JPS5277669A - Plastic ic case - Google Patents
Plastic ic caseInfo
- Publication number
- JPS5277669A JPS5277669A JP15423675A JP15423675A JPS5277669A JP S5277669 A JPS5277669 A JP S5277669A JP 15423675 A JP15423675 A JP 15423675A JP 15423675 A JP15423675 A JP 15423675A JP S5277669 A JPS5277669 A JP S5277669A
- Authority
- JP
- Japan
- Prior art keywords
- case
- plastic
- chip
- plastic case
- supersonic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Packaging Frangible Articles (AREA)
Abstract
PURPOSE: To gain the suitable case for the restricted space digital electronic clock having many terminals by supersonic or high frequency welding the plastic case, which has the window for taking into the IC chip, and the plastic case, which has the bottom for containing the IC chip, with interposing the lead board.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15423675A JPS5277669A (en) | 1975-12-24 | 1975-12-24 | Plastic ic case |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15423675A JPS5277669A (en) | 1975-12-24 | 1975-12-24 | Plastic ic case |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5277669A true JPS5277669A (en) | 1977-06-30 |
Family
ID=15579809
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15423675A Pending JPS5277669A (en) | 1975-12-24 | 1975-12-24 | Plastic ic case |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5277669A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55102258A (en) * | 1979-01-30 | 1980-08-05 | Hitachi Chem Co Ltd | Method of forming package for semiconductor and the like |
JPS57196548A (en) * | 1981-05-28 | 1982-12-02 | Toshiba Corp | Plastic chip carrier |
JPS63278353A (en) * | 1987-05-11 | 1988-11-16 | Sony Corp | Sealing method for package |
JPH01231415A (en) * | 1988-03-11 | 1989-09-14 | Matsushita Electric Ind Co Ltd | Surface acoustic wave device |
-
1975
- 1975-12-24 JP JP15423675A patent/JPS5277669A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55102258A (en) * | 1979-01-30 | 1980-08-05 | Hitachi Chem Co Ltd | Method of forming package for semiconductor and the like |
JPS57196548A (en) * | 1981-05-28 | 1982-12-02 | Toshiba Corp | Plastic chip carrier |
JPS63278353A (en) * | 1987-05-11 | 1988-11-16 | Sony Corp | Sealing method for package |
JPH01231415A (en) * | 1988-03-11 | 1989-09-14 | Matsushita Electric Ind Co Ltd | Surface acoustic wave device |
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