JPS53103385A - Integrated circuit for watches - Google Patents
Integrated circuit for watchesInfo
- Publication number
- JPS53103385A JPS53103385A JP1842277A JP1842277A JPS53103385A JP S53103385 A JPS53103385 A JP S53103385A JP 1842277 A JP1842277 A JP 1842277A JP 1842277 A JP1842277 A JP 1842277A JP S53103385 A JPS53103385 A JP S53103385A
- Authority
- JP
- Japan
- Prior art keywords
- watches
- integrated circuit
- covering
- prevent
- conductive material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Clocks (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE: To prevent the adverse influence of electromagnetic wave noises by covering the surface of an IC with a conductive material such as Al5, etc.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1842277A JPS53103385A (en) | 1977-02-22 | 1977-02-22 | Integrated circuit for watches |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1842277A JPS53103385A (en) | 1977-02-22 | 1977-02-22 | Integrated circuit for watches |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53103385A true JPS53103385A (en) | 1978-09-08 |
Family
ID=11971204
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1842277A Pending JPS53103385A (en) | 1977-02-22 | 1977-02-22 | Integrated circuit for watches |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53103385A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5627962A (en) * | 1979-08-15 | 1981-03-18 | Matsushita Electric Ind Co Ltd | Integrated circuit device |
JPS5645070A (en) * | 1979-09-21 | 1981-04-24 | Hitachi Ltd | Semiconductor integrated circuit device |
JPS5670647A (en) * | 1979-11-14 | 1981-06-12 | Matsushita Electronics Corp | Semiconductor device |
JPS5736859A (en) * | 1980-08-18 | 1982-02-27 | Pioneer Electronic Corp | Integrated circuit device |
US5700715A (en) * | 1994-06-14 | 1997-12-23 | Lsi Logic Corporation | Process for mounting a semiconductor device to a circuit substrate |
US5840599A (en) * | 1989-06-30 | 1998-11-24 | Texas Instruments Incorporated | Process of packaging an integrated circuit with a conductive material between a lead frame and the face of the circuit |
JP2003068974A (en) * | 2001-08-28 | 2003-03-07 | Fujitsu Ltd | Semiconductor device |
-
1977
- 1977-02-22 JP JP1842277A patent/JPS53103385A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5627962A (en) * | 1979-08-15 | 1981-03-18 | Matsushita Electric Ind Co Ltd | Integrated circuit device |
JPS5645070A (en) * | 1979-09-21 | 1981-04-24 | Hitachi Ltd | Semiconductor integrated circuit device |
JPS5670647A (en) * | 1979-11-14 | 1981-06-12 | Matsushita Electronics Corp | Semiconductor device |
JPS5736859A (en) * | 1980-08-18 | 1982-02-27 | Pioneer Electronic Corp | Integrated circuit device |
US5840599A (en) * | 1989-06-30 | 1998-11-24 | Texas Instruments Incorporated | Process of packaging an integrated circuit with a conductive material between a lead frame and the face of the circuit |
US5700715A (en) * | 1994-06-14 | 1997-12-23 | Lsi Logic Corporation | Process for mounting a semiconductor device to a circuit substrate |
JP2003068974A (en) * | 2001-08-28 | 2003-03-07 | Fujitsu Ltd | Semiconductor device |
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