JPS5516439A - Resin seal semiconductor device - Google Patents

Resin seal semiconductor device

Info

Publication number
JPS5516439A
JPS5516439A JP8943478A JP8943478A JPS5516439A JP S5516439 A JPS5516439 A JP S5516439A JP 8943478 A JP8943478 A JP 8943478A JP 8943478 A JP8943478 A JP 8943478A JP S5516439 A JPS5516439 A JP S5516439A
Authority
JP
Japan
Prior art keywords
resin seal
lead piece
semiconductor device
seal material
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8943478A
Other languages
Japanese (ja)
Inventor
Takehisa Hamano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8943478A priority Critical patent/JPS5516439A/en
Publication of JPS5516439A publication Critical patent/JPS5516439A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To increase reliability of the device by covering with glass a part of lead piece placed in a resin seal part to strengthen adhesion between the lead piece and the resin seal material.
CONSTITUTION: On part of a lead piece 12 placed in a resin seal material 4 is set glass material 5. The adhesive strength between the glass material 5 and the lead piece 12 is greater than that between the resin seal material 4 and the lead piece 12, and the glass material 5 is given a thermal contraction in the same direction as the longitudinal direction of the lead piece 12 of the resin seal material 4 so that the adhesion between the glass material 5 and the resin seal material 4 becomes tighter.
COPYRIGHT: (C)1980,JPO&Japio
JP8943478A 1978-07-24 1978-07-24 Resin seal semiconductor device Pending JPS5516439A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8943478A JPS5516439A (en) 1978-07-24 1978-07-24 Resin seal semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8943478A JPS5516439A (en) 1978-07-24 1978-07-24 Resin seal semiconductor device

Publications (1)

Publication Number Publication Date
JPS5516439A true JPS5516439A (en) 1980-02-05

Family

ID=13970555

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8943478A Pending JPS5516439A (en) 1978-07-24 1978-07-24 Resin seal semiconductor device

Country Status (1)

Country Link
JP (1) JPS5516439A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5025514A (en) * 1973-07-07 1975-03-18
JPS5036668A (en) * 1973-08-06 1975-04-05
JPS6436059A (en) * 1987-07-31 1989-02-07 Kyushu Nippon Electric Lead frame of semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5025514A (en) * 1973-07-07 1975-03-18
JPS5036668A (en) * 1973-08-06 1975-04-05
JPS5747680B2 (en) * 1973-08-06 1982-10-12
JPS6436059A (en) * 1987-07-31 1989-02-07 Kyushu Nippon Electric Lead frame of semiconductor device

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