JPS51142274A - Electrode lead for semiconductor device - Google Patents

Electrode lead for semiconductor device

Info

Publication number
JPS51142274A
JPS51142274A JP6686275A JP6686275A JPS51142274A JP S51142274 A JPS51142274 A JP S51142274A JP 6686275 A JP6686275 A JP 6686275A JP 6686275 A JP6686275 A JP 6686275A JP S51142274 A JPS51142274 A JP S51142274A
Authority
JP
Japan
Prior art keywords
semiconductor device
electrode lead
manufacture
glass
easy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6686275A
Other languages
Japanese (ja)
Other versions
JPS5433111B2 (en
Inventor
Toshiyuki Hidaka
Tatsuo Shimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6686275A priority Critical patent/JPS51142274A/en
Publication of JPS51142274A publication Critical patent/JPS51142274A/en
Publication of JPS5433111B2 publication Critical patent/JPS5433111B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: An electrode lead for a semiconductor device such as a glass-molded type semiconductor device or the like, which does not produce whiskers, has an excellent soldering property, and is easy to manufacture.
COPYRIGHT: (C)1976,JPO&Japio
JP6686275A 1975-06-02 1975-06-02 Electrode lead for semiconductor device Granted JPS51142274A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6686275A JPS51142274A (en) 1975-06-02 1975-06-02 Electrode lead for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6686275A JPS51142274A (en) 1975-06-02 1975-06-02 Electrode lead for semiconductor device

Publications (2)

Publication Number Publication Date
JPS51142274A true JPS51142274A (en) 1976-12-07
JPS5433111B2 JPS5433111B2 (en) 1979-10-18

Family

ID=13328078

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6686275A Granted JPS51142274A (en) 1975-06-02 1975-06-02 Electrode lead for semiconductor device

Country Status (1)

Country Link
JP (1) JPS51142274A (en)

Also Published As

Publication number Publication date
JPS5433111B2 (en) 1979-10-18

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