JPS5645070A - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
JPS5645070A
JPS5645070A JP12063579A JP12063579A JPS5645070A JP S5645070 A JPS5645070 A JP S5645070A JP 12063579 A JP12063579 A JP 12063579A JP 12063579 A JP12063579 A JP 12063579A JP S5645070 A JPS5645070 A JP S5645070A
Authority
JP
Japan
Prior art keywords
shield layer
region
function region
wiring layers
regions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12063579A
Other languages
Japanese (ja)
Inventor
Toru Inaba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12063579A priority Critical patent/JPS5645070A/en
Publication of JPS5645070A publication Critical patent/JPS5645070A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To obtain a crosstalk free IC without deteriorating integration by providing a shield layer on wiring layers by corresponding to a function region wherein the shield layer is grounded. CONSTITUTION:A region 13 consisting of a function region Trs1 for low frequency operation and a region 14 consisting of a function region Trs2 for high frequency operation are formed respectively on a semiconductor substrate 1 to compose a semiconductor integrated circuit. Next, the first SiO2 film 2 for surface stabilization is formed on one major surface 11 providing the above regions and opening holes are bored by corresponding to the regions 13 and 14. Plural wiring layers 3 contacting with the regions 13 and 14 are formed while expanding the wiring layers 3 on the films 2 in accordance with a predetermined pattern. Then, the whole surface is covered with the second SiO2 film 4 which becomes a layer insulating film and an IC is completed. At that time, a shield layer 5 consisting of a conductive material is provided by positioning the shield layer 5 on the film 4 corresponding to the function region Trs1 and the shield layer 5 is grounded. In this composition, the capacity coupling of the function region Trs2 having no shield layer 5 becomes small and crosstalk as a whole will be minimized.
JP12063579A 1979-09-21 1979-09-21 Semiconductor integrated circuit device Pending JPS5645070A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12063579A JPS5645070A (en) 1979-09-21 1979-09-21 Semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12063579A JPS5645070A (en) 1979-09-21 1979-09-21 Semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
JPS5645070A true JPS5645070A (en) 1981-04-24

Family

ID=14791092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12063579A Pending JPS5645070A (en) 1979-09-21 1979-09-21 Semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS5645070A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62203351A (en) * 1986-03-03 1987-09-08 Nippon Telegr & Teleph Corp <Ntt> Interconnection structure of integrated circuit
US4796084A (en) * 1985-05-13 1989-01-03 Kabushiki Kaisha Toshiba Semiconductor device having high resistance to electrostatic and electromagnetic induction using a complementary shield pattern
US7157794B2 (en) * 2002-04-03 2007-01-02 Oki Electric Industry Co., Ltd. Semiconductor device that suppresses variations in high frequency characteristics of circuit elements

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50102280A (en) * 1974-01-09 1975-08-13
JPS53103385A (en) * 1977-02-22 1978-09-08 Seiko Instr & Electronics Ltd Integrated circuit for watches

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50102280A (en) * 1974-01-09 1975-08-13
JPS53103385A (en) * 1977-02-22 1978-09-08 Seiko Instr & Electronics Ltd Integrated circuit for watches

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4796084A (en) * 1985-05-13 1989-01-03 Kabushiki Kaisha Toshiba Semiconductor device having high resistance to electrostatic and electromagnetic induction using a complementary shield pattern
JPS62203351A (en) * 1986-03-03 1987-09-08 Nippon Telegr & Teleph Corp <Ntt> Interconnection structure of integrated circuit
US7157794B2 (en) * 2002-04-03 2007-01-02 Oki Electric Industry Co., Ltd. Semiconductor device that suppresses variations in high frequency characteristics of circuit elements
US7545036B2 (en) 2002-04-03 2009-06-09 Oki Semiconductor Co., Ltd. Semiconductor device that suppresses variations in high frequency characteristics of circuit elements

Similar Documents

Publication Publication Date Title
GB1194159A (en) Improvements relating to Integrated Circuits.
JPS5334484A (en) Forming method for multi layer wiring
GB1513116A (en) Formation of integrated circuits
JPS5645070A (en) Semiconductor integrated circuit device
JPS5643749A (en) Semiconductor device and its manufacture
JPS55121669A (en) Method of forming inactive layer on integrated circuit device having substrate of semiconductor material
JPS5650535A (en) Manufacture of semiconductor device
JPS5693359A (en) Semiconductor integrated circuit and manufacture
JPS5333590A (en) Production of substrate for semiconductor integrated circuit
JPS5636153A (en) Semiconductor integrated circuit
JPS5294782A (en) Insulation gate type ic
JPS5721849A (en) Semiconductor integrated circuit
JPS56115558A (en) Semiconductor integrated circuit and manufacture thereof
JPS5662353A (en) Semiconductor device and its manufacturing method
JPS57164571A (en) Semiconductro integrated circuit device
JPS5466089A (en) Semiconductor capacitor device
JPS577948A (en) Semiconductor device and its manufacture
JPS5320875A (en) Semiconductor integrated circuit device
JPS5649541A (en) Multilayer wiring structure for integrated circuit
JPS5552252A (en) Semiconductor integrated circuit device and manufacturing of them
JPS5656662A (en) Semiconductor integrated circuit device
JPS6425481A (en) Manufacture of semiconductor device
JPS5791537A (en) Manufacture of semiconductor device
JPS5459078A (en) Manufacture of semiconductor device
JPS5687346A (en) Manufacture of semiconductor device