JPS52156561A - Resin molded semiconductor device and its production - Google Patents

Resin molded semiconductor device and its production

Info

Publication number
JPS52156561A
JPS52156561A JP7319276A JP7319276A JPS52156561A JP S52156561 A JPS52156561 A JP S52156561A JP 7319276 A JP7319276 A JP 7319276A JP 7319276 A JP7319276 A JP 7319276A JP S52156561 A JPS52156561 A JP S52156561A
Authority
JP
Japan
Prior art keywords
semiconductor device
resin molded
production
molded semiconductor
interposing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7319276A
Other languages
Japanese (ja)
Inventor
Akira Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7319276A priority Critical patent/JPS52156561A/en
Publication of JPS52156561A publication Critical patent/JPS52156561A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To improve the moisture resistance of a resin molded semiconductor device by a tape carrier system by interposing cavities between the main surface of a semiconductor chip and a sealing resin body.
COPYRIGHT: (C)1977,JPO&Japio
JP7319276A 1976-06-23 1976-06-23 Resin molded semiconductor device and its production Pending JPS52156561A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7319276A JPS52156561A (en) 1976-06-23 1976-06-23 Resin molded semiconductor device and its production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7319276A JPS52156561A (en) 1976-06-23 1976-06-23 Resin molded semiconductor device and its production

Publications (1)

Publication Number Publication Date
JPS52156561A true JPS52156561A (en) 1977-12-27

Family

ID=13511018

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7319276A Pending JPS52156561A (en) 1976-06-23 1976-06-23 Resin molded semiconductor device and its production

Country Status (1)

Country Link
JP (1) JPS52156561A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0479341A (en) * 1990-07-23 1992-03-12 Nippon Telegr & Teleph Corp <Ntt> Flexible wiring board
JPH05121492A (en) * 1991-10-25 1993-05-18 Nec Corp Tab tape

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0479341A (en) * 1990-07-23 1992-03-12 Nippon Telegr & Teleph Corp <Ntt> Flexible wiring board
JPH05121492A (en) * 1991-10-25 1993-05-18 Nec Corp Tab tape

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