JPS5543871A - Packaging of semiconductor device - Google Patents

Packaging of semiconductor device

Info

Publication number
JPS5543871A
JPS5543871A JP11694278A JP11694278A JPS5543871A JP S5543871 A JPS5543871 A JP S5543871A JP 11694278 A JP11694278 A JP 11694278A JP 11694278 A JP11694278 A JP 11694278A JP S5543871 A JPS5543871 A JP S5543871A
Authority
JP
Japan
Prior art keywords
semiconductor devices
packaging
film
band
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11694278A
Other languages
Japanese (ja)
Inventor
Yoichi Yamagishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Casio Computer Co Ltd
Original Assignee
Casio Computer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Casio Computer Co Ltd filed Critical Casio Computer Co Ltd
Priority to JP11694278A priority Critical patent/JPS5543871A/en
Publication of JPS5543871A publication Critical patent/JPS5543871A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To increase reliability and reduce the size of devices, by packaging semiconductor devices evenly by means of film-form packaging material.
CONSTITUTION: While band-shaped base film 3 fitted with many semiconductor devices 1 at fixed intervals is being transported, band-shaped film 7 is bonded to both surfaces of base film 3 in succession under heating and pressure, and thereby semiconductor devices 1 are packaged.
COPYRIGHT: (C)1980,JPO&Japio
JP11694278A 1978-09-22 1978-09-22 Packaging of semiconductor device Pending JPS5543871A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11694278A JPS5543871A (en) 1978-09-22 1978-09-22 Packaging of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11694278A JPS5543871A (en) 1978-09-22 1978-09-22 Packaging of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5543871A true JPS5543871A (en) 1980-03-27

Family

ID=14699520

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11694278A Pending JPS5543871A (en) 1978-09-22 1978-09-22 Packaging of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5543871A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6076146A (en) * 1983-10-03 1985-04-30 Nitto Electric Ind Co Ltd Thin type semiconductor device
JPS63273341A (en) * 1987-04-30 1988-11-10 Mitsubishi Electric Corp Semiconductor device
JPS641262A (en) * 1987-06-24 1989-01-05 Hitachi Ltd Electronic device and manufacture thereof
JPH0685114A (en) * 1992-09-01 1994-03-25 Toshiba Corp Resin seal semiconductor device and manufacture thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5379379A (en) * 1976-12-24 1978-07-13 Hitachi Ltd Production of semiconductor and divice for the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5379379A (en) * 1976-12-24 1978-07-13 Hitachi Ltd Production of semiconductor and divice for the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6076146A (en) * 1983-10-03 1985-04-30 Nitto Electric Ind Co Ltd Thin type semiconductor device
JPS63273341A (en) * 1987-04-30 1988-11-10 Mitsubishi Electric Corp Semiconductor device
JPS641262A (en) * 1987-06-24 1989-01-05 Hitachi Ltd Electronic device and manufacture thereof
JPH0685114A (en) * 1992-09-01 1994-03-25 Toshiba Corp Resin seal semiconductor device and manufacture thereof

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