JPS54576A - Electronic parts - Google Patents

Electronic parts

Info

Publication number
JPS54576A
JPS54576A JP6483177A JP6483177A JPS54576A JP S54576 A JPS54576 A JP S54576A JP 6483177 A JP6483177 A JP 6483177A JP 6483177 A JP6483177 A JP 6483177A JP S54576 A JPS54576 A JP S54576A
Authority
JP
Japan
Prior art keywords
electronic parts
resing
opposition
conductors
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6483177A
Other languages
Japanese (ja)
Inventor
Hisashi Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6483177A priority Critical patent/JPS54576A/en
Publication of JPS54576A publication Critical patent/JPS54576A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To produce a resing sealing body of high reliability by providing a wall higher than element surface in opposition to one side wall face of an element integrally with the conductors to which the element pellet is bonded.
COPYRIGHT: (C)1979,JPO&Japio
JP6483177A 1977-06-03 1977-06-03 Electronic parts Pending JPS54576A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6483177A JPS54576A (en) 1977-06-03 1977-06-03 Electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6483177A JPS54576A (en) 1977-06-03 1977-06-03 Electronic parts

Publications (1)

Publication Number Publication Date
JPS54576A true JPS54576A (en) 1979-01-05

Family

ID=13269576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6483177A Pending JPS54576A (en) 1977-06-03 1977-06-03 Electronic parts

Country Status (1)

Country Link
JP (1) JPS54576A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57125541U (en) * 1981-01-30 1982-08-05
JPS61106037U (en) * 1984-12-17 1986-07-05
US4695171A (en) * 1985-12-04 1987-09-22 General Instrument Corp. Horizontally or vertically orientable compact ticket processor
JPH01254446A (en) * 1987-12-11 1989-10-11 Atsushi Kitamura Shock absorbing bag and manufacture thereof
US5360233A (en) * 1990-05-30 1994-11-01 Takata Corporation Air bag in an air bag unit
US5432117A (en) * 1993-06-11 1995-07-11 Rohm Co., Ltd. Method of producing semiconductor device
JP2015043380A (en) * 2013-08-26 2015-03-05 富士電機株式会社 Semiconductor device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57125541U (en) * 1981-01-30 1982-08-05
JPS61106037U (en) * 1984-12-17 1986-07-05
US4695171A (en) * 1985-12-04 1987-09-22 General Instrument Corp. Horizontally or vertically orientable compact ticket processor
JPH01254446A (en) * 1987-12-11 1989-10-11 Atsushi Kitamura Shock absorbing bag and manufacture thereof
US5707711A (en) * 1987-12-11 1998-01-13 Asahi Kasei Kogyo Kabushiki Kaisha Impact absorbing air bag and method for manufacturing same
US5360233A (en) * 1990-05-30 1994-11-01 Takata Corporation Air bag in an air bag unit
US5432117A (en) * 1993-06-11 1995-07-11 Rohm Co., Ltd. Method of producing semiconductor device
JP2015043380A (en) * 2013-08-26 2015-03-05 富士電機株式会社 Semiconductor device

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