a combination of two or more of the individual preferred configurations of the present invention described below is also the present invention.

It goes without saying that each of the embodiments shown below is an example, and partial replacement or combination of the configurations shown in different embodiments is possible. In the second and subsequent embodiments, the description of the matters common to the first embodiment will be omitted, and only the differences will be described. In particular, the same action and effect due to the same configuration will not be mentioned sequentially for each embodiment.
In the following description, when each embodiment is not particularly distinguished, it is simply referred to as "the elastic electronic component of the present invention" or "the elastic electronic component mounting substrate of the present invention".

[First Embodiment of Elastic Electronic Components]
FIG. 1 is a perspective view schematically showing an elastic electronic component of the first embodiment.
FIG. 1 is a perspective view of the stretchable electronic component 1 as viewed from the mounting surface side (lower side), and is shown by allowing the sealing resin to pass through in order to show the internal structure of the sealing resin.
The stretchable electronic component 1 includes an electronic component 10 and a sealing resin 20 that seals the periphery of the electronic component 10. The shape of the stretchable electronic component 1 is a rectangular parallelepiped or a substantially rectangular parallelepiped shape, which is substantially the same as the shape of the sealing resin 20.
The sealing resin 20 is a stretchable resin and has a first main surface 21 and a second main surface 22 facing in the thickness direction (in the direction of arrow T in FIG. 1). The second main surface 22 is a mounting surface on which elastic electronic components are mounted.
Further, the sealing resin 20 is orthogonal to the first side surface 23 and the second side surface 24 facing the length direction (in FIG. 1, the arrow L direction) orthogonal to the thickness direction in the thickness direction and the length direction. It has a third side surface 25 and a fourth side surface 26 facing in the width direction (in the direction of arrow W in FIG. 1).

In the stretchable electronic component of the present invention, the electronic component and the wiring are connected at a portion other than the mounting surface.
In the stretchable electronic component 1, the electronic component 10 is arranged adjacent to the first main surface 21 of the sealing resin 20 in the sealing resin 20, and the connection between the electronic component 10 and the wiring 30 is the first main surface. It is on the surface 21.

The wiring 30 is electrically connected to the electronic component 10. The wiring 30 includes a first lead-out wiring 31 and a second lead-out wiring 32. The wiring 30 has a plurality of mounting electrodes at the ends of the second main surface 22 of the sealing resin 20, which is the mounting surface.
The first lead-out wiring 31 is connected to the first external electrode 11 of the electronic component 10 on the first main surface 21 of the sealing resin 20. Then, it reaches the second main surface 22 from the first main surface 21 via the first side surface 23. Then, on the second main surface 22, the end of the first lead-out wiring 31 has a first mounting electrode 41.
The second lead-out wiring 32 is connected to the second external electrode 12 of the electronic component 10 on the first main surface 21 of the sealing resin 20. Then, it reaches the second main surface 22 from the first main surface 21 via the second side surface 24. Then, on the second main surface 22, the end of the second lead-out wiring 32 has a second mounting electrode 42.

The resin layer 51 is provided on the back surface of the connection surface between the electronic component 10 of the sealing resin 20 and the wiring 30, that is, on the outside of the first main surface 21.

In the stretchable electronic component of the present invention having such a configuration, when the distance between the plurality of mounting electrodes on the mounting surface is extended by 3%, the elongation rate between the plurality of mounting electrodes on the mounting surface is increased. Another feature parallel to the mounting surface is that the distance between the plurality of mounting electrodes is larger than any of the elongation rates between the surfaces of the sealing resin measured in the same direction as the extension direction. Has. This will be described with reference to the drawings.

2 and 3 are cross-sectional views schematically showing a stretchable electronic component cut in a cross section parallel to the thickness direction and the length direction. FIG. 2 shows a reference state before extending the distance between the mounting electrodes, and FIG. 3 shows a state in which the distance between the mounting electrodes is extended.

In the stretchable electronic component 1, the sealing resin 20 has elasticity. Therefore, as shown in FIG. 3, the first mounting electrode 41 and the second mounting are extended so that the distance between the first mounting electrode 41 and the second mounting electrode 42 (that is, the distance between the mounting electrodes) is extended. When a force is applied to the electrode 42, the sealing resin 20 stretches and the shape of the stretchable electronic component 1 changes. When a force is applied so as to increase the distance between the mounting electrodes, the sealing resin 20 stretches most on the mounting surface (second main surface 22) and extends upward in the thickness direction (toward the first main surface 21). The amount of elongation of the sealing resin 20 decreases toward the direction (direction, arrow T direction). Therefore, the cross-sectional shape of the stretchable electronic component 1 whose cross-sectional shape is originally substantially rectangular becomes a substantially trapezoidal shape in which the mounting surface side to which the stretching force is applied has a long side.

In the stretchable electronic component of the present invention, the connection between the electronic component and the wiring is made at a portion other than the mounting surface. Since the sealing resin stretches most on the mounting surface, the portion where the electronic component and the wiring are connected is a portion where the elongation is smaller than that on the mounting surface.
That is, the force applied between the electronic component and the wiring at the portion where the electronic component and the wiring are connected is smaller than that when the electronic component and the wiring are connected on the mounting surface.
Therefore, when the stretchable electronic component is mounted on the stretchable wiring board and the stretchable wiring board is stretched (stretched), breakage at a portion where the electronic component and the wiring are connected is prevented.
Further, even if the mounting electrode is greatly extended, since there is no hard electronic component on the mounting surface, even if the mounting electrode on the mounting surface is extended, disconnection with the mounting portion is prevented.

It is determined as follows that the sealing resin stretches most on the mounting surface.
The elastic electronic component 1 is mounted on the elastic wiring board at the positions of the first mounting electrode 41 and the second mounting electrode 42, and the first mounting electrode 41 is on the left and the second mounting electrode 42 is on the right. The state in which the force is applied in the extending direction is considered to be the state in which the distance between the mounting electrodes is extended.
Before extending the distance between the mounting electrode, and the first mounting electrode 41 distance between the second mounting electrode 42 is a distance indicated by the double arrow P ₁ in FIG. This distance is the left end of the first mounting electrode 41 (the end far from the second mounting electrode 42) and the right end of the second mounting electrode 42 (first) before extending the distance between the mounting electrodes. It is defined as the distance from the end portion on the side far from the mounting electrode 41).
After extending the distance between the mounting electrode, and the first mounting electrode 41 distance between the second mounting electrode 42 is a distance indicated by the double arrow S ₁ in FIG. This distance is determined by the left end of the first mounting electrode 41 (the end far from the second mounting electrode 42) and the right end of the second mounting electrode 42 (the second) after extending the distance between the mounting electrodes. 1) The distance from the mounting electrode 41 (the end far from the mounting electrode 41) is defined.
That extend 3% of the distance between the plurality of mounting electrodes on the mounting surface, for mounting such that the distance indicated by the double arrow S ₁ in FIG. 3 becomes 3% longer than the distance indicated by the double arrow P ₁ in FIG. 2 It means increasing the distance between the electrodes.
In this case, the elongation ratio between the plurality of mounting electrodes on the mounting surface is represented by the following formula (1) and is 3%.
Elongation rate [%] between multiple mounting electrodes on the mounting surface
= [(S ₁ / P ₁ ) × 100] -100 equation (1)

The elongation rate [%] between the plurality of mounting electrodes on the mounting surface obtained as described above is compared with the elongation rate [%] on the other surface parallel to the mounting surface.
Even on other surfaces parallel to the mounting surface, the direction in which the stretchable electronic component is extended is the same as the direction in which the distance between the plurality of mounting electrodes is extended.
As the other surface parallel to the mounting surface, the other four surfaces obtained by dividing the stretchable electronic component in the thickness direction are used. 2 and 3 show the positions of the other four surfaces.
The other four surfaces are the first main surface (fifth surface) of the sealing resin, the intermediate surface (third surface) in the thickness direction with respect to the first main surface and the second main surface of the sealing resin, and the sealing. The first main surface of the stop resin and the surface intermediate to the third surface in the thickness direction (fourth surface), the second main surface of the sealing resin (first surface, mounting surface) and the third surface. It is an intermediate surface (second surface) with respect to the thickness direction.

For these four surfaces, the elongation rate is calculated in the same manner as for the mounting surface. The reference point for determining the elongation rate on each surface is the surface of the sealing resin.
In FIG. 2, for each of the second surface, the third surface, the fourth surface, and the first main surface (fifth surface) of the sealing resin, the sealing resin before the distance between the mounting electrodes is extended is shown. each double arrow _{P 2} a distance between the surface, double arrow _{P 3,} the double arrow _{P 4,} and are indicated by double arrow _{P 5.}
Further, in FIG. 3, each of the second surface, the third surface, the fourth surface, and the first main surface (fifth surface) of the sealing resin is sealed after the distance between the mounting electrodes is extended. each double arrow S ₂ the distance between the surface of the sealing _resin, a double arrow S _3, the double arrow S _4, and is shown by a double-headed arrow S _5.

The elongation ratio between the surfaces of the sealing resin on these four surfaces is represented by the following formulas (2), (3), (4) and (5).
Elongation rate [%] between the surfaces of the sealing resin on the second surface
= [(S ₂ / P ₂ ) × 100] -100 equation (2)
Elongation rate [%] between the surfaces of the sealing resin on the third surface
= [(S ₃ / P ₃ ) × 100] -100 formula (3)
Elongation rate [%] between the surfaces of the sealing resin on the fourth surface
= [(S ₄ / P ₄ ) × 100] -100 formula (4)
Elongation rate [%] between the surfaces of the sealing resin on the first main surface (fifth surface) of the sealing resin.
= [(S ₅ / P ₅ ) × 100] -100 formula (5)

If the elongation rates represented by the above equations (2) to (5), which are obtained by extending the distances between the plurality of mounting electrodes on the mounting surface by 3%, are all less than 3%, the mounting surface is stretched. When the distance between the plurality of mounting electrodes is extended by 3%, the elongation ratio between the plurality of mounting electrodes on the mounting surface is between the plurality of mounting electrodes on the other surface parallel to the mounting surface. It can be said that it is larger than any of the elongation rates between the surfaces of the sealing resin measured in the same direction as the extension direction.
That is, it can be said that the sealing resin stretches most on the mounting surface.

Hereinafter, each of the electronic component, the sealing resin, the wiring, and the resin layer used in the stretchable electronic component of the present invention will be described.
The electronic component used in the stretchable electronic component is preferably a chip component.
Examples of chip components include amplifiers (op amps, transistors, etc.), chip capacitors, chip resistors, and the like.
The shape of the electronic component is preferably a rectangular parallelepiped or a substantially rectangular parallelepiped. It is preferable that the rectangular parallelepiped has a shape in which the dimension in one direction is relatively large and the dimension in the other two directions is relatively small. The direction in which the dimensions are large is the longitudinal direction of the electronic component.

Further, at least one electronic component may be provided in the stretchable electronic component. Then, as long as the electronic component and the wiring are connected at a portion other than the mounting surface, two or more electronic components may be provided in the stretchable electronic component.

When the stretchable electronic component is viewed from the first main surface, the electronic component may be arranged so that its longitudinal direction is along the third side surface and the fourth side surface. This will be described with reference to the drawings.
FIG. 4 is a top view schematically showing the stretchable electronic component of the first embodiment when viewed from the first main surface. In FIG. 4, the resin layer located on the first main surface of the sealing resin is omitted.
In the stretchable electronic component 1, the electronic component 10 is oriented in the longitudinal direction (direction indicated by the double-headed arrow X in FIG. 4) along the third side surface 25 and the fourth side surface 26 of the sealing resin (both in FIG. 4). It is arranged in the direction indicated by the arrow L).
With such an arrangement, the stretchable electronic component has a shape obtained by enlarging the shape of the electronic component with the same shape (rectangular parallelepiped).

The sealing resin used in stretchable electronic components is a stretchable resin.
As an index of elasticity, a material having a Young's modulus of less than 100 MPa as a material for the sealing resin is preferable. Further, it is preferable to adjust the elasticity of the sealing resin in accordance with the elasticity of the substrate on which the elastic electronic component is mounted. For example, when the substrate is an elastic wiring board made of a thermoplastic polyurethane sheet having a thickness of 40 μm, the Young's modulus of the sealing resin is preferably 10 MPa or less.
Further, from the viewpoint of maintaining the shape of the stretchable electronic component when the stretchable force is not applied, the Young's modulus of the sealing resin is preferably 1 kPa or more.
Further, the sealing resin is preferably an insulating material because it is preferable to seal the electronic component and to insulate the electronic component from other parts.
Specific examples of such a sealing resin include silicone-based resins, acrylic-based resins, urethane-based resins, and epoxy-based resins.

Further, it is preferable that the sealing resin has R (chamfer) at the corners.
In FIGS. 2 and 3, chamfered portions (reference numerals 27a, 27b, 27c, 27d) in which the ridgeline portion (side of the rectangular parallelepiped) composed of the sealing resin is rounded are shown.
When such chamfering is provided, the effect of preventing the wiring provided in the sealing resin from breaking can be obtained.

The wiring is electrically connected to the electronic component and is drawn out to the mounting surface of the sealing resin.
When the stretchable electronic component expands and contracts, it is preferable that the wiring expands and contracts in accordance with the expansion and contraction of the sealing resin. Therefore, the wiring is preferably an elastic wiring.
As the elastic wiring, a wiring made of a composite material containing metal particles such as silver and copper and an elastomer such as silicone resin can be used. The Young's modulus of the elastic wiring is preferably 1 GPa or less. Such elastic wiring is provided on the side surfaces of the sealing resin (first side surface, second side surface, third side surface, and fourth side surface), and further, the mounting surface of the elastic electronic component (second main surface of the sealing resin). ).
The thickness of the elastic wiring is preferably 1 μm or more and 500 μm or less.

However, among the wiring, it is preferable that the wiring provided on the surface connected to the electronic component (the wiring provided on the first main surface 21 in FIG. 2) does not apply a force of expansion and contraction to the electronic component. Therefore, it is preferable that it does not have elasticity. Therefore, the wiring in this portion may be a wiring having no elasticity or a wiring having a low elasticity (for example, a metal wiring).
The thickness of the non-stretchable wiring is preferably 1 μm or more and 100 μm or less.

The wiring has a mounting electrode at its end on the mounting surface. The mounting electrode may have an electrode shape at the end of the lead-out wiring, or may have an electrode layer made of a material different from that of the lead-out wiring provided on the lead-out wiring.
Since the electrode layer itself does not have to expand and contract when the mounting electrode expands and contracts, a material having low elasticity (metal layer) may be used.

On the surface where the electronic component is connected to the wiring, a resin layer may be provided on the back surface of the connection surface between the electronic component and the wiring. Wiring can be connected to the electronic component by providing the wiring on the resin layer and mounting the electronic component on the wiring.
The thickness of the resin layer is preferably 10 μm or more and 100 μm or less.
The elastic electronic component may not be provided with the resin layer.

The size of the electronic component and the elasticity The size of the electronic component is not particularly limited. For example, the size of the electronic component is 0603 size (long side 0.6 mm, short side 0.3 mm), and the elasticity is set. The size of the electronic component may be 1608 size (long side 1.6 mm, short side 0.8 mm).

The method for manufacturing the stretchable electronic component of the first embodiment is not particularly limited, but the stretchable electronic component can be manufactured by the following method.
Hereinafter, a method for manufacturing a stretchable electronic component will be described as a method for manufacturing a plurality of stretchable electronic components at one time.
First, wiring is provided on the resin sheet to be the resin layer. A pad for mounting an electronic component is formed on the wiring. A large number of wiring patterns are repeatedly formed on the resin sheet according to the number of elastic electronic components to be manufactured and the number of electronic components to be mounted.
Then, the electronic component is mounted on the wiring pad.
A resin material to be a sealing resin is applied so as to cover the mounted electronic components, and the resin material is cured to form a sealing resin layer.
The sealing resin layer and the resin sheet are cut into a rectangular parallelepiped component shape by dicing according to the shape of each elastic electronic component to be manufactured.

As a rectangular parallelepiped shape, a lead-out wiring is formed on a predetermined side surface of the sealing resin. This lead-out wiring is preferably formed by elastic wiring.
The lead-out wiring can be formed by immersing the side surface of the sealing resin in a conductive paste which is a material for the lead-out wiring.
Since the wiring connected to the electronic component is exposed on the side surface of the rectangular parallelepiped by dicing, a lead-out wiring is formed so as to be connected to this wiring.
Further, a mounting electrode is provided so as to be connected to the lead-out wiring.
By such a step, the stretchable electronic component of the first embodiment is obtained.

Although the expression "curing" was used in the above step, this does not mean that the sealing resin is hardened, and the shape of the sealing resin is stabilized to the extent that the elastic sealing resin does not flow. It means to do it.

[Second Embodiment of Elastic Electronic Components]
FIG. 5 is a perspective view schematically showing the stretchable electronic component of the second embodiment.
FIG. 5 is a perspective view of the stretchable electronic component 2 as viewed from the mounting surface side (lower side), and is shown by allowing the sealing resin to pass through in order to show the internal structure of the sealing resin.
FIG. 6 is a top view schematically showing the stretchable electronic component of the second embodiment when viewed from the first main surface.
The stretchable electronic component 2 includes an electronic component 10 and a sealing resin 20 that seals the periphery of the electronic component 10. The shape of the stretchable electronic component 2 is a rectangular parallelepiped or a substantially rectangular parallelepiped shape, which is substantially the same as the shape of the sealing resin 20.
The stretchable electronic component according to the second embodiment is different from the stretchable electronic component according to the first embodiment in the form of wiring and the arrangement position of the electronic component. Since other configurations are the same as those of the stretchable electronic component according to the first embodiment, detailed description thereof will be omitted.

As shown in FIG. 6, in the stretchable electronic component 2, the electronic component 10 is shown by a double-headed arrow X in the longitudinal direction when the stretchable electronic component 2 is viewed from the first main surface 21. The direction) is arranged in a direction inclined from the direction of the third side surface 25 and the direction of the fourth side surface 26 (the direction indicated by the double-headed arrow L in FIG. 6).
Specifically, the shape of the sealing resin viewed from above is substantially square, and the longitudinal direction of the electronic component is arranged along the diagonal direction of this square.
By arranging the electronic components in such an orientation, the size of the entire stretchable electronic component can be reduced.

The wiring 130 includes a first lead-out wiring 131 and a second lead-out wiring 132 in which the wiring 130a connected to the first external electrode 11 of the electronic component 10 is branched into two. Further, the wiring 130 includes a third lead-out wiring 133 and a fourth lead-out wiring 134 in which the wiring 130b connected to the second external electrode 12 of the electronic component is branched into two.

The first lead-out wiring 131 and the second lead-out wiring 132 each reach the second main surface 22 via the first side surface 23 of the sealing resin 20.
The first lead-out wiring 131 has a first mounting electrode 141 at the end adjacent to the first side surface 23 and the third side surface 25.
The second lead-out wiring 132 has a second mounting electrode 142 at the end adjacent to the first side surface 23 and the fourth side surface 26.
The first lead-out wiring 131 may reach the second main surface 22 via the third side surface 25, and the second lead-out wiring 132 may reach the second main surface 22 via the fourth side surface 26.

The third lead-out wiring 133 and the fourth lead-out wiring 134 each reach the second main surface 22 via the second side surface 24 of the sealing resin 20.
The third lead-out wiring 133 has a third mounting electrode 143 at the end adjacent to the second side surface 24 and the third side surface 25.
The fourth lead-out wiring 134 has a fourth mounting electrode 144 at the end adjacent to the second side surface 24 and the fourth side surface 26.
The third lead-out wiring 133 may reach the second main surface 22 via the third side surface 25, and the fourth lead-out wiring 134 may reach the second main surface 22 via the fourth side surface 26.

With a structure in which the lead-out wiring is branched into two, it is possible to handle not only expansion and contraction in one direction but also simultaneous expansion and contraction in two directions. The two directions are the directions indicated by arrows L and W in FIGS. 5 and 6.
When two of the four mounting electrodes are selected and the distance between the mounting electrodes is extended by 3%, the elongation rate between the two mounting electrodes is equal to that of the other surface parallel to the mounting surface. The distance between the two mounting electrodes is greater than any of the elongations between the surfaces of the encapsulating resin measured in the same direction as the extension.
As the two mounting electrodes selected to extend between the mounting electrodes on the mounting surface, two adjacent mounting electrodes may be selected, or two diagonally located mounting electrodes are selected. May be good.

[Third Embodiment of elastic electronic components]
FIG. 7 is a perspective view schematically showing the stretchable electronic component of the third embodiment.
FIG. 7 is a perspective view of the stretchable electronic component 3 as viewed from the mounting surface side (lower side), and is shown by allowing the sealing resin to pass through in order to show the internal structure of the sealing resin.
The stretchable electronic component 3 includes an electronic component 10 and a sealing resin 20 that seals the periphery of the electronic component 10. The shape of the stretchable electronic component 3 is a rectangular parallelepiped or a substantially rectangular parallelepiped shape, which is substantially the same as the shape of the sealing resin 20.
The stretchable electronic component according to the third embodiment is different from the stretchable electronic component according to the first embodiment in the form of wiring and the arrangement position of the electronic component. Since other configurations are the same as those of the stretchable electronic component according to the first embodiment, detailed description thereof will be omitted.

In the stretchable electronic component 3, the electronic component 10 is arranged adjacent to the first side surface 23 in the sealing resin 20, and the electronic component 10 and the wiring are connected by the first side surface 23.
In the stretchable electronic component of the third embodiment, the electronic component 10 may be arranged adjacent to any side surface of the sealing resin 20, and is adjacent to the second side surface 24, the third side surface 25, or the fourth side surface 26. May be arranged. Further, the electronic component 10 and the wiring 130 may be connected by any of the second side surface 24, the third side surface 25, or the fourth side surface 26.

In the stretchable electronic component 1 of the first embodiment, the dimension in the length direction of the stretchable electronic component 1 is a dimension obtained by adding a certain length to the length in the longitudinal direction of the electronic component 10. Then, the dimension in the length direction of the stretchable electronic component 1 becomes larger than the dimension in the width direction and the dimension in the thickness direction.
On the other hand, in the stretchable electronic component 3 of the third embodiment, the longitudinal direction of the electronic component 10 is the direction along the thickness direction of the stretchable electronic component 3. Therefore, the dimension in the thickness direction of the stretchable electronic component 3 becomes larger than the dimension in the width direction and the dimension in the length direction.
Therefore, when the electronic component 10 is arranged adjacent to the side surface of the sealing resin 20, the dimensions in the length direction and the width direction of the stretchable electronic component shown in the arrows L and W directions in FIG. 7 can be reduced. can.
In this way, the area of the mounting surface can be reduced, so that the footprint of the stretchable electronic component on the substrate on which the stretchable electronic component is mounted can be reduced.

In FIG. 7, the form of wiring is shown as a form having four lead-out wirings and four mounting electrodes similar to the form of wiring of the stretchable electronic component of the second embodiment, but the form of wiring is this. The form is not limited to the form, and may be a form having two lead-out wirings and two mounting electrodes as in the elastic electronic component of the first embodiment.

[Fourth Embodiment of Elastic Electronic Components]
FIG. 8 is a perspective view schematically showing the stretchable electronic component of the fourth embodiment.
FIG. 8 is a perspective view of the stretchable electronic component 4 as viewed from the mounting surface side (lower side), and is shown by allowing the sealing resin to pass through in order to show the internal structure of the sealing resin.
The stretchable electronic component 4 includes an electronic component 10 and a sealing resin 220 that seals the periphery of the electronic component 10.
The sealing resin 220 has a bottom surface 222 which is a mounting surface, a curved surface 223 which is a curved surface connected to the bottom surface 222, and an upper surface 221 which is connected to the side surface 223. The shape of the stretchable electronic component 4 is the same as the shape of the sealing resin 220, and has a so-called dome shape or a substantially hemispherical shape.
The stretchable electronic component according to the fourth embodiment is different from the stretchable electronic component according to the first embodiment in the shape of the sealing resin and the form of wiring. Since other configurations are the same as those of the stretchable electronic component according to the first embodiment, detailed description thereof will be omitted.

In the stretchable electronic component 4, the electronic component 10 is arranged adjacent to the upper surface 221 in the sealing resin 220, and the connection between the electronic component 10 and the wiring 230 is made on the upper surface 221. The upper surface 221 of the stretchable electronic component 4 is a flat surface.
In the elastic electronic component of the fourth embodiment, the upper surface to which the electronic component and the wiring are connected is preferably a flat surface, but the upper surface to which the electronic component and the wiring are connected may be a curved surface. When the upper surface is a curved surface, the boundary between the upper surface and the side surface of the sealing resin may be substantially eliminated.

The wiring 230 includes a first lead-out wiring 231 connected to the first external electrode 11 of the electronic component 10. Further, the wiring 230 includes a second lead-out wiring 232 and a third lead-out wiring 233 connected to the second external electrode 12 of the electronic component.

The first lead-out wiring 231 and the second lead-out wiring 232 and the third lead-out wiring 233 each reach the bottom surface 222 via the side surface 223 of the sealing resin 220.
The first lead-out wiring 231 and the second lead-out wiring 232 and the third lead-out wiring 233 have a first mounting electrode 241 and a second mounting electrode 242 and a third mounting electrode 243 at their ends, respectively.
When each lead-out wiring is provided in this way, the angle between the wiring 230 on the upper surface 221 and the connection portion of each lead-out wiring becomes an obtuse angle, and the corner does not hit the connection portion. Breaking at the connection part is less likely to occur.

FIG. 8 shows a form having three lead-out wirings and mounting electrodes, but the form of wiring is not limited to this form, and the number of lead-out wirings and the number of mounting electrodes are particularly limited. It's not something.

[Fifth Embodiment of elastic electronic component]
FIG. 9 is a perspective view schematically showing the stretchable electronic component of the fifth embodiment.
FIG. 9 is a perspective view of the stretchable electronic component 5 as viewed from the electronic component side (upper side), and is shown by allowing the sealing resin to pass through in order to show the internal structure of the sealing resin.

The stretchable electronic component 5 includes an electronic component 10 and a sealing resin 320 that seals the periphery of the electronic component 10.
The sealing resin 320 has a quadrangular pyramid shape and has a first main surface 321 and a second main surface 322 facing in the thickness direction (direction indicated by the double-headed arrow T in FIG. 9). The second main surface 322 is a bottom surface having a large area, and the first main surface 321 is a top surface having a small area. The second main surface 322 serves as a mounting surface for the stretchable electronic component 5.
The stretchable electronic component according to the fifth embodiment is different from the stretchable electronic component according to the first embodiment in the shape of the sealing resin and the form of wiring. Since other configurations are the same as those of the stretchable electronic component according to the first embodiment, detailed description thereof will be omitted.

The area of the first main surface 321 may be smaller than the area of the second main surface 322, and the area of the first main surface 321 may be substantially the same as the area of the electronic component 10 adjacent to the first main surface 321. Further, the area of the first main surface 321 may be larger than the area of the electronic component 10 adjacent to the first main surface 321.

In the elastic electronic component 5 shown in FIG. 9, all the portions corresponding to the upper surface of the quadrangular frustum shape, which is the shape of the sealing resin 320, are the electronic components 10, and the sealing resin is placed on the upper surface of the quadrangular frustum shape. Looks like it doesn't exist. Even in such a case, if the shape of the sealing resin excluding the electronic parts is a quadrangular pyramid shape as a whole, the shape of the sealing resin is considered to be a quadrangular pyramid shape, and the area of the sealing resin is small. It may be considered that the first main surface exists as the upper surface of the quadrangular pyramid.

The electronic component 10 is arranged adjacent to the first main surface 321 in the sealing resin 320, and the electronic component 10 and the wiring 330 are connected to each other on the first main surface 321.
The wiring 330 includes a first lead-out wiring 331 and a second lead-out wiring (not shown) connected to the first external electrode 11 of the electronic component 10. Further, the wiring 330 includes a third lead-out wiring 333 and a fourth lead-out wiring 334 connected to the second external electrode 12 of the electronic component.
At the end of each lead-out wiring, a first mounting electrode 341, a second mounting electrode 342, a third mounting electrode 343, and a fourth mounting electrode 344 are provided, respectively.

The arrangement of the lead-out wiring and the mounting electrodes shown in FIG. 9 is the same as that of the elastic electronic component of the second embodiment.
Further, although FIG. 9 shows an example in which there are four lead-out wirings, the number of lead-out wirings is not limited, and even if the number of lead-out wirings is two as in the elastic electronic component 1 shown in FIG. good.
Further, the lead-out wiring may reach the second main surface via any side surface of the quadrangular pyramid shape.

In the stretchable electronic component of the fifth embodiment, the volume of the stretchable electronic component itself can be reduced. When the distance of the mounting electrodes included in this stretchable electronic component is increased, the area of the second main surface becomes large, but the area of the first main surface is not so large and is arranged adjacent to the first main surface. The force applied between the electronic component and the wiring is small.

[Sixth Embodiment of Elastic Electronic Components]
FIG. 10 is a cross-sectional view schematically showing the stretchable electronic component of the sixth embodiment.
In the stretchable electronic component 6 shown in FIG. 10, the resin layer 451 is provided on the back surface of the connection surface between the electronic component 10 and the wiring 30, that is, on the outside of the first main surface 21 of the sealing resin 20. Further, it is provided on the outside of each side surface of the sealing resin and on the outside of the lead-out wiring.
FIG. 10 shows that the resin layer 451 is provided on the outside of the first side surface 23 and the second side surface 24, on the outside of the first lead-out wiring 31 and on the outside of the second lead-out wiring 32.

The resin layer 451 is integrated from the outside of the first main surface 21 of the sealing resin 20 to the outside of each side surface. This is achieved by forming the resin layer 451 by bending the same resin sheet.

Further, in the wiring 30, there is no boundary between the wiring provided on the first main surface 21 of the sealing resin 20 and the wiring provided on the side surface of the sealing resin (first lead-out wiring 31, second lead-out wiring 32). It is formed continuously. In this case, it is preferable that all the wirings are elastic wirings.

The stretchable electronic component of the sixth embodiment can be manufactured by the following method.
First, elastic wiring is provided on the resin sheet to be the resin layer. Pads for mounting electronic components are formed on the elastic wiring.
Then, the electronic component is mounted on the pad of the elastic wiring.
Next, the resin sheet is bent so that the elastic wiring and the electronic components are inside, and the resin sheet is fitted into a mold having a predetermined shape and heat is applied to maintain the shape of the mold.
Further, a resin material to be a sealing resin is added to the inside of the shape of the mold to cure the resin material.
By such a step, the stretchable electronic component of the sixth embodiment is obtained.
Although the expression "curing" was used in the above step, this does not mean that the sealing resin is hardened, and the shape of the sealing resin is stabilized to the extent that the elastic sealing resin does not flow. It means to do it.

In this step, since the resin layer and the wiring are formed by bending, the wiring provided on the first main surface of the sealing resin and the wiring provided on the side surface of the sealing resin (first drawer wiring, second drawer). There is no boundary with the wiring). Therefore, it is possible to prevent the wiring from breaking at this boundary.
Further, since the entire outer circumference of the wiring is covered with the resin layer, the wiring can be protected from the outside of the stretchable electronic component.

The stretchable electronic component according to the sixth embodiment is different from the stretchable electronic component according to the first embodiment in the formation position of the resin layer and the mode of forming the wiring. Since other configurations are the same as those of the stretchable electronic component according to the first embodiment, detailed description thereof will be omitted.

Next, a stretchable electronic component mounting substrate obtained by mounting the stretchable electronic component of the present invention on the substrate will be described.
The stretchable electronic component mounting substrate of the present invention is characterized by comprising a substrate and the stretchable electronic component of the present invention mounted on the substrate on the mounting surface thereof.

[First Embodiment of Elastic Electronic Component Mounting Board]
FIG. 11 is a cross-sectional view schematically showing the elastic electronic component mounting substrate of the first embodiment.
FIG. 11 schematically shows a state in which the stretchable wiring board 510 is extended with respect to the stretchable electronic component mounting board 500 in which the stretchable electronic component 1 is mounted on the mounting surface 511 of the stretchable wiring board 510.
The stretchable wiring board 510 is made of a stretchable resin material. Examples of the resin material include thermoplastic polyurethane and the like.

The stretchable electronic component mounting substrate of the first embodiment can be used by being attached to a living body.
The thickness of the stretchable wiring board is not particularly limited, but is preferably 100 μm or less, and more preferably 1 μm or less, from the viewpoint of not inhibiting the expansion and contraction of the surface of the living body when attached to the living body. The thickness of the elastic wiring board is preferably 0.1 μm or more.

Wiring is provided on the elastic wiring board. The wiring preferably contains conductive particles and a resin, and is preferably a wiring having elasticity. For example, a mixture of metal powders such as Ag, Cu, and Ni as conductive particles and an elastomeric resin such as a silicone resin can be mentioned.

The joining method between the stretchable wiring board and the stretchable electronic component is not particularly limited, and can be performed by soldering or the like.

Since the stretchable wiring board has elasticity, it can be attached to a living body and stretched for use. When the electronic component mounted on the stretchable wiring board is the stretchable electronic component of the present invention, the mounting surface side of the stretchable electronic component can be expanded and contracted, so that disconnection between the board and the electronic component can be prevented. can.

[Second Embodiment of Elastic Electronic Component Mounting Board]
FIG. 12 is a cross-sectional view schematically showing the elastic electronic component mounting substrate of the second embodiment.
FIG. 12 schematically shows a state in which the flexible substrate 610 is bent with respect to the elastic electronic component mounting substrate 600 in which the elastic electronic component 1 is mounted on the mounting surface 611 of the flexible substrate 610.
The flexible substrate 610 is made of a flexible resin material. Examples of the resin material include polyimide resin and polyester resin.

The stretchable electronic component mounting substrate of the second embodiment can be used as a substrate that is bent and used by a movable portion of an electronic device.
The thickness of the flexible substrate is not particularly limited, but from the viewpoint of flexibility, it is preferably 100 μm or less, and more preferably 50 μm or less. The thickness of the flexible substrate is preferably 10 μm or more.

Wiring is provided on the flexible substrate. The wiring is preferably a flexible wiring, and a wiring formed by etching a copper foil or the like can be used.

The joining method between the flexible substrate and the stretchable electronic component is not particularly limited, and can be performed by soldering or the like.

When the electronic component mounted on the stretchable wiring board is the stretchable electronic component of the present invention, the mounting surface side of the stretchable electronic component can be stretched when the flexible substrate is bent, so that the mounting surface side of the stretchable electronic component can be stretched between the board and the electronic component. It is possible to prevent disconnection.

1, 2, 3, 4, 5, 6 Elastic electronic components 10 Electronic components 11 First external electrode of electronic component 12 Second external electrode of electronic component 20, 220, 320 Encapsulating resin 21, 321 First main surface 22 322 Second main surface (mounting surface)
23 1st side surface 24 2nd side surface 25 3rd side surface 26 4th side surface 27a, 27b, 27c, 27d Chamfered parts 30, 130, 130a, 130b, 230, 330 Wiring 31, 131, 231, 331 1st drawer wiring 32, 132, 232 2nd lead-out wiring 41, 141, 241, 341 1st mount electrode 42, 142, 242, 342 2nd mount electrode 51, 451 Resin layer 133, 233, 333 3rd lead-out wiring 134, 334 4th Lead-out wiring 143, 243, 343 Third mounting electrode 144, 344 Fourth mounting electrode 221 Top surface 222 Bottom surface (mounting surface)
223 Curved side surface 500, 600 Stretchable electronic component mounting board 510 Stretchable wiring board 511 Stretchable wiring board mounting surface 610 Flexible board 611 Flexible board mounting surface

Claims (11)

With electronic components
A sealing resin that seals the periphery of the electronic component and has a mounting surface,
It is provided with wiring that is electrically connected to the electronic component and is drawn out to the mounting surface of the sealing resin.
The sealing resin has elasticity and has elasticity.
The electronic component and the wiring are connected at a portion other than the mounting surface.
The wiring has a plurality of mounting electrodes at the ends thereof on the mounting surface.
When the distance between the plurality of mounting electrodes on the mounting surface is extended by 3%, the elongation rate between the plurality of mounting electrodes on the mounting surface is increased on the other surface parallel to the mounting surface. An elastic electronic component characterized in that it is larger than any of the elongation rates between the surfaces of the sealing resin, which is measured in the same direction as the extension direction of the distance between the plurality of mounting electrodes. The sealing resin has a first main surface and a second main surface facing in the thickness direction, a first side surface and a second side surface facing in the length direction orthogonal to the thickness direction, and the thickness direction and the length. It has a third side surface and a fourth side surface that are orthogonal to each other in the width direction and face each other in the width direction.
The second main surface is the mounting surface.
The first aspect of claim 1, wherein the electronic component is arranged adjacent to the first main surface in the sealing resin, and the connection between the electronic component and the wiring is made on the first main surface. Elastic electronic components. When the stretchable electronic component is viewed from the first main surface, the electronic component is arranged so that its longitudinal direction is along the third side surface and the fourth side surface.
The wiring includes a first lead-out wiring that reaches the second main surface from the first main surface via the first side surface, and a second wiring that reaches the second main surface from the first main surface via the second side surface. Equipped with lead-out wiring,
The first lead-out wiring has a first mounting electrode at the end thereof on the second main surface.
The stretchable electronic component according to claim 2, wherein the second lead-out wiring has a second mounting electrode at the end thereof on the second main surface. When the stretchable electronic component is viewed from the first main surface, the electronic component is arranged so that its longitudinal direction is inclined from the direction of the third side surface and the direction of the fourth side surface.
The wiring includes a first lead-out wiring and a second lead-out wiring that are branched into two from the first main surface and each reach the second main surface on the first side surface side via the side surface of the sealing resin. It is provided with a third lead-out wiring and a fourth lead-out wiring which are branched into two from the first main surface and each reach the second main surface on the second side surface side via the side surface of the sealing resin.
The first lead-out wiring has a first mounting electrode at an end adjacent to the first side surface and the third side surface.
The second lead-out wiring has a second mounting electrode at an end adjacent to the first side surface and the fourth side surface.
The third lead-out wiring has a third mounting electrode at the end adjacent to the second side surface and the third side surface.
The stretchable electronic component according to claim 2, wherein the fourth lead-out wiring has a fourth mounting electrode at the end adjacent to the second side surface and the fourth side surface. The sealing resin has a first main surface and a second main surface facing in the thickness direction, a first side surface and a second side surface facing in the length direction orthogonal to the thickness direction, and the thickness direction and the length. It has a third side surface and a fourth side surface that are orthogonal to each other in the width direction and face each other in the width direction.
The second main surface is the mounting surface.
The electronic component is arranged adjacent to the first side surface, the second side surface, the third side surface, or the fourth side surface in the sealing resin, and the connection between the electronic component and the wiring is described. The stretchable electronic component according to claim 1, wherein the first side surface, the second side surface, the third side surface, or the fourth side surface is used. The sealing resin has a bottom surface which is a mounting surface, a side surface which is a curved surface connected to the bottom surface, and an upper surface connected to the side surface.
The stretchable electronic component according to claim 1, wherein the electronic component is arranged adjacent to the upper surface in the sealing resin, and the connection between the electronic component and the wiring is made on the upper surface. The sealing resin has a first main surface and a second main surface facing each other in the thickness direction, and the second main surface is a bottom surface having a large area, and the first main surface is an upper surface having a small area. It's a shape
The second main surface is the mounting surface.
The first aspect of claim 1, wherein the electronic component is arranged adjacent to the first main surface in the sealing resin, and the connection between the electronic component and the wiring is made on the first main surface. Elastic electronic components. The stretchable electronic component according to any one of claims 1 to 7, wherein a resin layer is provided on the back surface of the connection surface between the electronic component and the wiring on the surface where the electronic component is connected to the wiring. With the board
A stretchable electronic component mounting substrate comprising the stretchable electronic component according to any one of claims 1 to 8 mounted on the board on the mounting surface. The stretchable electronic component mounting board according to claim 9, wherein the board is a stretchable wiring board. The elastic electronic component mounting substrate according to claim 9, wherein the substrate is a flexible substrate.

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