JPS5258371A - Production of resin sealed type electronic part - Google Patents

Production of resin sealed type electronic part

Info

Publication number
JPS5258371A
JPS5258371A JP13403875A JP13403875A JPS5258371A JP S5258371 A JPS5258371 A JP S5258371A JP 13403875 A JP13403875 A JP 13403875A JP 13403875 A JP13403875 A JP 13403875A JP S5258371 A JPS5258371 A JP S5258371A
Authority
JP
Japan
Prior art keywords
production
type electronic
electronic part
sealed type
resin sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13403875A
Other languages
Japanese (ja)
Other versions
JPS5938736B2 (en
Inventor
Kunihiro Tsubosaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13403875A priority Critical patent/JPS5938736B2/en
Publication of JPS5258371A publication Critical patent/JPS5258371A/en
Publication of JPS5938736B2 publication Critical patent/JPS5938736B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To improve moisture resistance by increasing the adhesivness between leads having silver on the surface and a sealing resin and making the interface airtight.
COPYRIGHT: (C)1977,JPO&Japio
JP13403875A 1975-11-10 1975-11-10 Resin-sealed electronic components Expired JPS5938736B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13403875A JPS5938736B2 (en) 1975-11-10 1975-11-10 Resin-sealed electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13403875A JPS5938736B2 (en) 1975-11-10 1975-11-10 Resin-sealed electronic components

Publications (2)

Publication Number Publication Date
JPS5258371A true JPS5258371A (en) 1977-05-13
JPS5938736B2 JPS5938736B2 (en) 1984-09-19

Family

ID=15118906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13403875A Expired JPS5938736B2 (en) 1975-11-10 1975-11-10 Resin-sealed electronic components

Country Status (1)

Country Link
JP (1) JPS5938736B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04130451U (en) * 1991-05-20 1992-11-30 富士通株式会社 Connection terminal for electronic devices

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0445467Y2 (en) * 1985-08-10 1992-10-26

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04130451U (en) * 1991-05-20 1992-11-30 富士通株式会社 Connection terminal for electronic devices

Also Published As

Publication number Publication date
JPS5938736B2 (en) 1984-09-19

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