JP7443875B2 - Stretchable electronic components and stretchable electronic component mounting boards - Google Patents

Description

The present invention relates to a stretchable electronic component and a stretchable electronic component mounting board.

In recent years, the state of the human body, etc. has been managed by acquiring and analyzing biological information.
2. Description of the Related Art A stretchable wiring board that is used by being attached to a living body is known as a board for acquiring biological information.
Electronic components that function to acquire biological information are mounted on the stretchable wiring board.

Patent Document 1 describes a stretchable wiring board (stretchable circuit board) on which electronic components are mounted. The stretchable wiring board disclosed in Patent Document 1 is formed such that the connection portion that electrically connects the electronic component and the stretchable wiring has stretchability and the Young's modulus thereof is greater than or equal to the stretchable wiring. There is.

Japanese Patent Application Publication No. 2016-143763

In FIG. 2 of Patent Document 1, the lower surface of the electronic component is the mounting surface, and the connection terminal of the electronic component is connected to the connection portion on the mounting surface.
When such a stretchable wiring board is stretched in the lateral direction, a large force is applied to the boundary between the connection terminal and the connection portion on the bottom surface of the electronic component. In Patent Document 1, it is considered that a connecting portion is provided to prevent wire breakage due to this force.

However, with the configuration of Patent Document 1, disconnection cannot be completely prevented.
Even in the stretchable wiring board, since the electronic components themselves are made of a hard material, the electronic components themselves cannot expand and contract in accordance with the expansion and contraction of the stretchable wiring. Therefore, if the configuration is such that force is applied to the portion where the electronic component is mounted on the board or the like, it is difficult to fundamentally prevent wire breakage.

The present invention has been made to solve the above problems, and provides an electronic component that prevents disconnection between the board and the electronic component when the stretchable wiring board is expanded and contracted when mounted on a stretchable wiring board. The purpose is to provide

The stretchable electronic component of the present invention includes an electronic component, a sealing resin that seals the periphery of the electronic component and has a mounting surface, and a stretchable electronic component that is electrically connected to the electronic component and that includes a sealing resin that seals the periphery of the electronic component. The wiring is drawn out to the mounting surface, the sealing resin has elasticity, the electronic component and the wiring are connected at a part other than the mounting surface, and the wiring has a plurality of mounting electrodes at the ends of the mounting surface, and when the distance between the plurality of mounting electrodes on the mounting surface is increased by 3%, the number of mounting electrodes on the mounting surface increases. The elongation rate between the surfaces of the sealing resin is measured in the same direction as the distance between the plurality of mounting electrodes on another plane parallel to the mounting surface. It is characterized by a higher elongation rate than any other.

The stretchable electronic component mounting board of the present invention is characterized by comprising a substrate and the stretchable electronic component of the present invention mounted on the substrate on its mounting surface.

According to the present invention, it is possible to provide an electronic component that prevents disconnection between the board and the electronic component when it is mounted on a stretchable wiring board and the stretchable wiring board is expanded and contracted.

FIG. 1 is a perspective view schematically showing a stretchable electronic component according to a first embodiment. FIG. 2 is a cross-sectional view schematically showing a stretchable electronic component cut along a cross section parallel to the thickness direction and the length direction. FIG. 3 is a cross-sectional view schematically showing a stretchable electronic component cut along a cross section parallel to the thickness direction and the length direction. FIG. 4 is a top view schematically showing the stretchable electronic component of the first embodiment viewed from the first main surface. FIG. 5 is a perspective view schematically showing the stretchable electronic component of the second embodiment. FIG. 6 is a top view schematically showing the stretchable electronic component of the second embodiment viewed from the first main surface. FIG. 7 is a perspective view schematically showing the stretchable electronic component of the third embodiment. FIG. 8 is a perspective view schematically showing the stretchable electronic component of the fourth embodiment. FIG. 9 is a perspective view schematically showing the stretchable electronic component of the fifth embodiment. FIG. 10 is a cross-sectional view schematically showing the stretchable electronic component of the sixth embodiment. FIG. 11 is a cross-sectional view schematically showing the stretchable electronic component mounting board of the first embodiment. FIG. 12 is a cross-sectional view schematically showing a stretchable electronic component mounting board according to the second embodiment.

Hereinafter, a stretchable electronic component and a stretchable electronic component mounting board of the present invention will be explained.
However, the present invention is not limited to the following configuration, and can be modified and applied as appropriate without changing the gist of the present invention. Note that the present invention also includes a combination of two or more of the individual preferred configurations of the present invention described below.

It goes without saying that each of the embodiments shown below is an example, and that the configurations shown in different embodiments can be partially replaced or combined. In the second embodiment and subsequent embodiments, descriptions of matters common to the first embodiment will be omitted, and only different points will be described. In particular, similar effects due to similar configurations will not be mentioned for each embodiment.
In the following description, unless the embodiments are particularly distinguished, they will simply be referred to as "the stretchable electronic component of the present invention" or "the stretchable electronic component mounting board of the present invention."

[First embodiment of stretchable electronic component]
FIG. 1 is a perspective view schematically showing a stretchable electronic component according to a first embodiment.
FIG. 1 is a perspective view of a stretchable electronic component 1 viewed from the mounting surface side (lower side), and the sealing resin is shown transparent to show the internal structure of the sealing resin.
The stretchable electronic component 1 includes an electronic component 10 and a sealing resin 20 that seals the periphery of the electronic component 10. The shape of the stretchable electronic component 1 is a rectangular parallelepiped or a substantially rectangular parallelepiped, and is substantially the same as the shape of the sealing resin 20.
The sealing resin 20 is a stretchable resin and has a first main surface 21 and a second main surface 22 that face each other in the thickness direction (direction of arrow T in FIG. 1). The second main surface 22 becomes a mounting surface on which stretchable electronic components are mounted.
In addition, the sealing resin 20 has a first side surface 23 and a second side surface 24 facing each other in a length direction (direction of arrow L in FIG. 1) perpendicular to the thickness direction, and a first side surface 23 and a second side surface 24 that are perpendicular to the thickness direction and the length direction. It has a third side surface 25 and a fourth side surface 26 that face each other in the width direction (arrow W direction in FIG. 1).

In the stretchable electronic component of the present invention, the electronic component and the wiring are connected at a location other than the mounting surface.
In the stretchable electronic component 1, the electronic component 10 is disposed within the sealing resin 20 adjacent to the first main surface 21 of the sealing resin 20, and the connection between the electronic component 10 and the wiring 30 is made through the first main surface 21 of the sealing resin 20. It is done on surface 21.

The wiring 30 is electrically connected to the electronic component 10. The wiring 30 includes a first lead wiring 31 and a second lead wiring 32. The wiring 30 has a plurality of mounting electrodes at its end on the second main surface 22 of the sealing resin 20, which is the mounting surface.
The first lead wiring 31 is connected to the first external electrode 11 of the electronic component 10 on the first main surface 21 of the sealing resin 20 . Then, it reaches the second main surface 22 from the first main surface 21 via the first side surface 23. The end of the first lead-out wiring 31 on the second main surface 22 has a first mounting electrode 41 .
The second lead wiring 32 is connected to the second external electrode 12 of the electronic component 10 on the first main surface 21 of the sealing resin 20 . Then, it reaches the second main surface 22 from the first main surface 21 via the second side surface 24. The end of the second lead-out wiring 32 on the second main surface 22 has a second mounting electrode 42 .

A resin layer 51 is provided on the back side of the connection surface between the electronic component 10 and the wiring 30 of the sealing resin 20, that is, on the outside of the first main surface 21.

In the stretchable electronic component of the present invention having such a configuration, when the distance between the plurality of mounting electrodes on the mounting surface is increased by 3%, the elongation rate between the plurality of mounting electrodes on the mounting surface is The characteristic is that the elongation rate is greater than any of the elongation rates between the surfaces of the sealing resin measured in the same direction as the direction in which the distance between the plurality of mounting electrodes is increased on another plane parallel to the mounting surface. has. This will be explained with reference to the drawings.

2 and 3 are cross-sectional views schematically showing a stretchable electronic component cut along a cross section parallel to the thickness direction and the length direction. FIG. 2 shows a reference state before the distance between the mounting electrodes is increased, and FIG. 3 shows a state in which the distance between the mounting electrodes is increased.

In the stretchable electronic component 1, the sealing resin 20 has stretchability. Therefore, as shown in FIG. 3, the first mounting electrode 41 and the second mounting electrode 42 are arranged so that the distance between the first mounting electrode 41 and the second mounting electrode 42 (that is, the distance between the mounting electrodes) is increased. When force is applied to the electrode 42, the sealing resin 20 stretches and the shape of the stretchable electronic component 1 changes. When a force is applied to increase the distance between the mounting electrodes, the sealing resin 20 stretches the most on the mounting surface (second principal surface 22), and extends upward in the thickness direction (toward the first principal surface 21). The amount of elongation of the sealing resin 20 decreases as it goes in the direction of the arrow T). Therefore, the cross-sectional shape of the stretchable electronic component 1, which originally had a substantially rectangular cross-sectional shape, becomes a substantially trapezoidal shape in which the long side is the mounting surface side to which the stretching force is applied.

In the stretchable electronic component of the present invention, the electronic component and wiring are connected at a location other than the mounting surface. Since the sealing resin stretches the most on the mounting surface, wherever electronic components and wiring are connected, the stretch is smaller than on the mounting surface.
That is, the force applied between the electronic component and the wiring at the location where the electronic component and the wiring are connected is smaller than when the electronic component and the wiring are connected at the mounting surface.
Therefore, when a stretchable electronic component is mounted on a stretchable wiring board and the stretchable wiring board is expanded/contracted (stretched), breakage at a portion where the electronic component and the wiring are connected is prevented.
Furthermore, even if the mounting electrode extends significantly, there is no hard electronic component on the mounting surface, so even if the mounting electrode extends on the mounting surface, disconnection with the mounting portion is prevented.

It is determined as follows whether the sealing resin stretches the most on the mounting surface.
The stretchable electronic component 1 is mounted on the stretchable wiring board at the positions of the first mounting electrode 41 and the second mounting electrode 42, with the first mounting electrode 41 on the left and the second mounting electrode 42 on the right. A state in which force is applied in the direction of extension is considered to be a state in which the distance between the mounting electrodes is extended.
The distance between the first mounting electrode 41 and the second mounting electrode 42 before increasing the distance between the mounting electrodes is the distance shown by the double-headed arrow _P1 in FIG. This distance is between the left end of the first mounting electrode 41 (the end farthest from the second mounting electrode 42) and the right end of the second mounting electrode 42 (the first end) before increasing the distance between the mounting electrodes. (the end on the far side from the mounting electrode 41).
After increasing the distance between the mounting electrodes, the distance between the first mounting electrode 41 and the second mounting electrode 42 is the distance shown by the double arrow _S1 in FIG. 3. This distance is between the left end of the first mounting electrode 41 (the end farthest from the second mounting electrode 42) and the right end (the end farthest from the second mounting electrode 42) of the second mounting electrode 42 after increasing the distance between the mounting electrodes. 1) is defined as the distance from the farthest end of the mounting electrode 41).
Increasing the distance between the plurality of mounting electrodes on the mounting surface by 3% means that the distance shown by the double-headed arrow _S1 in FIG. 3 is 3% longer than the distance shown by the double-headed arrow _P1 in FIG. This means increasing the distance between the electrodes.
In this case, the elongation rate between the plurality of mounting electrodes on the mounting surface is expressed by the following formula (1) and is 3%.
Elongation rate between multiple mounting electrodes on the mounting surface [%]
= [(S ₁ /P ₁ )×100]-100 Formula (1)

The elongation rate [%] between the plurality of mounting electrodes on the mounting surface determined as described above is compared with the elongation rate on another surface parallel to the mounting surface.
Also in the other plane parallel to the mounting surface, the direction in which the stretchable electronic component is extended is the same as the direction in which the distance between the plurality of mounting electrodes is extended.
As the other surfaces parallel to the mounting surface, the other four surfaces obtained by dividing the stretchable electronic component in the thickness direction are used. 2 and 3 show the positions of the other four surfaces.
The other four surfaces are the first principal surface (fifth surface) of the sealing resin, the surface (third surface) intermediate in the thickness direction between the first principal surface and the second principal surface of the sealing resin, and the sealing resin. A surface (fourth surface) intermediate in the thickness direction between the first main surface of the sealing resin and the third surface, and a second main surface (first surface, mounting surface) of the sealing resin and the third surface. This is the intermediate surface (second surface) in the thickness direction.

For these four surfaces, the elongation rate is determined in the same way as for the mounting surface. The reference point for determining the elongation rate on each surface is the surface of the sealing resin.
Figure 2 shows the sealing resin before increasing the distance between the mounting electrodes for each of the second surface, third surface, fourth surface, and first principal surface (fifth surface) of the sealing resin. The distances between the surfaces are indicated by double arrow P ₂ , double arrow P ₃ , double arrow P ₄ and double arrow P ₅ respectively.
FIG. 3 also shows the sealing after increasing the distance between the mounting electrodes for each of the second surface, third surface, fourth surface, and first principal surface (fifth surface) of the sealing resin. The distances between the surfaces of the stopper resin are indicated by a double arrow S ₂ , a double arrow S ₃ , a double arrow S ₄ , and a double arrow S ₅ , respectively.

The elongation rates between the surfaces of the sealing resin on these four surfaces are expressed by the following formulas (2), (3), (4), and (5).
Elongation rate between the surfaces of the sealing resin on the second side [%]
= [(S ₂ /P ₂ )×100]-100 Formula (2)
Elongation rate between the surfaces of the sealing resin on the third side [%]
= [(S ₃ /P ₃ )×100]-100 Formula (3)
Elongation rate between the surfaces of the sealing resin on the fourth side [%]
= [(S ₄ /P ₄ )×100]-100 Formula (4)
Elongation rate between the surfaces of the sealing resin on the first main surface (fifth surface) of the sealing resin [%]
= [(S ₅ /P ₅ )×100]-100 Formula (5)

If the elongation rate expressed by the above formulas (2) to (5) is less than 3% when the distance between the multiple mounting electrodes on the mounting surface is increased by 3%, then the distance between the multiple mounting electrodes on the mounting surface is When the distance between the multiple mounting electrodes is increased by 3%, the elongation rate between the multiple mounting electrodes on the mounting surface is the same as the elongation rate between the multiple mounting electrodes on the other plane parallel to the mounting surface. This can be said to be greater than any of the elongation rates between the surfaces of the sealing resin measured in the same direction as the direction in which the distance was increased.
In other words, it can be said that the sealing resin stretches the most on the mounting surface.

Below, each of the electronic component, sealing resin, wiring, and resin layer used in the stretchable electronic component of the present invention will be explained.
Preferably, the electronic components used within the stretchable electronic component are chip components.
Examples of chip components include amplifiers (operational amplifiers, transistors, etc.), chip capacitors, chip resistors, and the like.
The shape of the electronic component is preferably a rectangular parallelepiped or a substantially rectangular parallelepiped. It is preferable that the rectangular parallelepiped has a shape that is relatively large in one direction and relatively small in dimensions in the other two directions. The direction in which the dimension is larger is the longitudinal direction of the electronic component.

Further, at least one electronic component may be provided in the stretchable electronic component. Two or more electronic components may be provided in the stretchable electronic component as long as the connection between the electronic component and the wiring is made at a site other than the mounting surface.

The electronic component may be arranged such that its longitudinal direction is along the third side surface and the fourth side surface when the stretchable electronic component is viewed from the first main surface. This will be explained with reference to the drawings.
FIG. 4 is a top view schematically showing the stretchable electronic component of the first embodiment when viewed from the first main surface. In FIG. 4, the resin layer located on the first main surface of the sealing resin is omitted.
In the stretchable electronic component 1, the electronic component 10 has its longitudinal direction (the direction indicated by the double-headed arrow (direction shown by arrow L).
With such an arrangement, the stretchable electronic component has a shape that is the same shape (cuboid) as the electronic component expanded.

The sealing resin used in stretchable electronic components is a stretchable resin.
As an index of elasticity, it is preferable that the material of the sealing resin has a Young's modulus of less than 100 MPa. Further, it is preferable to adjust the elasticity of the sealing resin in accordance with the elasticity of the substrate on which the elastic electronic component is mounted. For example, when the substrate is a stretchable wiring board made of a thermoplastic polyurethane sheet with a thickness of 40 μm, it is preferable that the Young's modulus of the sealing resin is 10 MPa or less.
Further, from the viewpoint of maintaining the shape of the stretchable electronic component when no stretching force is applied, it is preferable that the Young's modulus of the sealing resin is 1 kPa or more.
Further, since it is preferable that the sealing resin seals the electronic component and insulates the electronic component from other parts, it is preferably an insulating material.
Specific examples of such sealing resins include silicone resins, acrylic resins, urethane resins, and epoxy resins.

Further, it is preferable that the corners of the sealing resin are rounded (chamfered).
2 and 3 show four chamfered portions (reference numerals 27a, 27b, 27c, and 27d) in which the ridgeline portions (sides of the rectangular parallelepiped) of the rectangular parallelepiped made of sealing resin are rounded.
When such a chamfer is provided, the effect of preventing the wiring provided in the sealing resin from breaking can be obtained.

The wiring is electrically connected to the electronic component and drawn out to the mounting surface of the sealing resin.
When the stretchable electronic component expands and contracts, it is preferable that the wiring also expands and contracts in accordance with the expansion and contraction of the sealing resin, so the wiring is preferably a stretchable wiring.
As the stretchable wiring, wiring made of a composite material containing metal particles such as silver or copper and elastomer such as silicone resin can be used. It is preferable that the elastic wiring has a Young's modulus of 1 GPa or less. Such stretchable wiring is provided on the side surfaces of the sealing resin (first side, second side, third side, and fourth side), and is further provided on the mounting surface of the stretchable electronic component (the second main surface of the sealing resin). ) is preferably provided.
The thickness of the stretchable wiring is preferably 1 μm or more and 500 μm or less.

However, among the wiring, it is preferable that the wiring provided on the surface to be connected to the electronic components (the wiring provided on the first main surface 21 in FIG. 2) be prevented from applying expansion/contraction force to the electronic components. Therefore, it is preferable that the material has no elasticity. Therefore, the wiring in this portion may be a non-stretchable wiring or a low-stretchable wiring (for example, a metal wiring).
The thickness of the non-stretchable wiring is preferably 1 μm or more and 100 μm or less.

The wiring has a mounting electrode at its end on the mounting surface. The mounting electrode may be one in which the end of the lead wire is shaped like an electrode, or may be one in which an electrode layer made of a material different from that of the lead wire is provided on the lead wire.
Since the electrode layer itself does not need to expand and contract when the mounting electrode expands and contracts, it may be made of a material (metal layer) with low elasticity.

On the surface where the electronic component is connected to the wiring, a resin layer may be provided on the back side of the connection surface between the electronic component and the wiring. By providing wiring in the resin layer and mounting the electronic component on the wiring, the wiring and the electronic component can be connected.
The thickness of the resin layer is preferably 10 μm or more and 100 μm or less.
Note that the stretchable electronic component does not need to be provided with a resin layer.

The size of the electronic component and the size of the stretchable electronic component are not particularly limited, but for example, if the size of the electronic component is 0603 size (long side 0.6 mm, short side 0.3 mm), the stretchable The size of the electronic component may be 1608 size (long side 1.6 mm, short side 0.8 mm).

Although the method for manufacturing the stretchable electronic component of the first embodiment is not particularly limited, it can be manufactured by the following method.
Below, a method for manufacturing a stretchable electronic component will be described as a method for manufacturing a plurality of stretchable electronic components at once.
First, wiring is provided on a resin sheet that will become a resin layer. Pads for mounting electronic components are formed on the wiring. A large number of wiring patterns are repeatedly formed on the resin sheet in accordance with the number of stretchable electronic components to be manufactured and the number of electronic components to be mounted.
Then, electronic components are mounted on the wiring pads.
A resin material serving as a sealing resin is applied to cover the mounted electronic components, and the resin material is cured to form a sealing resin layer.
The sealing resin layer and resin sheet are diced into rectangular parallelepiped component shapes according to the shape of each stretchable electronic component to be manufactured.

The lead wiring is formed in a rectangular parallelepiped shape on a predetermined side surface of the sealing resin. This lead-out wiring is preferably formed of a stretchable wiring.
The lead wiring can be formed by dipping the side surface of the sealing resin in a conductive paste that is a material for the lead wiring.
Since the wiring connected to the electronic component is exposed on the side surface of the rectangular parallelepiped by dicing, a lead wiring is formed to be connected to this wiring.
Further, a mounting electrode is provided to be connected to the lead wiring.
Through such steps, the stretchable electronic component of the first embodiment is obtained.

Note that although the expression "cure" is used in the above process, this does not mean that the sealing resin is made hard, but rather that the shape of the elastic sealing resin is stabilized to the extent that it does not flow. It means to do as you please.

[Second embodiment of stretchable electronic component]
FIG. 5 is a perspective view schematically showing the stretchable electronic component of the second embodiment.
FIG. 5 is a perspective view of the stretchable electronic component 2 viewed from the mounting surface side (lower side), and the sealing resin is shown transparent to show the internal structure of the sealing resin.
FIG. 6 is a top view schematically showing the stretchable electronic component of the second embodiment viewed from the first main surface.
The stretchable electronic component 2 includes an electronic component 10 and a sealing resin 20 that seals around the electronic component 10. The shape of the stretchable electronic component 2 is a rectangular parallelepiped or a substantially rectangular parallelepiped, and is substantially the same as the shape of the sealing resin 20.
The stretchable electronic component according to the second embodiment is different from the stretchable electronic component according to the first embodiment in the form of wiring and the arrangement position of the electronic component. The other configurations are the same as those of the stretchable electronic component according to the first embodiment, so a detailed explanation thereof will be omitted.

As shown in FIG. 6, in the stretchable electronic component 2, the electronic component 10 is arranged in the longitudinal direction (indicated by double arrow X in FIG. direction) is inclined from the direction of the third side surface 25 and the direction of the fourth side surface 26 (the direction indicated by the double-headed arrow L in FIG. 6).
Specifically, the shape of the sealing resin when viewed from above is approximately square, and the longitudinal direction of the electronic component is arranged along the diagonal of this square.
By arranging the electronic component in such an orientation, the size of the entire stretchable electronic component can be reduced.

The wiring 130 includes a first lead wiring 131 and a second lead wiring 132, which are formed by branching a wiring 130a connected to the first external electrode 11 of the electronic component 10 into two. Further, the wiring 130 includes a third lead wiring 133 and a fourth lead wiring 134, which are formed by branching the wiring 130b connected to the second external electrode 12 of the electronic component into two.

The first lead-out wiring 131 and the second lead-out wiring 132 each reach the second main surface 22 through the first side surface 23 of the sealing resin 20.
The first lead-out wiring 131 has a first mounting electrode 141 at an end adjacent to the first side surface 23 and the third side surface 25.
The second lead-out wiring 132 has a second mounting electrode 142 at an end adjacent to the first side surface 23 and the fourth side surface 26 .
Note that the first lead wiring 131 may reach the second main surface 22 through the third side surface 25, and the second lead wire 132 may reach the second main surface 22 through the fourth side surface 26.

The third lead-out wiring 133 and the fourth lead-out wiring 134 each reach the second main surface 22 through the second side surface 24 of the sealing resin 20.
The third lead-out wiring 133 has a third mounting electrode 143 at an end adjacent to the second side surface 24 and the third side surface 25.
The fourth lead wiring 134 has a fourth mounting electrode 144 at an end adjacent to the second side surface 24 and the fourth side surface 26.
Note that the third lead wire 133 may reach the second main surface 22 through the third side surface 25, and the fourth lead wire 134 may reach the second main surface 22 through the fourth side surface 26.

With a structure in which the lead wiring is branched into two, it is possible to handle not only expansion and contraction in one direction but also simultaneous expansion and contraction in two directions. The two directions are the directions shown by arrows L and W in FIGS. 5 and 6.
When two of the four mounting electrodes are selected and the distance between them is increased by 3%, the elongation rate between the two mounting electrodes is, on the other plane parallel to the mounting surface, This is larger than any of the elongation rates between the surfaces of the sealing resin measured in the same direction as the direction in which the distance between the two mounting electrodes is increased.
As the two mounting electrodes selected to extend the distance between the mounting electrodes on the mounting surface, two adjacent mounting electrodes may be selected, or two mounting electrodes located on a diagonal line may be selected. Good too.

[Third embodiment of stretchable electronic component]
FIG. 7 is a perspective view schematically showing the stretchable electronic component of the third embodiment.
FIG. 7 is a perspective view of the stretchable electronic component 3 viewed from the mounting surface side (lower side), and the sealing resin is shown transparent to show the internal structure of the sealing resin.
The stretchable electronic component 3 includes an electronic component 10 and a sealing resin 20 that seals around the electronic component 10 . The shape of the stretchable electronic component 3 is a rectangular parallelepiped or a substantially rectangular parallelepiped, and is substantially the same as the shape of the sealing resin 20.
The stretchable electronic component according to the third embodiment differs from the stretchable electronic component according to the first embodiment in the form of wiring and the arrangement position of the electronic component. The other configurations are the same as those of the stretchable electronic component according to the first embodiment, so a detailed explanation thereof will be omitted.

In the stretchable electronic component 3, the electronic component 10 is placed adjacent to the first side surface 23 within the sealing resin 20, and the electronic component 10 and wiring are connected at the first side surface 23.
In the stretchable electronic component of the third embodiment, the electronic component 10 only needs to be placed adjacent to any side surface of the sealing resin 20, and adjacent to the second side surface 24, the third side surface 25, or the fourth side surface 26. It may be arranged as follows. Moreover, the connection between the electronic component 10 and the wiring 130 may be made on either the second side surface 24, the third side surface 25, or the fourth side surface 26.

In the stretchable electronic component 1 of the first embodiment, the lengthwise dimension of the stretchable electronic component 1 is equal to the length of the electronic component 10 plus a certain length. Then, the lengthwise dimension of the stretchable electronic component 1 becomes larger than the widthwise dimension and the thicknesswise dimension.
On the other hand, in the stretchable electronic component 3 of the third embodiment, the longitudinal direction of the electronic component 10 is along the thickness direction of the stretchable electronic component 3. Therefore, the dimension in the thickness direction of the stretchable electronic component 3 becomes larger than the dimension in the width direction and the dimension in the length direction.
Therefore, when the electronic component 10 is placed adjacent to the side surface of the sealing resin 20, it is possible to reduce the length and width dimensions of the stretchable electronic component shown in the directions of arrows L and W in FIG. can.
In this way, the area of the mounting surface can be reduced, so that the footprint of the stretchable electronic component on the board on which the stretchable electronic component is mounted can be reduced.

In FIG. 7, the wiring form is similar to the wiring form of the stretchable electronic component in the second embodiment, and is shown as having four lead-out wiring lines and four mounting electrodes. The form is not limited to this, and may be a form having two lead wires and two mounting electrodes like the stretchable electronic component of the first embodiment.

[Fourth embodiment of stretchable electronic component]
FIG. 8 is a perspective view schematically showing the stretchable electronic component of the fourth embodiment.
FIG. 8 is a perspective view of the stretchable electronic component 4 viewed from the mounting surface side (lower side), and the sealing resin is shown transparent to show the internal structure of the sealing resin.
The stretchable electronic component 4 includes an electronic component 10 and a sealing resin 220 that seals around the electronic component 10.
The sealing resin 220 has a bottom surface 222 that is a mounting surface, a side surface 223 that is a curved surface connected to the bottom surface 222, and a top surface 221 that is connected to the side surface 223. The shape of the stretchable electronic component 4 is the same as the shape of the sealing resin 220, and is a so-called dome-shaped or substantially hemispherical shape.
The stretchable electronic component according to the fourth embodiment is different from the stretchable electronic component according to the first embodiment in the shape of the sealing resin and the form of the wiring. The other configurations are the same as those of the stretchable electronic component according to the first embodiment, so a detailed explanation thereof will be omitted.

In the stretchable electronic component 4, the electronic component 10 is placed adjacent to the top surface 221 within the sealing resin 220, and the connection between the electronic component 10 and the wiring 230 is made on the top surface 221. The upper surface 221 of the stretchable electronic component 4 is a flat surface.
In the stretchable electronic component of the fourth embodiment, the upper surface to which the electronic component and the wiring are connected is preferably a flat surface, but the upper surface to which the electronic component and the wiring are connected may be a curved surface. When the upper surface is a curved surface, there may be substantially no boundary between the upper surface and the side surface of the sealing resin.

The wiring 230 includes a first lead wiring 231 connected to the first external electrode 11 of the electronic component 10 . Further, the wiring 230 includes a second lead wiring 232 and a third lead wiring 233 connected to the second external electrode 12 of the electronic component.

The first lead wire 231, the second lead wire 232, and the third lead wire 233 each reach the bottom surface 222 through the side surface 223 of the sealing resin 220.
The first lead-out wiring 231, the second lead-out wiring 232, and the third lead-out wiring 233 each have a first mounting electrode 241, a second mounting electrode 242, and a third mounting electrode 243 at their ends.
When each lead wire is provided in this way, the angle between the connection part of the wire 230 on the top surface 221 and each lead wire is an obtuse angle, and the corner does not touch the connection part, so that when the lead wire expands or contracts, rupture at the connection part is less likely to occur.

Although FIG. 8 shows a form with three lead-out wirings and mounting electrodes, the form of the wiring is not limited to this form, and the number of lead-out wirings and the number of mounting electrodes are not particularly limited. It's not something you can do.

[Fifth embodiment of stretchable electronic component]
FIG. 9 is a perspective view schematically showing the stretchable electronic component of the fifth embodiment.
FIG. 9 is a perspective view of the stretchable electronic component 5 viewed from the electronic component side (upper side), and the sealing resin is shown transparent to show the internal structure of the sealing resin.

The stretchable electronic component 5 includes an electronic component 10 and a sealing resin 320 that seals the periphery of the electronic component 10.
The sealing resin 320 has a truncated quadrangular pyramid shape, and has a first main surface 321 and a second main surface 322 that face each other in the thickness direction (the direction indicated by the double-headed arrow T in FIG. 9). The second main surface 322 is a bottom surface with a large area, and the first main surface 321 is a top surface with a small area. The second main surface 322 becomes a mounting surface for the stretchable electronic component 5.
The stretchable electronic component according to the fifth embodiment is different from the stretchable electronic component according to the first embodiment in the shape of the sealing resin and the form of the wiring. The other configurations are the same as those of the stretchable electronic component according to the first embodiment, so a detailed explanation thereof will be omitted.

The area of the first main surface 321 may be smaller than the area of the second main surface 322, and the area of the first main surface 321 may be approximately the same as the area of the electronic component 10 adjacent to the first main surface 321. Further, the area of the first main surface 321 may be larger than the area of the electronic component 10 adjacent to the first main surface 321.

In the stretchable electronic component 5 shown in FIG. 9, the entire portion corresponding to the upper surface of the truncated quadrangular pyramid shape, which is the shape of the sealing resin 320, is the electronic component 10; Looks like it doesn't exist. Even in this case, if the overall shape of the encapsulating resin excluding electronic components is a truncated quadrangular pyramid shape, the shape of the encapsulating resin is considered to be a truncated quadrangular pyramid shape, and the encapsulating resin has a small area. It may be assumed that the first principal surface exists as the upper surface of a truncated quadrangular pyramid.

The electronic component 10 is placed adjacent to the first main surface 321 within the sealing resin 320, and the connection between the electronic component 10 and the wiring 330 is made on the first main surface 321.
The wiring 330 includes a first lead wiring 331 and a second lead wiring (not shown) connected to the first external electrode 11 of the electronic component 10. Further, the wiring 330 includes a third lead wiring 333 and a fourth lead wiring 334 that are connected to the second external electrode 12 of the electronic component.
A first mounting electrode 341, a second mounting electrode 342, a third mounting electrode 343, and a fourth mounting electrode 344 are provided at the end of each lead wiring.

The arrangement of the lead wiring and mounting electrodes shown in FIG. 9 is the same as that of the stretchable electronic component of the second embodiment.
Furthermore, although FIG. 9 shows an example in which there are four lead-out wires, the number of lead-out wires is not limited, and may be two as in the stretchable electronic component 1 shown in FIG. good.
Further, the lead wiring may reach the second main surface through any side surface of the truncated pyramid shape.

In the stretchable electronic component of the fifth embodiment, the volume of the stretchable electronic component itself can be reduced. When the distance between the mounting electrodes included in this stretchable electronic component increases, the area of the second principal surface increases, but the area of the first principal surface does not increase so much, and the The force applied between electronic components and wiring becomes smaller.

[Sixth embodiment of stretchable electronic component]
FIG. 10 is a cross-sectional view schematically showing the stretchable electronic component of the sixth embodiment.
In the stretchable electronic component 6 shown in FIG. 10, the resin layer 451 is provided on the back side of the connection surface between the electronic component 10 and the wiring 30, that is, on the outside of the first main surface 21 of the sealing resin 20. Furthermore, it is provided outside each side of the sealing resin and outside the lead wiring.
FIG. 10 shows that the resin layer 451 is provided on the outside of the first side surface 23 and the second side surface 24, on the outside of the first lead-out wiring 31, and on the outside of the second lead-out wiring 32.

The resin layer 451 is integrated from the outside of the first main surface 21 of the sealing resin 20 to the outside of each side surface. This is achieved by forming the resin layer 451 by bending the same resin sheet.

Further, in the wiring 30, the wiring provided on the first main surface 21 of the sealing resin 20 and the wiring provided on the side surface of the sealing resin (first lead wiring 31, second lead wiring 32) have no border. formed continuously. In this case, it is preferable that all the wiring be stretchable wiring.

The stretchable electronic component of the sixth embodiment can be manufactured by the following method.
First, stretchable wiring is provided on a resin sheet that will become a resin layer. Pads for mounting electronic components are formed on the stretchable wiring.
Then, electronic components are mounted on the stretchable wiring pads.
Next, the resin sheet is bent so that the stretchable wiring and electronic components are on the inside, and the resin sheet is inserted into a mold having a predetermined shape and heat is applied to maintain the shape of the mold.
Furthermore, a resin material to be a sealing resin is added inside the shape of the mold, and the resin material is hardened.
Through such steps, the stretchable electronic component of the sixth embodiment is obtained.
Note that although the expression "cure" is used in the above process, this does not mean that the sealing resin is made hard, but rather that the shape of the elastic sealing resin is stabilized to the extent that it does not flow. It means to do as you please.

In this process, the resin layer and the wiring are formed by bending, so the wiring provided on the first main surface of the sealing resin and the wiring provided on the side surface of the sealing resin (first lead-out wiring, second lead-out wiring) (wiring) disappears. Therefore, it is possible to prevent the wiring from breaking at this boundary.
Furthermore, since the entire outer periphery of the wiring is covered with the resin layer, the wiring can be protected from the outside of the stretchable electronic component.

The stretchable electronic component according to the sixth embodiment differs from the stretchable electronic component according to the first embodiment in the formation position of the resin layer and the manner in which the wiring is formed. The other configurations are the same as those of the stretchable electronic component according to the first embodiment, so a detailed explanation thereof will be omitted.

Next, a stretchable electronic component mounting board formed by mounting the stretchable electronic component of the present invention on a board will be described.
The stretchable electronic component mounting board of the present invention is characterized by comprising a board and the stretchable electronic component of the present invention mounted on the board on its mounting surface.

[First embodiment of stretchable electronic component mounting board]
FIG. 11 is a cross-sectional view schematically showing the stretchable electronic component mounting board of the first embodiment.
FIG. 11 schematically shows a stretchable electronic component mounting board 500 in which the stretchable electronic component 1 is mounted on the mounting surface 511 of the stretchable wiring board 510, with the stretchable wiring board 510 being stretched.
The stretchable wiring board 510 is made of a stretchable resin material. Examples of the resin material include thermoplastic polyurethane.

The stretchable electronic component mounting board of the first embodiment can be used by being attached to a living body.
Although the thickness of the stretchable wiring board is not particularly limited, it is preferably 100 μm or less, more preferably 1 μm or less, from the viewpoint of not inhibiting the expansion and contraction of the surface of the living body when it is attached to the living body. Further, the thickness of the stretchable wiring board is preferably 0.1 μm or more.

Wiring is provided on the stretchable wiring board. The wiring preferably contains conductive particles and resin, and is preferably stretchable. For example, a mixture of metal powder such as Ag, Cu, or Ni as conductive particles and an elastomer resin such as silicone resin may be used.

The method of joining the stretchable wiring board and the stretchable electronic component is not particularly limited, and soldering or the like can be used.

Since the stretchable wiring board has stretchability, it can be attached to a living body and used by being stretched and contracted. When the electronic component to be mounted on the stretchable wiring board is the stretchable electronic component of the present invention, the mounting surface side of the stretchable electronic component can expand and contract, thereby preventing disconnection between the board and the electronic component. can.

[Second embodiment of stretchable electronic component mounting board]
FIG. 12 is a cross-sectional view schematically showing a stretchable electronic component mounting board according to the second embodiment.
FIG. 12 schematically shows a stretchable electronic component mounting board 600 in which the stretchable electronic component 1 is mounted on the mounting surface 611 of the flexible board 610, with the flexible board 610 bent.
The flexible substrate 610 is made of a flexible resin material. Examples of the resin material include polyimide resin, polyester resin, and the like.

The stretchable electronic component mounting board of the second embodiment can be used as a board that is bent and used in a movable part of an electronic device.
The thickness of the flexible substrate is not particularly limited, but from the viewpoint of flexibility, it is preferably 100 μm or less, more preferably 50 μm or less. Moreover, it is preferable that the thickness of the flexible substrate is 10 μm or more.

Wiring is provided on the flexible substrate. The wiring is preferably a flexible wiring, and wiring formed by etching copper foil or the like can be used.

The method of joining the flexible substrate and the stretchable electronic component is not particularly limited, and may be performed by soldering or the like.

When the electronic component mounted on the stretchable wiring board is the stretchable electronic component of the present invention, the mounting surface side of the stretchable electronic component can stretch when the flexible board is bent, so that the distance between the board and the electronic component is reduced. Disconnection can be prevented.

1, 2, 3, 4, 5, 6 stretchable electronic component 10 electronic component 11 first external electrode of electronic component 12 second external electrode of electronic component 20, 220, 320 sealing resin 21, 321 first main surface 22 , 322 Second principal surface (mounting surface)
23 First side surface 24 Second side surface 25 Third side surface 26 Fourth side surface 27a, 27b, 27c, 27d Chamfered portion 30, 130, 130a, 130b, 230, 330 Wiring 31, 131, 231, 331 First extraction wiring 32, 132, 232 Second lead wiring 41, 141, 241, 341 First mounting electrode 42, 142, 242, 342 Second mounting electrode 51, 451 Resin layer 133, 233, 333 Third lead wiring 134, 334 Fourth Output wiring 143, 243, 343 Third mounting electrode 144, 344 Fourth mounting electrode 221 Top surface 222 Bottom surface (mounting surface)
223 Side surface that is a curved surface 500, 600 Stretchable electronic component mounting board 510 Stretchable wiring board 511 Mounting surface of stretchable wiring board 610 Flexible board 611 Mounting surface of flexible board

Claims (11)

electronic parts and
a sealing resin that seals around the electronic component and includes a mounting surface;
Wiring electrically connected to the electronic component and drawn out to the mounting surface of the sealing resin,
The sealing resin has elasticity,
The connection between the electronic component and the wiring is made at a location other than the mounting surface,
The wiring has a plurality of mounting electrodes at its end on the mounting surface,
When the distance between the plurality of mounting electrodes on the mounting surface is increased by 3%, the elongation rate between the plurality of mounting electrodes on the mounting surface is such that on another plane parallel to the mounting surface, A stretchable electronic material, characterized in that the elongation rate is greater than any of the elongation rates between the plurality of opposing surfaces of the sealing resin, measured in the same direction as the direction in which the distance between the plurality of mounting electrodes is increased. parts. The sealing resin has a first main surface and a second main surface facing each other in the thickness direction, a first side surface and a second side surface facing each other in a length direction perpendicular to the thickness direction, and a first side surface and a second side surface facing each other in the length direction perpendicular to the thickness direction. It has a third side surface and a fourth side surface facing each other in the width direction perpendicular to the width direction,
The second main surface is a mounting surface,
2. The electronic component according to claim 1, wherein the electronic component is arranged adjacent to the first main surface within the sealing resin, and the electronic component and the wiring are connected on the first main surface. Stretchable electronic components. The electronic component is arranged such that its longitudinal direction is along the third side surface and the fourth side surface when the stretchable electronic component is viewed from the first main surface,
The wiring includes a first lead-out wiring that reaches the second main surface from the first main surface via the first side surface, and a second lead wire that reaches the second main surface from the first main surface via the second side surface. Equipped with pull-out wiring,
The first lead-out wiring has a first mounting electrode at its end on the second main surface,
3. The stretchable electronic component according to claim 2, wherein the second lead-out wiring has a second mounting electrode at an end thereof on the second main surface. The electronic component is arranged such that the longitudinal direction thereof is inclined from the direction of the third side surface and the direction of the fourth side surface when the stretchable electronic component is viewed from the first main surface,
The wiring branches from the first main surface into two parts, each of which passes through a side surface of the sealing resin and reaches the second main surface on the first side surface; a first lead wiring and a second lead wiring; A third lead-out wiring and a fourth lead-out wiring are provided that are branched into two from the first main surface and each reach the second main surface on the second side surface through a side surface of the sealing resin,
The first lead-out wiring has a first mounting electrode at an end adjacent to the first side surface and the third side surface,
The second lead-out wiring has a second mounting electrode at an end adjacent to the first side surface and the fourth side surface,
The third lead-out wiring has a third mounting electrode at an end adjacent to the second side surface and the third side surface,
3. The stretchable electronic component according to claim 2, wherein the fourth lead-out wiring has a fourth mounting electrode at an end adjacent to the second side surface and the fourth side surface. The sealing resin has a first main surface and a second main surface facing each other in the thickness direction, a first side surface and a second side surface facing each other in a length direction perpendicular to the thickness direction, and a first side surface and a second side surface facing each other in the length direction perpendicular to the thickness direction. It has a third side surface and a fourth side surface facing each other in the width direction perpendicular to the width direction,
The second main surface is a mounting surface,
The electronic component is disposed adjacent to the first side surface, the second side surface, the third side surface, or the fourth side surface within the sealing resin, and the connection between the electronic component and the wiring is The stretchable electronic component according to claim 1, wherein the stretchable electronic component is formed on any one of the first side, the second side, the third side, or the fourth side. The sealing resin has a bottom surface which is a mounting surface, a side surface which is a curved surface connected to the bottom surface, and an upper surface connected to the side surface,
2. The stretchable electronic component according to claim 1, wherein the electronic component is placed adjacent to the upper surface within the sealing resin, and the electronic component and the wiring are connected at the upper surface. The sealing resin has a first main surface and a second main surface facing each other in the thickness direction, and the second main surface is a bottom surface with a large area, and the first main surface is a truncated quadrangular pyramid with a top surface with a small area. The shape is
The second main surface is a mounting surface,
2. The electronic component according to claim 1, wherein the electronic component is arranged adjacent to the first main surface within the sealing resin, and the electronic component and the wiring are connected on the first main surface. Stretchable electronic components. 8. The stretchable electronic component according to claim 1, wherein a resin layer is provided on the back side of the connection surface between the electronic component and the wiring, on the surface where the electronic component is connected to the wiring. A substrate and
A stretchable electronic component mounting board, comprising the stretchable electronic component according to any one of claims 1 to 8, mounted on the board on its mounting surface. The stretchable electronic component mounting board according to claim 9, wherein the board is a stretchable wiring board. The stretchable electronic component mounting board according to claim 9, wherein the board is a flexible board.

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