JPS5375762A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5375762A
JPS5375762A JP15132276A JP15132276A JPS5375762A JP S5375762 A JPS5375762 A JP S5375762A JP 15132276 A JP15132276 A JP 15132276A JP 15132276 A JP15132276 A JP 15132276A JP S5375762 A JPS5375762 A JP S5375762A
Authority
JP
Japan
Prior art keywords
semiconductor device
peeling
providing
lead wire
high reliability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15132276A
Other languages
Japanese (ja)
Other versions
JPS586307B2 (en
Inventor
Yoshiyuki Uchida
Takashi Onuma
Ken Meguro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP51151322A priority Critical patent/JPS586307B2/en
Publication of JPS5375762A publication Critical patent/JPS5375762A/en
Publication of JPS586307B2 publication Critical patent/JPS586307B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view
    • H01L2224/05558—Shape in side view conformal layer on a patterned surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Abstract

PURPOSE: To obtain the device having high reliability, by providing the lead wire so that peeling off is not taken place from the metallic film to the power cycle of a long duration.
COPYRIGHT: (C)1978,JPO&Japio
JP51151322A 1976-12-16 1976-12-16 semiconductor equipment Expired JPS586307B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51151322A JPS586307B2 (en) 1976-12-16 1976-12-16 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51151322A JPS586307B2 (en) 1976-12-16 1976-12-16 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS5375762A true JPS5375762A (en) 1978-07-05
JPS586307B2 JPS586307B2 (en) 1983-02-03

Family

ID=15516082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51151322A Expired JPS586307B2 (en) 1976-12-16 1976-12-16 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS586307B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS589369A (en) * 1981-07-08 1983-01-19 Matsushita Electronics Corp Transistor
JPS5818964A (en) * 1981-07-28 1983-02-03 Fujitsu Ltd Semiconductor device
JPS58199563A (en) * 1982-05-17 1983-11-19 Sanyo Electric Co Ltd Transistor with damper diode
JPS6399568A (en) * 1977-10-25 1988-04-30 ゼネラル・エレクトリック・カンパニイ Semiconductor device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6399568A (en) * 1977-10-25 1988-04-30 ゼネラル・エレクトリック・カンパニイ Semiconductor device
JPH0345536B2 (en) * 1977-10-25 1991-07-11 Gen Electric
JPS589369A (en) * 1981-07-08 1983-01-19 Matsushita Electronics Corp Transistor
JPS5818964A (en) * 1981-07-28 1983-02-03 Fujitsu Ltd Semiconductor device
JPH0156531B2 (en) * 1981-07-28 1989-11-30 Fujitsu Ltd
JPS58199563A (en) * 1982-05-17 1983-11-19 Sanyo Electric Co Ltd Transistor with damper diode
JPH0228895B2 (en) * 1982-05-17 1990-06-27 Sanyo Electric Co

Also Published As

Publication number Publication date
JPS586307B2 (en) 1983-02-03

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