JPS54576A - Electronic parts - Google Patents

Electronic parts

Info

Publication number
JPS54576A
JPS54576A JP6483177A JP6483177A JPS54576A JP S54576 A JPS54576 A JP S54576A JP 6483177 A JP6483177 A JP 6483177A JP 6483177 A JP6483177 A JP 6483177A JP S54576 A JPS54576 A JP S54576A
Authority
JP
Japan
Prior art keywords
electronic parts
resing
opposition
conductors
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6483177A
Other languages
Japanese (ja)
Inventor
Hisashi Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6483177A priority Critical patent/JPS54576A/en
Publication of JPS54576A publication Critical patent/JPS54576A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To produce a resing sealing body of high reliability by providing a wall higher than element surface in opposition to one side wall face of an element integrally with the conductors to which the element pellet is bonded.
COPYRIGHT: (C)1979,JPO&Japio
JP6483177A 1977-06-03 1977-06-03 Electronic parts Pending JPS54576A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6483177A JPS54576A (en) 1977-06-03 1977-06-03 Electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6483177A JPS54576A (en) 1977-06-03 1977-06-03 Electronic parts

Publications (1)

Publication Number Publication Date
JPS54576A true JPS54576A (en) 1979-01-05

Family

ID=13269576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6483177A Pending JPS54576A (en) 1977-06-03 1977-06-03 Electronic parts

Country Status (1)

Country Link
JP (1) JPS54576A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57125541U (en) * 1981-01-30 1982-08-05
JPS61106037U (en) * 1984-12-17 1986-07-05
US4695171A (en) * 1985-12-04 1987-09-22 General Instrument Corp. Horizontally or vertically orientable compact ticket processor
JPH01254446A (en) * 1987-12-11 1989-10-11 Atsushi Kitamura Shock absorbing bag and manufacture thereof
US5360233A (en) * 1990-05-30 1994-11-01 Takata Corporation Air bag in an air bag unit
US5432117A (en) * 1993-06-11 1995-07-11 Rohm Co., Ltd. Method of producing semiconductor device
JP2015043380A (en) * 2013-08-26 2015-03-05 富士電機株式会社 Semiconductor device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57125541U (en) * 1981-01-30 1982-08-05
JPS61106037U (en) * 1984-12-17 1986-07-05
US4695171A (en) * 1985-12-04 1987-09-22 General Instrument Corp. Horizontally or vertically orientable compact ticket processor
JPH01254446A (en) * 1987-12-11 1989-10-11 Atsushi Kitamura Shock absorbing bag and manufacture thereof
US5707711A (en) * 1987-12-11 1998-01-13 Asahi Kasei Kogyo Kabushiki Kaisha Impact absorbing air bag and method for manufacturing same
US5360233A (en) * 1990-05-30 1994-11-01 Takata Corporation Air bag in an air bag unit
US5432117A (en) * 1993-06-11 1995-07-11 Rohm Co., Ltd. Method of producing semiconductor device
JP2015043380A (en) * 2013-08-26 2015-03-05 富士電機株式会社 Semiconductor device

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