JPS51113465A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS51113465A
JPS51113465A JP3697075A JP3697075A JPS51113465A JP S51113465 A JPS51113465 A JP S51113465A JP 3697075 A JP3697075 A JP 3697075A JP 3697075 A JP3697075 A JP 3697075A JP S51113465 A JPS51113465 A JP S51113465A
Authority
JP
Japan
Prior art keywords
lead frame
assimilates
simplifying
intention
manufacturing process
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3697075A
Other languages
Japanese (ja)
Inventor
Toshiro Iba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3697075A priority Critical patent/JPS51113465A/en
Publication of JPS51113465A publication Critical patent/JPS51113465A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Abstract

PURPOSE: Lead frame formation by synthetic resin resembles or assimilates sealing material properties to improve dampproofing, with the intention of simplifying the manufacturing process and reducing cost.
COPYRIGHT: (C)1976,JPO&Japio
JP3697075A 1975-03-28 1975-03-28 Lead frame Pending JPS51113465A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3697075A JPS51113465A (en) 1975-03-28 1975-03-28 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3697075A JPS51113465A (en) 1975-03-28 1975-03-28 Lead frame

Publications (1)

Publication Number Publication Date
JPS51113465A true JPS51113465A (en) 1976-10-06

Family

ID=12484586

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3697075A Pending JPS51113465A (en) 1975-03-28 1975-03-28 Lead frame

Country Status (1)

Country Link
JP (1) JPS51113465A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57195843U (en) * 1981-06-04 1982-12-11

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4971872A (en) * 1972-11-10 1974-07-11

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4971872A (en) * 1972-11-10 1974-07-11

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57195843U (en) * 1981-06-04 1982-12-11

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