JPS5543871A - Packaging of semiconductor device - Google Patents

Packaging of semiconductor device

Info

Publication number
JPS5543871A
JPS5543871A JP11694278A JP11694278A JPS5543871A JP S5543871 A JPS5543871 A JP S5543871A JP 11694278 A JP11694278 A JP 11694278A JP 11694278 A JP11694278 A JP 11694278A JP S5543871 A JPS5543871 A JP S5543871A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
devices
semiconductor
film
packaging
shaped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11694278A
Inventor
Yoichi Yamagishi
Original Assignee
Casio Comput Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE: To increase reliability and reduce the size of devices, by packaging semiconductor devices evenly by means of film-form packaging material.
CONSTITUTION: While band-shaped base film 3 fitted with many semiconductor devices 1 at fixed intervals is being transported, band-shaped film 7 is bonded to both surfaces of base film 3 in succession under heating and pressure, and thereby semiconductor devices 1 are packaged.
COPYRIGHT: (C)1980,JPO&Japio
JP11694278A 1978-09-22 1978-09-22 Packaging of semiconductor device Pending JPS5543871A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11694278A JPS5543871A (en) 1978-09-22 1978-09-22 Packaging of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11694278A JPS5543871A (en) 1978-09-22 1978-09-22 Packaging of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5543871A true true JPS5543871A (en) 1980-03-27

Family

ID=14699520

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11694278A Pending JPS5543871A (en) 1978-09-22 1978-09-22 Packaging of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5543871A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6076146A (en) * 1983-10-03 1985-04-30 Nitto Electric Ind Co Ltd Thin type semiconductor device
JPS63273341A (en) * 1987-04-30 1988-11-10 Mitsubishi Electric Corp Semiconductor device
JPS641262A (en) * 1987-06-24 1989-01-05 Hitachi Ltd Electronic device and manufacture thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5379379A (en) * 1976-12-24 1978-07-13 Hitachi Ltd Production of semiconductor and divice for the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5379379A (en) * 1976-12-24 1978-07-13 Hitachi Ltd Production of semiconductor and divice for the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6076146A (en) * 1983-10-03 1985-04-30 Nitto Electric Ind Co Ltd Thin type semiconductor device
JPS63273341A (en) * 1987-04-30 1988-11-10 Mitsubishi Electric Corp Semiconductor device
JPS641262A (en) * 1987-06-24 1989-01-05 Hitachi Ltd Electronic device and manufacture thereof

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